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At least 73 records · Page 4

Convolutional Neural Networks for the CHIPS Neutrino Detector R&D Project.

The CHerenkov detectors In mine PitS (Chips) neutrino detector R&D project aims to develop novel strategies and technologies for very large yet ‘cheap as chips’ water Cherenkov neutrino detectors. Via deployment in a body of water, use of commercially available components, and instrumentation coverage optimisation for the study of exclusively accelerator beam neutrinos, Chips will enable megaton scale detectors to become a reality at the cost of $200k-$300k per kt of sensitive mass. During the summer of 2019 a prototype Chips detector, Chips-5, was deployed into the Wentworth 2W disused mine pit in northern Minnesota, 7 mrad off the NuMI beam axis. A novel data acquisition system was introduced using cheap single-board computers and open-source software. This work presents a novel approach to water Cherenkov neutrino detector event reconstruction and classification. Three forms of a Convolutional Neural Network, a type of deep learning algorithm, have been trained to reject cosmic muon events, classify beam events, and estimate neutrino energies, all using only the raw detector event as input. When evaluated on the expected distribution of Chips-5 events, this new approach is shown to be robust and explainable as well as providing a significant performance increase over the standard likelihood-based reconstruction and simple neural network classification. Promisingly, the performance presented here is comparable to the more complex (and expensive) neutrino oscillation experiments within the field.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Multi-chip photonics transceiver

A photonics transceiver is described herein, wherein the photonics transceiver exhibits improved areal bandwidth density and improved energy per bit consumption relative to conventional photonics transceivers. The photonics transceiver achieves an areal bandwidth density of at least 5 Tbps/mm2 with an energy consumption of less than 500 fJ/bit (sum of energy consumed for both a transmitted bit and a received bit). The photonics transceiver is a multi-chip module, where chips in the multi-chip module are tightly integrated with one another. The multi-chip module includes light source, photodetector, photonics, and control/logic chips. The photonics chip includes transparent conducting oxide integrated optical modulators and multiplexers and demultiplexers based on MEMS-tunable optical ring resonators.

Wood, Michael↗

An optimized ChIP-Seq framework for profiling histone modifications in Chromochloris zofingiensis

The eukaryotic green alga Chromochloris zofingiensis is a reference organism for studying carbon partitioning and a promising candidate for the production of biofuel precursors. Recent transcriptome profiling transformed our understanding of its biology and generally algal biology, but epigenetic regulation remains understudied and represents a fundamental gap in our understanding of algal gene expression. Chromatin immunoprecipitation followed by deep sequencing (ChIP-Seq) is a powerful tool for the discovery of such mechanisms, by identifying genome-wide histone modification patterns and transcription factor-binding sites alike. Here, we established a ChIP-Seq framework for Chr. zofingiensis yielding over 20 million high-quality reads per sample. The most critical steps in a ChIP experiment were optimized, including DNA shearing to obtain an average DNA fragment size of 250 bp and assessment of the recommended formaldehyde concentration for optimal DNA-protein cross-linking. We used this ChIP-Seq framework to generate a genome-wide map of the H3K4me3 distribution pattern and to integrate these data with matching RNA-Seq data. In line with observations from other organisms, H3K4me3 marks predominantly transcription start sites of genes. Our H3K4me3 ChIP-Seq data will pave the way for improved genome structural annotation in the emerging reference alga Chr. zofingiensis.

59 BASIC BIOLOGICAL SCIENCES↗

Test results and prospects for RD53A, a large scale 65 nm CMOS chip for pixel readout at the HL-LHC

The CERN RD53 collaboration was founded to tackle the extraordinary challenges associated with the design of pixel readout chips for the innermost layers of particle trackers at future high energy physics experiments. Around 20 institutions are involved in the collaboration, which has the support of both ATLAS and CMS experiments. The goals of the collaboration include the comprehensive understanding of radiation effects in the 65 nm technology, the development of tools and methodology to efficiently design large complex mixed signal chips and, ultimately, the development of a full size readout chip featuring a 400 × 400 pixel array with 50μm pitch. In August 2017, the collaboration submitted the large scale chip RD53A, integrating a matrix of 400 × 192 pixels and embodying three different analog front-end designs. Here, this work discusses the characteristic of the RD53A chip, with some emphasis on the analog processors, and presents the first test results on the pixel array.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

System-on-Chip approach microwave diagnostics development for burning plasma

System-on-chip (SoC) millimeter wave integrated circuit technology has been developed and employed in chip heterodyne radiometers in Electron Cyclotron Emission Imaging (ECEI) and Microwave Imaging Reflectometer (MIR) on the DIII-D tokamak for 2D electron temperature and density fluctuation diagnostics. The W-band (75-110 GHz) ECEI system has been employed with 20 poloidal horn receiver modules with customized monolithic integrated circuit chips and internal local oscillator coupling path. The new SoC approach demonstrates > 30 dB additional gain on the receiver and 95% electronics noise suppression compared to the previous Schottky diode mixer array . An F-band (110-140 GHz) receiver chip has been developed to measure MHD and turbulence behavior on the DIII-D high-field side, such as Alfven eigenmodes. Furthermore, it can image pedestal structure evolution on fusion facilities with stronger magnetic fields, such as ASDEX-U, EAST, HL-2M, and LHD. The F-band chip performance has been tested in the laboratory. Also, V-band (55-75 GHz) transmitter and receiver modules (55-75 GHz) have been developed for DIII-D and NSTX-U Furthermore, microwave Imaging Reflectometer (MIR) application suitability for 2D density fluctuation imaging on the pedestal region.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Changes in feedstock quality in willow chip piles created in winter from a commercial scale harvest

Storage and handling are important facets of biomass logistics because there are associated costs and biomass properties can change significantly as material proceeds through the supply chain. Thus, this aspect of biomass supply systems requires continued study. Shrub willow chips were harvested, and used to create six piles that each contained between 10 and 22 Mg (fresh biomass). Material was monitored for several months in temporary storage to assess changes in biomass quality (moisture, ash and energy content). Internal pile temperatures increased due to biological activity and conditions within a pile quickly differentiated based on location (shell, core, top, and side). Mean moisture content increased from 42 to 47% (mass fraction) between harvest and delivery of the chips, but ranged between 37 and over 60% over the next three months depending on pile location with the shell generally drier than the core. Mean ash content increased 1 to 2% points (mass fraction) between harvesting, reloading and delivery to the trial location, but became more variable during storage. Higher heating values (HHV) were stable between 18.6 and 19.0 MJ kg –1 over the six months, but lower heating values (LHV) ranged between 8.6 and 11.7 MJ kg –1 and mirrored changes in moisture content. There was minimal change in chip quality over two months, but quality became more variable over longer time periods. In conclusion, this period could be extended, and negative effects on chip quality could be mitigated, by improving storage methods, blending different types of chips, or employing pretreatments.

09 BIOMASS FUELS↗

RD53A: A large-scale prototype chip for the phase II upgrade in the serially powered HL-LHC pixel detectors

The phase II upgrade of the HL-LHC experiments within the LHC intends to deepen the studies of the Higgs boson and to allow the discovery of further particles by adding an integrated luminosity of about 4000 fb -1 over 10 years of operation. This upgrade would overwhelm the installed pixel detector readout chips with higher hit rates and radiation levels than ever before. To match these extreme requirements the RD53 collaboration, a joint effort between ATLAS and CMS, developed RD53A, a new generation pixel detector readout chip prototype manufactured in a 65 nm CMOS technology. It is half the size of the final pixel chips and designed to meet requirements in the face of 3 GHz/cm 2 hit rate after irradiation to 500 Mrad. The detector is able to use 50×50 μm 2 or 25×100 μm 2 pixels with high readout speed of up to 4 links per chip with 1.28 Gbit/s each. Shunt–LDO regulators integrated on the bottom of the chip provide the required voltages to the two power domains, analog and digital. These regulators enable serial powering of the pixel modules, which is the only feasible, radiation hard scheme to ensure acceptable power cable losses and to stay within the material budget for the future pixel detectors. Finally, an overview of the status and challenges of serial powering and the Shunt–LDO regulator development will be given.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Plug-and-play polymer microfluidic chips for hydrated, room temperature, fixed-target serial crystallography

The practice of serial X-ray crystallography (SX) depends on efficient, continuous delivery of hydrated protein crystals while minimizing background scattering. Of the two major types of sample delivery devices, fixed-target devices offer several advantages over widely adopted jet injectors, including: lower sample consumption, clog-free delivery, and the ability to control on-chip crystal density to improve hit rates. In this study we present our development of versatile, inexpensive, and robust polymer microfluidic chips for routine and reliable room temperature serial measurements at both synchrotrons and X-ray free electron lasers (XFELs). Our design includes highly X-ray-transparent enclosing thin film layers tuned to minimize scatter background, adaptable sample flow layers tuned to match crystal size, and a large sample area compatible with both raster scanning and rotation based serial data collection. The optically transparent chips can be used both for in situ protein crystallization (to eliminate crystal handling) or crystal slurry loading, with prepared samples stable for weeks in a humidified environment and for several hours in ambient conditions. Serial oscillation crystallography, using a multi-crystal rotational data collection approach, at a microfocus synchrotron beamline (SSRL, beamline 12-1) was used to benchmark the performance of the chips. Furthermore, high-resolution structures (1.3–2.7 Å) were collected from five different proteins – hen egg white lysozyme, thaumatin, bovine liver catalase, concanavalin-A (type VI), and SARS-CoV-2 nonstructural protein NSP5. Overall, our modular fabrication approach enables precise control over the cross-section of materials in the X-ray beam path and facilitates chip adaption to different sample and beamline requirements for user-friendly, straightforward diffraction measurements at room temperature.

59 BASIC BIOLOGICAL SCIENCES↗

A radiation tolerant clock generator for the CMS endcap timing layer readout chip

Here, we present the test results of a low jitter Phase Locked Loop (PLL) prototype chip for the CMS Endcap Timing Layer readout chip (ETROC). This chip is based on the improved version of a clock synthesis circuit named ljCDR from the Low Power Gigabit Transceiver (lpGBT) project. The ljCDR is tested in its PLL mode. An automatic frequency calibration (AFC) block with the Triple Modular Redundancy (TMR) register is developed for the LC-oscillator calibration. The chip was manufactured in a 65 nm CMOS process with 10 metal layers. The chip has been extensively tested, including Total Ionizing Dose (TID) testing up to 300 Mrad and Single Event Upset (SEU) testing with heavy ions possessing a Linear Energy Transfer (LET) from 1.3 to 62.5 MeV × cm 2 /mg.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Testing the limits of ITkPixV2: the ATLAS inner tracker pixel detector readout chip

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of 5 × 1034 cm-1 s-1, ITkPixV2 must meet significant increases in nearly all design requirements compared to the current ATLAS Inner Detector (ID), including a 10× increase in trigger rate, a 7.5× increase in hit rate, a 3× increase in radiation tolerance, and a 12.5× decrease in pixel current draw per unit area, all while maintaining a similar power per unit area as present pixel detectors. Here we present the first measurements of the ITkPixV2 chip operated at the limits of the full chip design requirements, including in particular a measurement of the activity-induced current of the chip as a function of increasing hit rate.

Le Pottier, L↗

A user-friendly plug-and-play cyclic olefin copolymer-based microfluidic chip for room-temperature, fixed-target serial crystallography

Over the past two decades, serial X-ray crystallography has enabled the structure determination of a wide range of proteins. With the advent of X-ray free-electron lasers (XFELs), ever-smaller crystals have yielded high-resolution diffraction and structure determination. A crucial need to continue advancement is the efficient delivery of fragile and micrometre-sized crystals to the X-ray beam intersection. This paper presents an improved design of an all-polymer microfluidic `chip' for room-temperature fixed-target serial crystallography that can be tailored to broadly meet the needs of users at either synchrotron or XFEL light sources. The chips are designed to be customized around different types of crystals and offer users a friendly, quick, convenient, ultra-low-cost and robust sample-delivery platform. Compared with the previous iteration of the chip [Gilbile et al. (2021), Lab Chip , 21 , 4831–4845], the new design eliminates cleanroom fabrication. It has a larger imaging area to volume, while maintaining crystal hydration stability for both in situ crystallization or direct crystal slurry loading. Crystals of two model proteins, lysozyme and thaumatin, were used to validate the effectiveness of the design at both synchrotron (lysozyme and thaumatin) and XFEL (lysozyme only) facilities, yielding complete data sets with resolutions of 1.42, 1.48 and 1.70 Å, respectively. Overall, the improved chip design, ease of fabrication and high modifiability create a powerful, all-around sample-delivery tool that structural biologists can quickly adopt, especially in cases of limited sample volume and small, fragile crystals.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

High-Voltage AlInGaN LED Chips

A high-voltage light-emitting diode (LED) flip chip based on an AlInGaN heterostructure is developed and fabricated. The LED flip chip consists of 16 elements connected in series, each of which is a convential LED. The chip with a total area of 1.25 × 1.25 mm is intended for a working current of 20 mA and a forward voltage of 48 V. To improve the current-distribution uniformity over the active region of the chip elements and to minimize the losses of the element area occupied by the n-type contact, the n-type contact pads in them are arranged inside the p-type contact region due to the two-level metallization layout with an intermediate insulating layer of dielectric. The arrangement topology of the contact pads is developed using numerical simulation. An increase in the quantum efficiency of the chip is provided by the application of combinations of metals with a high reflectance at the LED emission wavelength, which are used when fabricating n- and p-type contacts as well as current-carrying strips.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Simultaneous on-chip generation of violet, blue, cyan, green, yellow, orange, and red light from an octave-spanning infrared frequency comb

An integrated, multi-spectral visible-light source could significantly benefit technologies such as displays, medical imaging, spectroscopy, visible-light communications, and astrophysics. However, despite recent advances in chip-scale visible lasers, simultaneously generating light of all colors in a single chip has been challenging. Existing solutions are either not suitable for full chip-scale integration, or are fundamentally difficult to scale. Here we demonstrate the simultaneous on-chip generation of infrared, red, orange, yellow, green, cyan, blue, and violet light. Leveraging the low loss, low dispersion, and high density of modes of an adiabatic multimode silicon nitride (SiN) microresonator, we use a single infrared pump of moderate power (~130 mW) to produce an octave-spanning infrared frequency comb that is then converted to different portions of the visible spectrum. We measure non-mode-locked combs and soliton steps corresponding to mode-locked states, making our comb generator suitable for applications that demand either low or high coherence. Since the required pump power is compatible with high-power lasers demonstrated in the same SiN platform, our multi-octave light generator can be fully integrated in a chip-scale form factor. We envision that such a light source will be a catalyst for the development and deployment of miniaturized multi-spectral technologies for quantum systems, medical imaging, displays, and spectroscopy.

47 OTHER INSTRUMENTATION↗

Dynamic Aspects of Chip Formation

A multimass chain model of chip formation in the secondary deformation zone is proposed. The influence of the frictional conditions and cutting conditions on the group motion of the chip elements over the cutter’s front surface is shown. The dynamics of the motion of the chip’s free end has a significant influence on its fracture. In particular, the mass ratio of the last elements involved in the group motion (and positioned on the contact line at the cutter’s front surface) and the free end of the chip gives rise to considerable dynamic splitting forces between the elements. The proposed approach offers broad scope for analysis of the conditions of chip formation, including conditions with intensification of the cutting process by electrical pulses.

36 MATERIALS SCIENCE↗

A very high speed lossless compression/decompression chip set

A chip is described that will perform lossless compression and decompression using the Rice Algorithm. The chip set is designed to compress and decompress source data in real time for many applications. The encoder is designed to code at 20 M samples/second at MIL specifications. That corresponds to 280 Mbits/second at maximum quantization or approximately 500 Mbits/second under nominal conditions. The decoder is designed to decode at 10 M samples/second at industrial specifications. A wide range of quantization levels is allowed (4...14 bits) and both nearest neighbor prediction and external prediction are supported. When the pre and post processors are bypassed, the chip set performs high speed entropy coding and decoding. This frees the chip set from being tied to one modeling technique or specific application. Both the encoder and decoder are being fabricated in a 1.0 micron CMOS process that has been tested to survive 1 megarad of total radiation dosage. The CMOS chips are small, only 5 mm on a side, and both are estimated to consume less than 1/4 of a Watt of power while operating at maximum frequency.

Venbrux, Jack↗

A Low Cost Single Chip VDL Compatible Transceiver ASIC

Recent trends in commercial communications system components have focussed almost exclusively on cellular telephone technology. As many of the traditional sources of receiver components have discontinued non-cellular telephone products, the designers of avionics and other low volume radio applications find themselves increasingly unable to find highly integrated components. This is particularly true for low power, low cost applications which cannot afford the lavish current consumption of the software defined radio approach increasingly taken by certified device manufacturers. In this paper, we describe a low power transceiver chip targeting applications from low VHF to low UHF frequencies typical of avionics systems. The chip encompasses a selectable single or double conversion design for the receiver and a low power IF upconversion transmitter. All local oscillators are synthesized and integrated into the chip. An on-chip I-Q modulator and demodulator provide baseband modulation and demodulation capability allowing the use of low power, fixed point signal processing components for signal demodulation. The goal of this program is to demonstrate a low cost VDL mode-3 transceiver using this chip to receive text weather information sent using 4-slot TDMA with no support for voice. The data will be sent from an experimental ground station. This work is funded by NASA Glenn Research Center.

Becker, Robert↗

Manipulating Neutral Atoms in Chip-Based Magnetic Traps

Several techniques for manipulating neutral atoms (more precisely, ultracold clouds of neutral atoms) in chip-based magnetic traps and atomic waveguides have been demonstrated. Such traps and waveguides are promising components of future quantum sensors that would offer sensitivities much greater than those of conventional sensors. Potential applications include gyroscopy and basic research in physical phenomena that involve gravitational and/or electromagnetic fields. The developed techniques make it possible to control atoms with greater versatility and dexterity than were previously possible and, hence, can be expected to contribute to the value of chip-based magnetic traps and atomic waveguides. The basic principle of these techniques is to control gradient magnetic fields with suitable timing so as to alter a trap to exert position-, velocity-, and/or time-dependent forces on atoms in the trap to obtain desired effects. The trap magnetic fields are generated by controlled electric currents flowing in both macroscopic off-chip electromagnet coils and microscopic wires on the surface of the chip. The methods are best explained in terms of examples. Rather than simply allowing atoms to expand freely into an atomic waveguide, one can give them a controllable push by switching on an externally generated or a chip-based gradient magnetic field. This push can increase the speed of the atoms, typically from about 5 to about 20 cm/s. Applying a non-linear magnetic-field gradient exerts different forces on atoms in different positions a phenomenon that one can exploit by introducing a delay between releasing atoms into the waveguide and turning on the magnetic field.

Aveline, David↗

Mathematical Simulation for Integrated Linear Fresnel Spectrometer Chip

A miniaturized solid-state optical spectrometer chip was designed with a linear gradient-gap Fresnel grating which was mounted perpendicularly to a sensor array surface and simulated for its performance and functionality. Unlike common spectrometers which are based on Fraunhoffer diffraction with a regular periodic line grating, the new linear gradient grating Fresnel spectrometer chip can be miniaturized to a much smaller form-factor into the Fresnel regime exceeding the limit of conventional spectrometers. This mathematical calculation shows that building a tiny motionless multi-pixel microspectrometer chip which is smaller than 1 cubic millimter of optical path volume is possible. The new Fresnel spectrometer chip is proportional to the energy scale (hc/lambda), while the conventional spectrometers are proportional to the wavelength scale (lambda). We report the theoretical optical working principle and new data collection algorithm of the new Fresnel spectrometer to build a compact integrated optical chip.

Park, Yeonjoon↗