Enhanced Bulk Transport in Copper Vanadate Photoanodes Identified by Combinatorial Alloying
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Although various processes for metal printing at the micro- and mesoscale have been demonstrated, printing functional devices such as thermocouples, thermopiles, and heat flux sensors that function based on interfaces between an alloy and another alloy/metal demands processes for printing alloys. Furthermore, a high-quality and crystalline alloy is required for acceptable function of these devices. This article reports for the first time co-electrodeposition-based printing of single-phase solid solution nanocrystalline copper/nickel (Cu/Ni) alloy with various controllable compositions (Cu100Ni0 to Cu19Ni81) from a single electrolyte. Additionally, the printed alloy is nanocrystalline (<35 nm), continuous, and dense with no apparent porosity, with remarkable mechanical and magnetic properties, without any postprocessing annealing such as heat treatment. In addition, a functional thermocouple fabricated using this process is demonstrated. Such a process can not only be used for fabrication of functional devices, it may also facilitate fundamental studies on alloys by printing a continuous library of alloy composition for material characterization.
The direct metal deposition (DMD) additive manufacturing process produces high cooling rates within a small melt pool and can lead to high amounts of solute trapping. These high cooling rates limit diffusion and lead to the formation of non-equilibrium phases. In this work, we utilize a numerical model to calculate the degree of solute trapping, defined as non-equilibrium partitioning. A theoretical case with overall composition fixed to 50Cu-50Fe at.%. was performed to observe the influence of increasing solidification rates. We then simulate DMD of equimolar Cu-Fe powder printed on mild steel substrate and the calculated non-equilibrium phase compositions were consistent with experimental observations reported earlier on this alloy composition. For a single deposited track, cooling rates are high enough to yield significant solute trapping. Here, the degree of solute trapping is highest near the free surface and has a gradient that correlates with the cooling rate gradient.
This study examines the effect of copper alloying on pitting resistance in a model solid solution FCC Ni-13%Cr-10%Fe alloy through potentiodynamic and potentiostatic polarization in 0.1 M NaCl in conjunction with an analysis using first-principles competitive electro-chemisorption modeling. The pitting potential increased with increasing Cu content in the alloy. Furthermore, the extent of metastable pit growth was suppressed and the incubation time for metastable to stable pit transition increased with Cu content. The first-principles competitive adsorption calculations suggested that Cu alloying suppresses chloride ion adsorption on the alloy surface in a simulated pit environment, which inhibits active dissolution at the pit bottom, enhances proton adsorption, and thereby increases the local pH at the pit bottom. In conclusion, we propose that these two effects of Cu in solid solution combine to reduce pit stability and may act in addition to the enrichment of Cu on the corroding pit surface.
Understanding and controlling the alloying properties of nanomaterials under electrochemical conditions are critically important for fields ranging from energy storage and catalysis to electrochromic window technology. Hydrogen-absorbing nanomaterials, like palladium, are especially interesting due to their ability to reversibly absorb and store hydrogen in their lattice at near-stoichiometric amounts. Palladium’s work function is also significantly deeper than that of most transition metals, which enables electrochemical underpotential deposition of conformal monolayer and submonolayer amounts of transition metals onto the palladium surface. The simultaneous existence of these two properties is unique and opens new and exciting avenues for electrochemical applications. However, the intersection of surface-modified, hydrogen-alloyed palladium nanomaterials is poorly understood, and specifically, how these structures evolve during electrochemical operating conditions remains an open question. Here, we synthesize {100}-terminated palladium nanocubes and deposit between 0.5 and 22 monolayers of copper at the palladium surface. We then electrochemically alloy these surface-modified structures with hydrogen. Using a combination of analytical electrochemistry, spectroscopy, and microscopy, we track the positional evolution of the Cu at the surface of Pd, its impact on palladium’s ability to absorb hydrogen, and copper’s effect on hydrogen evolution electrocatalysis. We show that Cu readily alloys into the palladium nanocube at potentials more negative than the Cu 2+/0 deposition, but a 0.5 monolayer thick copper layer remains at the Pd surface regardless of potential. Finally, we discuss the implications of these findings within the framework of CO 2 reduction catalysis for carbon–carbon bond-forming chemistry.
Through 2024-2025 some alloys of copper, aluminum and nickel were tested in a cryogenic electrical resistivity measurement bench, with the primary intent to help inform the design of superconducting current leads for EIC.
A secondary alkaline battery includes an anode, a cathode, and an electrolyte. The cathode includes a current collector, a cathode mixture in electrical contact with the current collector. The cathode mixture comprises: manganese oxide, a copper compound comprising copper, a salt of copper, an alloy thereof, or any combination thereof, a bismuth compound comprising bismuth, a salt of bismuth, or any combination thereof, and a conductive carbon. The secondary alkaline battery can also include a first composition in contact with the current collector and disposed between the current collector and the cathode mixture that includes copper, a salt of copper, an alloy thereof, or a combination thereof.
Abstract Metal dusting is still an unresolved issue at high temperatures. Currently, two material‐related strategies to mitigate metal dusting are described in the literature. On the one hand, highly alloyed materials are used, which contain large amounts of protective oxide‐forming elements, such as Cr, Al, and Si. The second mitigation strategy is based on inhibiting the catalytic effect of Fe, Ni, and Co. These elements all strongly catalyze the formation of solid carbon from the gas phase. Combining the catalytic protection of Cu alloying for metal dusting with protection by a classical alumina/chromia barrier is a native feature that high‐entropy alloys (HEAs) can offer. In this study, the behavior of different equiatomic HEAs with and without Al and/or Cu are studied when exposed at 620°C in a highly aggressive metal‐dusting environment.
Over the last several decades, additive manufacturing (AM) has been primarily used for rapid prototyping or to create novel geometries that would be difficult or impossible to create by normal manufacturing methods. More recently, research has been focused on expanding the list of materials that can be made through additive manufacturing, opening a greater range of material properties for this manufacturing method. Due to the unusual conditions during AM, including the high cooling rates and voxel by voxel method of production, AM parts often have anisotropic material microstructures and properties. In this investigation, the laser power, composition, and nozzle head speed during direct metal deposition of copper-iron alloys was varied to understand how the grain structure within the printed parts could be changed and controlled. The resulting dendrite spacing was measured and compared to calculated cooling rates from Gaussian beams on flat plates under similar material and laser properties, which resulted in a cooling rate to dendrite spacing relationship following an inverse square root, as is found in other dendritic systems [Young and Kerkwood, Metall. Trans. A 6, 197–205 (1975)]. Thus, it is demonstrated that in the Cu-Fe system, dendrite spacing can be controlled through manipulation of printing parameters.
In the present work, Al-4 wt pct Cu/TiC composite was synthesized by the molten salt route that contains submicron-sized TiC particles in the Al-4 wt pct Cu matrix. The concentration of the TiC particle in the base alloy is 7.5 wt pct. Melt ultrasound treatment was done by remelting the as-cast composite at 1023 K (750 °C) in a view to refine the size of TiC particles to nanoscale and distribute them evenly in the matrix. The microstructure and age hardenability of the untreated and ultrasound-treated composites were investigated. The TiC particles accelerate the precipitation kinetics of CuAl{sub 2} phase in Al-4 wt pct Cu alloy. In the present study, the hardness obtained for untreated Al-4 wt pct Cu/TiC composite is 120 VHN within 5 hours of peak aging time, which is higher than the hardness of the monolithic Al-4 wt pct Cu, which is 104 VHN at 35 hours of peak aging time. Melt ultrasound treatment of Al-4 wt pct Cu/TiC composite shows no significant effect on the distribution and refinement of TiC particles in the matrix. However, it partially disintegrates the TiC into Al{sub 3}Ti and Al{sub 4}C{sub 3} particles. The ultrasound-treated composite showed an improved hardness of about 132 VHN at 5 hours of peak aging, in comparison to that of the untreated composite, by forming denser and homogeneous CuAl{sub 2} precipitates.
High traffic touch surfaces such as doorknobs, countertops, and handrails can be transmission points for the spread of pathogens, emphasizing the need to develop materials that actively self-sanitize. Metals are frequently used for these surfaces due to their durability, but many metals also possess antimicrobial properties which function through a variety of mechanisms. This work investigates metallic alloys comprised of several metals which individually possess antimicrobial properties, with the target of achieving broad-spectrum, rapid sanitation through synergistic activity. An entropy-motivated stabilization paradigm is proposed to prepare scalable alloys of copper, silver, nickel and cobalt. Using combinatorial sputtering, thin-film alloys were prepared on 100 mm wafers with ≈50% compositional grading of each element across the wafer. The films were then annealed and investigated for alloy stability. Antimicrobial activity testing was performed on both the as-grown alloys and the annealed films using four microorganisms—Phi6, MS2, Bacillus subtilis and Escherichia coli —as surrogates for human viral and bacterial pathogens. Testing showed that after 30 s of contact with some of the test alloys, Phi6, an enveloped, single-stranded RNA bacteriophage that serves as a SARS-CoV-2 surrogate, was reduced up to 6.9 orders of magnitude (> 99.9999%). Additionally, the non-enveloped, double-stranded DNA bacteriophage MS2, and the Gram-negative E. coli and Gram-positive B. subtilis bacterial strains showed a 5.0, 6.4, and 5.7 log reduction in activity after 30, 20 and 10 min, respectively. Antimicrobial activity in the alloy samples showed a strong dependence on the composition, with the log reduction scaling directly with the Cu content. Concentration of Cu by phase separation after annealing improved activity in some of the samples. The results motivate a variety of themes which can be leveraged to design ideal antimicrobial surfaces.
In this work, we investigated the effects of alloying elements on plastic deformation and microstructure evolution in polycrystalline copper (Cu) and Cu alloyed with 1 wt. % lead (Cu-1 %Pb). These materials were selected due to the size mismatch between Cu and Pb, with the latter forming precipitates at grain boundaries. Multi-modal characterization techniques, including neutron diffraction, electron backscatter diffraction (EBSD), and transmission electron microscopy (TEM), along with finite element simulations were employed to study the deformation behavior across multiple length scales. While both Cu and Cu-1%Pb exhibited similar macroscale response and final deformation textures, both dislocation line profile analysis and TEM revealed increased dislocation density in deformed Cu-1%Pb specimens. The presence of lead precipitates also significantly affected local plastic deformation during compression, with their influence diminishing with increasing strain. These results demonstrate the complex relationships between alloying elements, plastic deformation, microstructural evolution, and material behavior under load. The insights gained from this multi-scale and multi-technique approach contribute to the fundamental understanding of microstructural evolution in immiscible alloys and are valuable for tailoring the properties of structural materials for specific engineering applications.
Knowledge of how trace amounts of more reactive metals influence the oxidation rate and mechanism of Cu surfaces is essential for developing strategies to optimize the performance of Cu-based catalysts. We find that the addition of 1% Rh to Cu(111) increases the initial O 2 dissociation rate by approximately 9-fold. CO poisoning experiments reveal that single Rh atoms activate O 2 and facilitate the spillover of atomic oxygen to Cu sites. Scanning tunneling microscopy (STM) and in situ X-ray photoelectron spectroscopy (XPS) support this mechanism, showing enhanced surface oxygen near Rh atoms. Here, a density functional theory (DFT)-based model demonstrates that Rh binds the O 2 precursor 0.15 eV more strongly than Cu(111) and lowers the O 2 dissociation barrier by 0.02 eV. Both single-crystal and nanoparticle experiments show that at low oxygen pressures, Rh enhances Cu oxidation, whereas at higher pressures, it inhibits deeper oxidation, as evidenced by in situ ultraviolet-visible (UV-vis) spectra.
Cu-rich Pt–Cu bimetallic catalysts are among the most promising candidates for actively catalyzing the hydrodechlorination of 1,2-dichloroethane (1,2-DCA) toward ethylene production. Combining reaction kinetics experiments with density functional theory (DFT) calculations and mean-field microkinetic modeling, we present a systematic mechanistic study for 1,2-DCA hydrodechlorination on Cu-rich Pt–Cu alloy catalysts. Our DFT (PBE+(TS+SCS)) results suggest that increasing Cu content in the Pt–Cu alloy destabilizes C 2 -species adsorption while stabilizing the binding of atomic chlorine. The reaction energetics of all the elementary steps in the 1,2-DCA reaction network were calculated on a Pt 1 Cu 3 (111) model surface. The DFT results were then used to construct a microkinetic model, and the model-predicted reaction rates were compared with our reaction kinetics experimental results on a Cu-rich SiO 2 -supported Pt–Cu alloy catalyst through a parameter estimation procedure. Both the reaction kinetics experiments and the microkinetic model after parameter adjustments yielded 100% selectivity to ethylene. The microkinetic model pointed to a reaction pathway involving two sequential chlorine-removal steps on the Pt–Cu alloy catalyst, a mechanism distinct from the one previously identified on pure Pt/SiO 2 catalysts, which involved an initial hydrogen-removal step. Adjustments to the DFT-derived parameters indicate the possible formation of chlorine-induced Cu-enriched surface sites during 1,2-DCA hydrodechlorination conditions, sites that are more active than those encountered in the bulk Pt 1 Cu 3 (111) alloy surface. Furthermore, our study offers valuable initial insights on the 1,2-DCA hydrodechlorination reaction mechanism and the nature of the active sites on PtCu bimetallic catalysts.
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It is well known that Fe-Si alloys with Si content higher than in conventional electrical sheet steels (>3.2% Si) can make a significant impact in improving the efficiency of electrical motors if they are available in sheet/foil (strip) forms at suitable cost. While the magnetic and electrical attributes (e.g., resistivity, core loss) of these high-Si Fe alloys, of relevance to electrical motor core laminations, are known to be exceptional, the alloys have limited workability, making them difficult to produce consistently in sheet/foil (strip) forms. Current processing techniques such as rolling, while adequate for producing conventional electrical steel sheet, do have important disadvantages - large energy consumption and emissions, limitations in processing of low-workability alloys (e.g., high-Si content steels), large-scale plant infrastructure, and less than adequate capability to engineer sheet metals with specific microstructures (e.g., fine-grained) and crystallographic textures (e.g., shear textures). It is therefore of interest to have an alternative commercial process that can produce sheet/foil (strip) from high-Si Fe alloys and which can also overcome some of the deficiencies of current multistage strip processes. The goal of the present project was design and demonstration of a new energy-efficient pilot process for producing high-Si electrical steel strip of commercial widths and thickness, and with superior electrical and magnetic properties than current electrical steels (Fe-3.2% Si as benchmark). The applications domain for these steels is electrical motor core laminations. We have addressed this goal by accomplishment of the following specific objectives and tasks: a) Development of an Fe-4Si-4Cr alloy with electrical resistivity >80 μΩ-cm, induction flux density >1.48 T at 5000 A/m and core loss 35% lower than the benchmark 3.2% Si alloy. The alloy which meets DOE target specifications for motor core attributes was designed with the Si content controlled for the electrical properties and the Cr content tailored to meet material/process workability requirements. b) A unique machining-based deformation processing system was designed and scaled-up to produce strip of commercial width (25 mm to 150 mm) and thickness (up to 0.5 mm) from the Fe-4Si-4Cr alloy and other alloys of varied workability including copper, Al6061-T6 and naval brass. The key attributes of the machining-based strip production are deformation processing by concentrated simple-shear; single-step production of strip from ingot using compact machine infrastructure; strip surface finish of Ra 0.35 to 1 micrometer that is comparable/superior to that of rolled strip; discrete production of strip that can potentially be done at point of use; and controllability of strip mechanical/formability properties by deformation control. c) The electrical, magnetic, surface quality, mechanical, formability, and metallurgical properties/attributes of the machining-based strip were established by direct ASTM standard or equivalent measurement techniques. d) Punching characteristics of the strip in terms of load, edge quality and macro defects were similar to those of conventional 3.2% Si electrical steels. These punching characteristics are critical from a manufacturability perspective for motor/transformer core applications. e) A modeling framework for energy analysis of multistage rolling and the machining-based deformation processing has been established. Application of this modeling to the two strip-processes showed that the machining-based process requires significantly lower specific energy for processing, ~ 25% of that for rolling. The modeling framework can be adapted for a range of sheet-metal forming, bulk metal forming, and machining processes. It can be used to identify key parameters controlling process specific energy. f) A comparative analysis of advantages and disadvantages of machining-based processing against rolling for strip production. The single stage machining-based processing, with compact infrastructure, represents a new manufacturing paradigm for sheet and foil manufacturing that can potentially also be applied to advanced titanium, aluminum, copper and magnesium alloys. The goals and objectives were accomplished by a cross-disciplinary project team comprising of personnel from Purdue University; M4 Sciences LLC, a small-business focused on advanced manufacturing technology development; the Pacific Northwest National Labs; and tool manufacturers. The team is currently in advanced discussions with multiple entities for future process development for commercialization.