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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4

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NASA NTRS1984

Investigation of welded interconnection of large area wraparound contacted silicon solar cells

An investigation was conducted to evaluate the welding and temperature cycle testing of large area 5.9 x 5.9 wraparound silicon solar cells utilizing printed circuit substrates with SSC-155 interconnect copper metals and the LMSC Infrared Controlled weld station. An initial group of 5 welded modules containing Phase 2 developmental 5.9 x 5.9 cm cells were subjected to cyclical temperatures of + or 80 C at a rate of 120 cycles per day. Anomalies were noted in the adhesion of the cell contact metallization; therefore, 5 additional modules were fabricated and tested using available Phase I cells with demonstrated contact integrity. Cycling of the later module type through 12,000 cycles indicated the viability of this type of lightweight flexible array concept. This project demonstrated acceptable use of an alternate interconnect copper in combination with large area wraparound cells and emphasized the necessity to implement weld pull as opposed to solder pull procedures at the cell vendors for cells that will be interconnected by welding.

Lott, D. R.↗

NASA NTRS1985

Interconnect resistance of photovoltaic submodules

Small area amorphous silicon solar cells generally have higher efficiencies than large interconnected submodules. Among the reasons for the differences in performance are the lack of large area uniformity, the effect of nonzero tin oxide sheet resistance, and possibly pinholes in the various layers. Another and usually small effect that can contribute to reduced performance of interconnected cells is the resistance of the interconnection i.e., the series resistance introduced by the metal to tin oxide contact through silicon. Proper processing problems to avoid poor contacts are discussed.

Volltrauer, H.↗

NASA NTRS1987

The performance of multicomputer interconnection networks

The interdependency of nodes and multicomputer interconnection networks is examined using simple calculations based on the asymptotic properties of queueing networks. Methods are described for choosing interconnection networks that fit individual classes of applications. It is also shown how analytic models can be extended to benchmark existing interconnection networks.

Reed, Daniel A.↗

NASA NTRS1988

Optically interconnected phased arrays

Phased-array antennas are required for many future NASA missions. They will provide agile electronic beam forming for communications and tracking in the range of 1 to 100 GHz. Such phased arrays are expected to use several hundred GaAs monolithic integrated circuits (MMICs) as transmitting and receiving elements. However, the interconnections of these elements by conventional coaxial cables and waveguides add weight, reduce flexibility, and increase electrical interference. Alternative interconnections based on optical fibers, optical processing, and holography are under evaluation as possible solutions. In this paper, the current status of these techniques is described. Since high-frequency optical components such as photodetectors, lasers, and modulators are key elements in these interconnections, their performance and limitations are discussed.

Bhasin, Kul B.↗

NASA NTRS1987

Resistive synaptic interconnects for electronic neural networks

The use of the alpha-Ge(1-x):Al(x) and alpha-Ge(1-x):Cu(x) alloys and Pt/Al2O3 cermet thin films as resistive interconnects for binary synaptic memory arrays is evaluated. The fabrication of the 10-20 microns long, 10 microns wide, and 0.1 micron thick interconnects from the alloys and cermet is described. The current-voltage and switching characteristics of the as-deposited films and the patterned test structure are studied. The resistivity, uniformity, stability, and compatibility of the interconnects are examined. It is observed that alpha-Ge(1-x):Cu(x) alloys have a wide resistivity range and low temperature coefficients of resistance; however, their long-term stability is limited due to their low crystallization temperature. It is detected that the alpha-Ge(1-x):Al(x) alloys have higher crystallization temperatures and their resistivity is not greatly affected by large changes in metal content. The Pt/Al2O3 samples display excellent stability, easy fabrication, and control of resistivity with metal content.

Lamb, J. L.↗

NASA NTRS1988

An experimental method for directly determining the interconnectivity of melt in a partially molten system

An experimental method for directly determining the degree of interconnectivity of melt in a partially molten system is discussed using an olivine-basalt system as an example. Samarium 151 is allowed time to diffuse through mixtures of olivine and basalt powder which have texturally equilibrated at 1350 C and 13 to 15 kbars. The final distribution of samarium is determined through examination of developed radiographs of the samples. Results suggest an interconnected melt network is established at melt fractions at least as low as 1 wt pct and all melt is completely interconnected at melt fractions at least as low as 2 wt pct for the system examined.

Daines, Martha J.↗

NASA NTRS1988

Optically interconnected phased arrays

Bhasin, Kul B.↗

NASA NTRS1990

Modeling and synthesis of multicomputer interconnection networks

The type of interconnection network employed has a profound effect on the performance of a multicomputer and multiprocessor design. Adequate models are needed to aid in the design and development of interconnection networks. A novel modeling approach using statistical and optimization techniques is described. This method represents an attempt to compare diverse interconnection network designs in a way that allows not only the best of existing designs to be identified but to suggest other, perhaps hybrid, networks that may offer better performance. Stepwise linear regression is used to develop a polynomial surface representation of performance in a (k+1) space with a total of k quantitative and qualitative independent variables describing graph-theoretic characteristics such as size, average degree, diameter, radius, girth, node-connectivity, edge-connectivity, minimum dominating set size, and maximum number of prime node and edge cutsets. Dependent variables used to measure performance are average message delay and the ratio of message completion rate to network connection cost. Response Surface Methodology (RSM) optimizes a response variable from a polynomial function of several independent variables. Steepest ascent path may also be used to approach optimum points.

Standley, Hilda M.↗

NASA NTRS1991

Optical Backplane Interconnection

Optical backplane interconnection (OBIT), method of optically interconnecting many parallel outputs from data processor to many parallel inputs of other data processors by optically changing wavelength of output optical beam. Requires only one command: exact wavelength necessary to make connection between two desired processors. Many features, including smallness advantageous to incorporate OBIT into integrated optical device. Simplifies or eliminates wiring and speeds transfer of data over existing electrical or optical interconnections. Computer hookups and fiber-optical communication networks benefit from concept.

Hendricks, Herbert D.↗

NASA NTRS1991

Atomic oxygen degradation of Intelsat 4-type solar array interconnects: Laboratory investigations

A Hughes 506 type communication satellite belonging to the Intelsat organization was marooned in low Earth orbit on March 14, 1990, following failure of the Titan third stage to separate properly. The satellite, Intelsat VI, was designed for service in geosynchronous orbit and contains several material configurations which are susceptible to attack by atomic oxygen. Analysis showed the silver foil interconnects in the satellite photovoltaic array to be the key materials issue because the silver is exposed directly to the atomic oxygen ram flux. The results are reported of atomic oxygen degradation testing of Intelsat VI type silver foil interconnects both as virgin material and in a configured solar cell element. Test results indicate that more than 80 pct. of the original thickness of silver in the Intelsat VI solar array interconnects should remain after completion of the proposed Space Shuttle rescue and/or reboost mission.

Koontz, S. L.↗

NASA NTRS1989

Policy issues in interconnecting networks

To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

Leiner, Barry M.↗

NASA NTRS1991

Assessment of atomic oxygen erosion of silver interconnects on Intelsat 6, F3

Intelsat 6 F-3 was launched from Cape Canaveral on a Titan 3 launch vehicle. Failure of the launch vehicle resulted in the satellite being marooned in Low Earth Orbit (LEO). During its sojourn in LEO, Intelsat 6 is exposed to an unanticipated environment consisting primarily of atomic oxygen, which will subject the unprotected silver interconnects (nominally 12.5 microns thick) on the solar panel to oxidation and erosion. Rescue by Space Shuttle is being examined. Consequently, Intelsat and Comsat have joined in an effort to determine the condition of the silver interconnects at the anticipated time of reboost and to assess the long term risks to the intended geostationary mission. Ground based tests, theoretical analysis, and a flight experiment aboard STS-41 were executed, and new software was written to calculate the expected total atomic oxygen fluence on the interconnects.

A. Dunnet↗

NASA NTRS1993

Implementation of interconnect simulation tools in spice

Accurate computer simulation of high speed digital computer circuits and communication circuits requires a multimode approach to simulate both the devices and the interconnects between devices. Classical circuit analysis algorithms (lumped parameter) are needed for circuit devices and the network formed by the interconnected devices. The interconnects, however, have to be modeled as transmission lines which incorporate electromagnetic field analysis. An approach to writing a multimode simulator is to take an existing software package which performs either lumped parameter analysis or field analysis and add the missing type of analysis routines to the package. In this work a traditionally lumped parameter simulator, SPICE, is modified so that it will perform lossy transmission line analysis using a different model approach. Modifying SPICE3E2 or any other large software package is not a trivial task. An understanding of the programming conventions used, simulation software, and simulation algorithms is required. This thesis was written to clarify the procedure for installing a device into SPICE3E2. The installation of three devices is documented and the installations of the first two provide a foundation for installation of the lossy line which is the third device. The details of discussions are specific to SPICE, but the concepts will be helpful when performing installations into other circuit analysis packages.

Satsangi, H.↗

NASA NTRS1996

Finite width coplanar waveguide patch antenna with vertical fed through interconnect

The paper presents the design, fabrication and characterization of a finite width Coplanar waveguide (FCPW) patch antenna and a FCPW-to-FCPW vertical interconnect. The experimental results demonstrate the antenna and interconnect performance. A scheme to integrate an eight element FCPW patch array with MMIC phase shifters and amplifiers using vertical interconnects is described. The antenna module has potential applications in an advanced satellite to ground transmit phased array at K-Band.

Simons, Rainee N.↗

NASA NTRS1999

Novel Three-Dimensional Vertical Interconnect Technology for Microwave and RF Applications

In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,

Goverdhanam, Kavita↗

NASA NTRS2000

Thin and Thick Films Materials Based Interconnection Technology for 500 C Operation

Precious metal based thick-film material was used for printed wires, wire bond pads, test lead-attach, and conductive die-attach for high temperature (up to 500 C and beyond) chip level packaging. A SiC Shottky diode with a thin-film coated backside was attached to a ceramic substrate using precious metal based thick-film material as the electrically conductive bonding layer. After a 500-hour soak test in atmospheric oxygen, these basic interconnection elements, including attached test diode survived both electrically and mechanically. The electrical resistance of these interconnections (including thick-film printed wire/pad, bonded wire, and test lead attach) were low and stable at both room and elevated temperatures. The electrical resistance of the die-attach interface estimated by I-V characterization of the attached diode, during and after high temperature heat treatment, remained desirably low over the course of a 500-hour anneal. Further durability testing of this high temperature interconnection technology is also discussed.

Chen, Liang-Yu↗

NASA NTRS2000

An Interconnected Network of Core-Forming Melts Produced by Shear Deformation

The formation mechanism of terrestrial planetary is still poorly understood, and has been the subject of numerous experimental studies. Several mechanisms have been proposed by which metal-mainly iron with some nickel-could have been extracted from a silicate mantle to form the core. Most recent models involve gravitational sinking of molten metal or metal sulphide through a partially or fully molten mantle that is often referred to as a'magma ocean. Alternative models invoke percolation of molten metal along an interconnected network (that is, porous flow) through a solid silicate matrix. But experimental studies performed at high pressures have shown that, under hydrostatic conditions, these melts do not form an interconnected network, leading to the widespread assumption that formation of metallic cores requires a magma ocean. In contrast, here we present experiments which demonstrate that shear deformation to large strains can interconnect a significant fraction of initially isolated pockets of metal and metal sulphide melts in a solid matrix of polycrystalline olivine. Therefore, in a dynamic (nonhydrostatic) environment, percolation remains a viable mechanism for the segregation and migration of core-forming melts in a solid silicate mantle.

Bruhn, D.↗

NASA NTRS2003

Development of a Thin Film Solar Cell Interconnect for the Powersphere Concept

Progressive development of microsatellite technologies has resulted in increased demand for lightweight electrical power subsystems including solar arrays. The use of thin film photovoltaics has been recognized as a key solution to meet the power needs. The lightweight cells can generate sufficient power and still meet critical mass requirements. Commercially available solar cells produced on lightweight substrates are being studied as an option to fulfill the power needs. The commercially available solar cells are relatively inexpensive and have a high payoff potential. Commercially available thin film solar cells are primarily being produced for terrestrial applications. The need to convert the solar cell from a terrestrial to a space compatible application is the primary challenge. Solar cell contacts, grids and interconnects need to be designed to be atomic oxygen resistant and withstand rapid thermal cycling environments. A mechanically robust solar cell interconnect is also required in order to withstand handling during fabrication and survive during launch. The need to produce the solar cell interconnects has been identified as a primary goal of the Powersphere program and is the topic of this paper. Details of the trade study leading to the final design involving the solar cell wrap around contact, flex blanket, welding process, and frame will be presented at the conference.

Simburger, Edward J.↗