Search NASA⌕ Search

SEARCH · Search NASA

Results for “CURING”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 73 records · Page 4

Exploratory study on the effects of novel diamine curing agents and isocyanate precursors on the properties on new epoxy and urethane adhesives

Aromatic diamines based on diphenyl sulfone and benzophenone were studied as epoxy adhesive curing agents. Previously found differences in adhesive strengths for meta vs para orientation were not found in these series. The use of aluminum and alumina as fillers in a m,m prime-methylene dianiline-cured epoxy adhesive was not found to be beneficial to adhesive strength. Alumina filled adhesives had much lower strength than unfilled adhesives. The unfilled m,m prime-methylene dianiline-based epoxy adhesive had excellent resistance to moisture relative to a p,p prime-methylene dianiline-based adhesive and maintained good strengths up to 250 F. A glass fiber composite based on a m,m prime-methylene dianiline-cured epoxy appeared to be equivalent to the p,p prime-methylene dianiline-cured epoxy as judged by short beam shear tests.

Glasgow, D. G.↗

Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materials

The paper presents results of experiments in which the thermal expansion and swelling behavior of an epoxy resin system and two graphite/epoxy composite systems exposed to water were measured. It was found that the cured epoxy resin swells by an amount slightly less than the volume of the absorbed water and that the swelling efficiency of the water varies with the moisture content of the polymer. Additionally, the thermal expansion of cured epoxy resin that is saturated with water is observed to be more than twice that of dry resin. Results also indicate that cured resin that is saturated with 7.1% water at 95 C will rapidly increase in moisture content to 8.5% when placed in 1 C water. The mechanism for this phenomenon, termed reverse thermal effect, is described in terms of a slightly modified free-volume theory in conjunction with the theory of polar molecule interaction. Nearly identical behavior was observed in two graphite/epoxy composite systems, thus establishing that this behavior may be common to all cured epoxy resins.

Adamson, M. J.↗

The stability of new transparent polymeric materials: The epoxy trimethoxyboroxine system. Part 1: The preparation, characterization and curing of epoxy resins and their copolymers

The effects of resin composition, curing conditions fillers, and flame retardant additives on the flammability of diglycidyl ether of bisphenol-A (DGEBA) as measured by the oxygen index is examined. The oxygen index of DGEBA cured with various curing agents was between 0.198 to 0.238. Fillers and flame retardant additives can increase the oxygen index dependent on the material and the amount used. Changes in the basic cured resin properties can be anticipated with the addition of noncompatible additives. High flame resistant epoxy resins with good stability and mechanical properties are investigated.

Pearce, E.↗

Applications of mass spectrometry techniques to autoclave curing of materials

Mass spectrometer analysis of gases evolved from polymer materials during a cure cycle can provide a wealth of information useful for studying cure properties and procedures. In this paper data is presented for two materials to support the feasibility of using mass spectrometer gas analysis techniques to enhance the knowledge of autoclave curing of composite materials and provide additional information for process control evaluation. It is expected that this technique will also be useful in working out the details involved in determining the proper cure cycle for new or experimental materials.

Smith, A. C.↗

Dielectric cure monitoring: Preliminary studies

Preliminary studies have been conducted on two types of dielectric cure monitoring systems employing both epoxy resins and phenolic composites. An Audrey System was used for 23 cure monitoring runs with very limited success. Nine complete cure monitoring runs have been investigated using a Micromet System. Two additional measurements were performed to investigate the Micromet's sensitivity to water absorption in a post-cure carbon-phenolic material. While further work is needed to determine data significance, the Micromet system appears to show promise as a feedback control device during processing.

Goldberg, B. E.↗

Characterization-curing-property studies of HBRF 55A resin formulations

Characterization curing property investigations on HBRF 55A resin formulations are reported. The initial studies on as received cured samples cut from a full-size FWC are reviewed. Inadequacies of as-received and aged samples are pointed out and additional electron microscopic evidence is offered. Characterization of as-received ingredients of HBRF 55A formulation is described. Specifically, Epon 826, Epon 828, EpiRez 5022, RD-2 and various amines, including Tonox and Tonox 60.40, were characterized. Cure kinetics of various formulations are investigated. Changes in physical/thermal properties (viscosity, specific heat, thermal conductivity and density) during cure are described.

Pearce, E. M.↗

Dielectric cure monitoring of the 55A filament wound case resin

Studies were conducted to correlate data from dielectric cure monitoring of 55A filament would case resins using the Micromet System II with differential scanning calorimetry and resin strength tests. Strength tests for resin bonding at various time intervals and DSC are standard accepted techniques for monitoriong resin cure cycles. They are time consuming, destructive, and non-continuous. The Micromet System II will yield reliable information on degree of cure and other parameters, which should allow better quality control on filament wound case resin cure.

Mcnutt, R. C.↗

Modeling the curing process of thermosetting resin matrix composites

A model is presented for simulating the curing process of a thermosetting resin matrix composite. The model relates the cure temperature, the cure pressure, and the properties of the prepreg to the thermal, chemical, and rheological processes occurring in the composite during cure. The results calculated with the computer code developed on the basis of the model were compared with the experimental data obtained from autoclave-curved composite laminates. Good agreement between the two sets of results was obtained.

Loos, A. C.↗

Measurement of the degree of cure in epoxies with ultrasonic velocity

The use of ultrasonic longitudinal velocity values to measure the degree of cure (defined for an epoxide system as the concentration of epoxide/amine bonds divided by the initial epoxide concentration) in epoxy resins is investigated. The experimental setup used to measure the changes in longitudinal velocity with time is described, together with the technique used to calculate the degree of cure from the acoustic data, using the principle of additive module. Measurements were done with diglycidyl ether of bisphenol A epoxy resin cured with an amine adduct agent. Good qualitative agreement was shown between the time dependence of the acoustically measured degree of cure and the predicted rate of reaction.

Winfree, W. P.↗

Frequency-dependent dielectric analysis - Monitoring the chemistry and rheology of thermosets during cure

Frequency-dependent dielectric measurements in a curing resin sample were performed using an impedance analyzer and a permittivity sensor, to separate and measure the ionic (sigma) and dipolar (tau) mobilities, used as molecular probes of the cure reaction in the resin. The resin samples were tetraglycidyl 4,4-prime-diaminodiphenylmethane epoxy resins which included catalyzed (Hercules 3501-6) and uncatalyzed l3502 resin samples. The values of sigma and tau were used to quantitatively determine the viscosity, the degree of cure, and the T(g) of the resin. It is shown that the values of the Arrhenius and WLF constants during the cure process reflect the buildup of the crosslink network.

Kranbuehl, D.↗

Monitoring Polymer Curing Via Electromagnetic Impedance

New nondestructive in-situ electromagnetic-impedance measurement technique senses cure-processing properties of high-temperature, high-performance thermostat and thermoplastic resins. Continuous frequency-dependent measurement and analysis performed during curing cycle. Monitors and measures molecular properties of polymeric resin in liquid and solid states. Applications include nondestructive means for evaluation of materials, determination of "window" boundaries of curing cycles of thermoplastics and thermoset resins, and for online, closed-loop control of curing cycles.

Freeman, William T.↗

Exploratory Study on the Effects of Novel Diamine Curing Agents and Isocyanate Precursors on the Properties of New Epoxy and Urethane Adhesives

This report covers the results of investigations directed toward studying the effects of novel aromatic diamine structures on epoxy adhesive properties and includes work done under a modification to the original contract. Three aromatic diamines based on diphenylsulfone and benzophenone were studied as epoxy adhesive curing agents. Previously found differences in adhesive strengths for meta vs para orientation were not found in these series. The use of aluminum and alumina as fillers in a m,m'-methylene dianiline-cured epoxy adhesive was not found to be beneficial to adhesive strength. Alumina filled adhesives had much lower strength than unfilled adhesives. The unfilled m,m'-methylene dianiline-based epoxy adhesive had excellent resistance to moisture relative to a p,p'-methylene dianiline-based adhesive and maintained good strengths up to 250 F. A glass fiber composite based on a m,m'-methylene dianiline-cured epoxy appeared to be equivalent to the p,p'-methylene dianiline-cured epoxy as judged by short beam shear tests.

Glasgow, D. Gerald↗

Room-Temperature-Cured Copolymers for Lithium Battery Gel Electrolytes

Polyimide-PEO copolymers (PEO signifies polyethylene oxide) that have branched rod-coil molecular structures and that can be cured into film form at room temperature have been invented for use as gel electrolytes for lithium-ion electric-power cells. These copolymers offer an alternative to previously patented branched rod-coil polyimides that have been considered for use as polymer electrolytes and that must be cured at a temperature of 200 C. In order to obtain sufficient conductivity for lithium ions in practical applications at and below room temperature, it is necessary to imbibe such a polymer with a suitable carbonate solvent or ionic liquid, but the high-temperature cure makes it impossible to incorporate and retain such a liquid within the polymer molecular framework. By eliminating the high-temperature cure, the present invention makes it possible to incorporate the required liquid.

Meador, Mary Ann B.↗

Cure Cycle Design Methodology for Fabricating Reactive Resin Matrix Fiber Reinforced Composites: A Protocol for Producing Void-free Quality Laminates

For the fabrication of resin matrix fiber reinforced composite laminates, a workable cure cycle (i.e., temperature and pressure profiles as a function of processing time) is needed and is critical for achieving void-free laminate consolidation. Design of such a cure cycle is not trivial, especially when dealing with reactive matrix resins. An empirical "trial and error" approach has been used as common practice in the composite industry. Such an approach is not only costly, but also ineffective at establishing the optimal processing conditions for a specific resin/fiber composite system. In this report, a rational "processing science" based approach is established, and a universal cure cycle design protocol is proposed. Following this protocol, a workable and optimal cure cycle can be readily and rationally designed for most reactive resin systems in a cost effective way. This design protocol has been validated through experimental studies of several reactive polyimide composites for a wide spectrum of usage that has been documented in the previous publications.

Hou, Tan-Hung↗

Relationship of Cure Temperature to Mechanical, Physical, and Dielectric Performance of PDMS Glass Composite for Electric Motor Insulation

Achieving NASAs aggressive fuel burn and emission reduction for N-plus-3 aircraft will require hybrid electric propulsion system in which electric motors driven by either power generated from turbine or energy storage system will power the fan for propulsion. Motors designed for hybrid electric aircraft are expected to operate at medium to high voltages over long durations in a high altitude service environment. Such conditions have driven research toward the development of wire insulation with improved mechanical strength, thermal stability and increased breakdown voltage. The silicone class of materials has been considered for electric wire insulation due to its inherent thermal stability, dielectric strength and mechanical integrity. This paper evaluates the dependence of these properties on the cure conditions of a polydimethyl-siloxane (PDMS) elastomer; where both cure temperature and base-to-catalyst ratio were varied. The PDMS elastomer was evaluated as a bulk material and an impregnation matrix within a lightweight glass veil support. The E-glass support was selected for mechanical stiffness and dielectric strength. This work has shown a correlation between cure conditions and material physical properties. Tensile strength increased with cure temperature whereas breakdown voltage tended to be independent of process variations. The results will be used to direct material formulation based on specific insulation requirements.

insulation↗

In-situ Inspection of Reflowable-Interface Composite Joints During Cure in an Autoclave

In structural bonds, the interface between adherend and adhesive is nearly two-dimensional making it susceptible to minute quantities of contamination, which can cause weak bonds. Regulatory organizations such as the Federal Aviation Administration (FAA) often require redundant load paths in secondary-bonded, primary-structures to alleviate concerns with bonded performance. Under NASA’s Convergent Aeronautics Solutions (CAS) project, the Adhesive Free Bonding of Composites (AERoBOND) project is investigating reformulated aerospace epoxy-matrix resins to enable reflow and diffusion of the resin at the joint interface during a secondary bonding and cure process. The reflow and intermixing of the matrix resin during assembly can eliminate the material discontinuity at the interface, thereby removing the dependence of bond performance on adhesion at a nearly two-dimensional boundary. AERoBOND process development has evaluated a multitude of parameters including the materials used, the stoichiometric offset of the epoxy resins, time and temperature of cure, and thickness of each ply. Without in-situ process monitoring, the condition of a test article is unknown until mechanical testing is completed. This presentation describes the use of an in-situ ultrasonic inspection system to monitor the joining of two composite parts assembled using the AERoBOND technique. This work quantifies the elimination of the interface by measuring the wave reflection, or lack thereof, at the joint throughout the cure cycle. In addition, the results indicate when reflow and cure of the epoxy resin at the joint occurred. By using the recently developed in-situ inspection with a mobile ultrasonic transducer, localized results can be obtained across a large portion of the joint with high resolution.

Tyler B Hudson↗

In-situ Inspection of Reflowable-Interface Composite Joints During Cure in an Autoclave

In structural bonds, the interface between adherend and adhesive is nearly two-dimensional making it susceptible to minute quantities of contamination, which can cause weak bonds. Regulatory organizations such as the Federal Aviation Administration (FAA) often require redundant load paths in secondary-bonded, primary-structures to alleviate concerns with bonded performance. Under NASA’s Convergent Aeronautics Solutions (CAS) project, the Adhesive Free Bonding of Composites (AERoBOND) project is investigating reformulated aerospace epoxy-matrix resins to enable reflow and diffusion of the resin at the joint interface during a secondary bonding and cure process. The reflow and intermixing of the matrix resin during assembly can eliminate the material discontinuity at the interface, thereby removing the dependence of bond performance on adhesion at a nearly two-dimensional boundary. AERoBOND process development has evaluated a multitude of parameters including the materials used, the stoichiometric offset of the epoxy resins, time and temperature of cure, and thickness of each ply. Without in-situ process monitoring, the condition of a test article is unknown until mechanical testing is completed. This presentation describes the use of an in-situ ultrasonic inspection system to monitor the joining of two composite parts assembled using the AERoBOND technique. This work quantifies the elimination of the interface by measuring the wave reflection, or lack thereof, at the joint throughout the cure cycle. In addition, the results indicate when reflow and cure of the epoxy resin at the joint occurred. By using the recently developed in-situ inspection with a mobile ultrasonic transducer, localized results can be obtained across a large portion of the joint with high resolution.

Tyler B Hudson↗

In-situ Inspection of Reflowable-Interface Composite Joints During Cure in an Autoclave

In structural bonds, the interface between adherend and adhesive is nearly two-dimensional making it susceptible to minute quantities of contamination, which can cause weak bonds. Regulatory organizations such as the Federal Aviation Administration (FAA) often require redundant load paths in secondary-bonded primary-structures to alleviate the inability to certify bonded performance. To address this issue, the NASA Convergent Aeronautics Solutions (CAS): Adhesive Free Bonding of Composites (AERoBOND) project is investigating reformulated aerospace epoxy-matrix resins to enable reflow and diffusion of the resin at the joint interface during a secondary bonding and cure process. The reflow and intermixing of the matrix resin during assembly can eliminate the material discontinuity at the interface, thereby removing the dependence of bond performance on adhesion at a nearly two-dimensional boundary. AERoBOND process development has evaluated a multitude of parameters including the materials used, the stoichiometric offset of the epoxy resins, time and temperature of cure, and thickness of each ply. Without in-situ process monitoring, the condition of a test article is unknown until mechanical testing is completed. This paper describes the use of an in-situ ultrasonic inspection system to monitor the joining of two composite parts assembled using the AERoBOND technique. This work quantifies the interface by measuring the wave reflection, or lack thereof, at the joint throughout the cure cycle. In addition, the results indicate when reflow and cure of the epoxy resin at the joint occurred. By using the recently developed in-situ inspection method with a mobile ultrasonic transducer, localized results can be obtained across a large portion of the joint with high resolution.

Tyler B Hudson↗