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Strain controlled torsional and biaxial (tension-torsion) low cycle fatigue behavior of Waspaloy was studied at room temperature as a function of heat treatment. Biaxial tests were conducted under proportional (when the axial and torsional strain cycles are in-phase) and non-proportional (when the axial and torsional strain cycles are 90 deg out-of-phase) cyclic conditions. The deformation behavior under these different cyclic conditions were evaluated by slip trace analysis. For this, a Schmidt-type factor was defined for multiaxial loading conditions and it was shown that when the slip deformation is predominant, non-proportional cycles are more damaging than proportional or pure axial or torsional cycles. This was attributed to the fact that under non-proportional cyclic conditions, deformation was through multiple slip as opposed single slip for other loading conditions, which gave rise to increased hardening. The total life for a given test condition was found to be independent of heat treatment. This was interpreted as being due to the differences in the cycles to initiation and propagation of cracks.
TiNiPt shape memory alloys are particularly promising for use as solid state actuators in environments up to 300 C, due to a reasonable balance of properties, including acceptable work output. However, one of the challenges to commercializing a viable high-temperature shape memory alloy (HTSMA) is to establish the appropriate primary and secondary processing techniques for fabrication of the material in a required product form such as rod and wire. Consequently, a Ti(50.5)Ni(29.5)Pt20 alloy was processed using several techniques including single-pass high-temperature extrusion, multiple-pass high-temperature extrusion, and cold drawing to produce bar stock, thin rod, and fine wire, respectively. The effects of heat treatment on the hardness, grain size, room temperature tensile properties, and transformation temperatures of hot- and cold-worked material were examined. Basic tensile properties as a function of temperature and the strain-temperature response of the alloy under constant load, for the determination of work output, were also investigated for various forms of the Ti(50.5)Ni(29.5)Pt20 alloy, including fine wire.
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47th International Conference and Expo on Advanced Ceramics and Composites (ICACC 2023), Daytona Beach, FL, January 22-27, 2023
Oral Presentation at ASTM 8th International Conference on Advanced Manufacturing 2023.
While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a eutectic region of Sn with moderately dispersed Ag3Sn intermetallic, surrounded by a dendritic Sn-rich phase. The SEM images of the fracture surface indicated the presence of a tough shear surface at the initial cavity break area and a break line in the middle of specimen along the failure direction. A hyperbolic-sine creep model was adopted and used to fit the creep experiment data. The effect on the mechanical properties by adding the quaternary element bismuth to the Sn-3.5Ag-0.8Cu alloy was measured and compared with the mechanical properties of the ternary alloys. The results of this research study provide necessary data for the modeling of solder joint reliability for a range of Sn-Ag-Cu compositions and a baseline for evaluating the effects of subsequent quaternary additions.
Microstructural and interfacial characterization of unidirectional SiC (SCS-6) fiber reinforced-reaction formed SiC (RFSC) composites has been carried out. Silicon-1.7 at.% molybdenum alloy was used as the melt infiltrant, instead of pure silicon, to reduce the activity of silicon in the melt as well as to reduce the amount of free silicon in the matrix. Electron microprobe analysis was used to evaluate the microstructure and phase distribution in these composites. The matrix is SiC with a bi-modal grain-size distribution and small amounts of MoSi2, silicon, and carbon. Fiber push-outs tests on these composites showed that a desirably low interfacial shear strength was achieved. The average debond shear stress at room temperature varied with specimen thickness from 29 to 64 MPa, with higher values observed for thinner specimens. Initial frictional sliding stresses showed little thickness dependence with values generally close to 30 MPa. Push-out test results showed very little change when the test temperature was increased to 800 C from room temperature, indicating an absence of significant residual stresses in the composite.
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The contamination from the crucible has been recognized as the main drawback of using vacuum induction melting (VIM) method to prepare TiNi shape memory alloys (SMAs). In the present work, we evaluated the feasibility of utilizing the highly-stable BaZrO3 crucible to prepare TiNi SMAs, whose microstructure and mechanical properties were investigated by High-energy X-ray Diffraction (HE-XRD), analytical Transmission Electron Microscopy (TEM), Differential Scanning Calorimetry (DSC) and tensile test. It was found that there were about 0.035 wt % oxygen and 0.039 wt % zirconium remained in the TiNi alloy after melting in BaZrO3 crucible, which fulfills the ASTM standard on biomedical TiNi alloys. Oxygen from the dissolution of BaZrO3 could form Ti4Ni2Ox phase, and zirconium exists as solute atoms in both of the matrix and second phase. After the thermomechanical processing and vacuum annealing at 850 degrees C, the alloy achieved 37.63% of fracture elongation and 880 MPa of tensile strength. The transformational strain and martensitic yield strain of the alloy reached about 8% and 21% respectively.
Previous work on refractory diboride composites has shown these systems to have potential for use in high temperature leading edge applications for reusable reentry vehicles. These composites, based on compositions of HfB2 or ZrB2 with SiC particulate reinforcements, have shown good oxidation resistance in reentry environments. In this work we are investigating the effects of composition and microstructure on properties. Preliminary studies of composite mechanical properties and oxidation behavior will be discussed.
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