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DOE OSTI2025

Operational and Performance Monitoring of East Tennessee Technology Park Ponds—2025 Results

Performance and operational monitoring are regulatory requirements associated with a non–time-critical removal action for three surface water bodies at the East Tennessee Technology Park (ETTP) in Oak Ridge, Tennessee (Figure 1): the K-1007-P1 Pond, the K-901-A Pond, and the K-720 Slough. This progress report summarizes the monitoring activities and results from FY 2025. The goal of ecological enhancement of the K-1007-P1 and K-901-A Ponds is to reduce risk from polychlorinated biphenyl (PCB) contamination in fish to humans and wildlife. Lowering PCB concentrations in the water column and in the food that fish eat is expected to decrease PCB bioaccumulation in fish. Performance monitoring of the K-1007-P1 Pond focuses on annual PCB trends in water, clams, and fish. PCBs in fish also are sampled annually at the K-720 Slough. Operational monitoring ensures that ecological enhancement measures—including water quality, plant community, fish community, and wildlife actions—have been implemented as intended. Monitoring provides the information necessary to determine whether modifications are needed to attain the design end state (i.e., a heavily vegetated, clearwater pond dominated by sunfish with significantly diminished or at least downwardly trending PCB levels in fish). In FY 2025, fish removal efforts and vegetation planting primarily focused on the K-901-A Pond. These actions were implemented to help push the systems toward the desired end state. Descriptions of the various monitoring activities and preliminary 2025 results are provided in the following sections. An update on fish and plant management actions in FY 2025 is also included in this report. A summary of the more detailed information in this report will be presented as required in the upcoming Remediation Effectiveness Report.

54 ENVIRONMENTAL SCIENCES↗

NASA NTRS2019

Characterization of Low-Temperature, Co-Fired Ceramic-Manufactured Electrostatic Thruster-Closeout Report

The goal of the project was to evaluate prototypes of an experimental thruster developed by the University of Arkansas (UA), Fayetteville, AR. The design under evaluation is a radio frequency (RF) electrostatic thruster that was fabricated using the low-temperature, co-fired ceramic (LTCC) materials and fabrication process. This materials system is analogous to printed circuit board (PCB) technology with the most significant difference being that the laminate is replaced by a ceramic material and the copper layer is replaced by printed sinterable silver paste. LTCC designs are baked after fabrication and assembled to realize an entirely monolithic structure with internal conductors, vias, and cavities. In this process, the LTCC electrostatic thruster (LTCC-ET) that is the subject of the present work becomes a monolithic ceramic thruster capable of withstanding temperatures in excess of 500 ºC. The UA and NASA Marshall Space Flight Center (MSFC) jointly performed prototype testing on the LTCC-ET under a NASA Cooperative Agreement Notice (CAN) award. The LTCC-ET was tested at MSFC in May 2018 over a 1-week period. There were two goals for the test program: (1) Testing to determine the operating parameters required to create plasma ignition in the test articles. This was explored by setting a propellant flowrate and increasing RF power until plasma ignition was observed. Testing was conducted with both argon and krypton. (2) Investigate the thrust and specific impulse (Isp) performance of the thruster as a function of propellant flowrate and grid voltage. This goal was not met during the project as technical challenges in maintaining stable plasma ignition arose due to stress and heating of the RF power feed. In summary, a prototype thruster design (consisting of three packaged units) was fabricated by UA and tested for the first time under vacuum conditions at MSFC to experimentally determine basic performance metrics and functionality. It was found that the design was not sufficiently optimized or robust enough in its initial iteration to support a significant test campaign or characterization program. It was concluded that the propellant outlet channels must be reduced in size with the flowpaths adjusted to increase propellant residence time in the thruster, and that the RF connector must be replaced with a version capable of handling higher power throughput and heating. However, even in its unoptimized form, a plasma could be produced in the LTCCET, demonstrating the efficacy of the design approach. The design is especially compelling due to its low cost to manufacture and, more importantly, its scalability of size and power throughput. Low cost and scalability are also important in that additional functionalities, such as thrust vectoring and plume charge neutralization, can be integrated into future designs with minimal additional cost. This project has matured the LTCC-ET development Technology Readiness Level (TRL) from 1 to 2. The low-cost RF plasma source portion of the LTCC device was matured from TRL 2 to 4 through the demonstration of RF plasma ignition under vacuum conditions.

Huang, P.-H. A.↗

NASA NTRS2021

Hypersonic Second Mode Instability Response to Shaped Roughness

An experimental campaign was conducted on a 7-degree half-angle cone in the NASA Langley Research Center 20-Inch Mach 6 Wind Tunnel to examine the influence of arrays of regularly spaced roughness elements on instability growth and transition. The primary element shape was a pair of elliptical planform ramps that were inclined at equal and opposite angles with respect to the local streamwise direction. The element shapes were designed to induce transient growth disturbances that would lead to sustained azimuthal modulation of the boundary layer flow while limiting the nearfield disturbances to avoid an immediate, i.e., effective tripping of the boundary layer. The bulk of the run matrix consisted of testing different element height sat free stream unit Reynolds numbers ranging from 9.8 to 13.1 million per meter. Other element shapes previously designed for tripping hypersonic boundary layers were also implemented. The model was instrumented with surface mounted Kulite ® and PCB ® pressure transducers and thermocouples. Spectra from the PCBs ® indicated clear suppression of the second-mode instability; however, neither the PCB ® spectra nor the heat transfer data presented strong evidence for delayed turbulent flow. Complementary stability computations likewise demonstrated second-mode reduction, particularly just downstream of the roughness, but also revealed a rise in first mode (streak-instability) amplitudes from the baseline that was likely responsible for the earlier transition observed for taller roughness cases.

Hypersonics↗

NASA NTRS2021

Hypersonic Second-Mode Instability Response to Shaped Roughness

Hypersonics↗

NASA NTRS2021

Hypersonic Second-Mode Instability Response to Shaped Roughness

Hypersonics↗

DOE OSTI2025

10 kV Class 14 MHz Isolated Power Supply

This paper presents a single-switch based isolated power supply, utilizing a PCB based core-less transformer to achieve high inter-winding isolation and low common-mode capacitance. Detailed design procedure, considering the transformer to achieve full range ZVS, minimize voltage stress and minimize RMS currents is presented. The proposed methodology is experimentally validated at 14 MHz, with a load variation of 10:1 in output power and a maximum output power of 4 W. The proposed power supply is useful in applications such as MV gate drives and sensors.

Tessaro Andrade, Elvey [ORNL] (ORCID:0009000225919↗

NASA NTRS2000

Advanced Atmospheric Water Vapor DIAL Detection System

Measurement of atmospheric water vapor is very important for understanding the Earth's climate and water cycle. The remote sensing Differential Absorption Lidar (DIAL) technique is a powerful method to perform such measurement from aircraft and space. This thesis describes a new advanced detection system, which incorporates major improvements regarding sensitivity and size. These improvements include a low noise advanced avalanche photodiode detector, a custom analog circuit, a 14-bit digitizer, a microcontroller for on board averaging and finally a fast computer interface. This thesis describes the design and validation of this new water vapor DIAL detection system which was integrated onto a small Printed Circuit Board (PCB) with minimal weight and power consumption. Comparing its measurements to an existing DIAL system for aerosol and water vapor profiling validated the detection system.

Refaat, Tamer F.↗

NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

High Temperature, Packaging, Alumina, Thick Film↗

NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.

high temperature↗

NASA NTRS2000

Thermal Characterization for a Modular 3-D Multichip Module

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

Fan, Mark S.↗

NASA NTRSDate not supplied

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards↗

NASA NTRS2014

Initial Field Deployment Results of Green PCB Removal from Sediment Systems (GPRSS)

The goal of this task order was to complete optimization and development of the Green PCB Remediation from Sediment Systems(GPRSSs) technology, culminating in the production of functioning demonstration test units which would be deployed at a suitable demonstration location. This location would be selected in conjunction with Toxicological & Ecological Associates who have entered into a SAA with NASA to partner with and further develop this technology. The GPRSSs technology was initially developed under ESC Task Order 83 with the purpose of providing a green remediation technology capable of in-situ removal and remediation of polychlorinated biphenyls (PCBs) from contaminated sediments. The core concept of the technology, a polymeric blanket capable of absorbing PCBs when in contact with contaminated sediments was then transitioned to Task Order 165 where the primary objective was to fully design and optimize a functioning test unit capable of testing the theoretical and laboratory scale concepts in a real world situation. Results from both task orders are included in this report for completeness, although Task Order 165 focused on the blanket design and the small scale field demonstration in which is currently still ongoing in Altavista, VA.

Deployment↗

DOE OSTI2025

Broadband mm-Wave Substrate Integrated Waveguides [Poster]

At mm-wave frequencies, signals need to be supported by specialized, low-loss transmission lines such as waveguides. Substrate-integrated waveguides (SIWs) combine the good electrical properties of rectangular waveguides with the compactness of planar transmission lines. Additionally, SIWs can be fabricated using standard PCB manufacturing techniques and can be easily integrated with other mm-wave components. This study explores SIWs in the 50-75 GHz range, with designs optimized for simple fabrication.

42 ENGINEERING↗

NASA NTRS2020

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Sood, Bhanu↗

NASA NTRS2022

KSC Headquarters Building Area SWMU 104 Soil Interim Measure Report for LOC 2D and LOC 2E Kennedy Space Center, Florida

This Interim Measure (IM) Report for Location of Concern (LOC) 2D and LOC 2E summarizes the activities associated with implementation of an IM to address soil and concrete contamination at the Kennedy Space Center (KSC) Headquarters Building Area (KHQA) located at KSC, Florida. KHQA has been designated Solid Waste Management Unit (SWMU) 104 under KSC’s Resource Conservation and Recovery Act Corrective Action Program. The IM consisted of excavating/removing residual polychlorinated biphenyl (PCB) contamination in soil and concrete from two separate areas, LOC 2D and LOC 2E, which were associated with electrical transformer locations. IM activities were conducted in accordance with the Interim Measure Work Plan (IMWP), Revision 1, for KHQA dated June 2018, which was approved by the Florida Department of Environmental Protection in a correspondence letter dated April 2016 and the United States Environmental Protection Agency in a correspondence letter dated August 2018. The objective of the IM was to remove all remaining contaminated media with total PCB concentrations greater than the State of Florida Residential Soil Cleanup Target Level (RSCTL) (0.5 milligrams per kilogram [mg/kg]). This cleanup goal meets unrestrictive re-use conditions in Florida, and is below federal regulations for PCB Bulk Remediation Waste Cleanup of 1 mg/kg for high occupancy, unrestricted use areas, as outlined in 40 Code of Federal Regulations (CFR) 761.61(a). The timeline of the IM was coordinated with demolition of the former KSC Headquarters Building (demolished in 2021) in order to safely remove contaminated media after electrical equipment was de-energized and removed from the site. Excavation activities were conducted between January 10, 2022, and February 8, 2022, and included two waste streams for off-site disposal: (1) PCB-remediation waste greater than or equal to 50 mg/kg, and (2) PCB-remediation waste less than 50 mg/kg. A total of approximately 347 cubic yards (478 tons) of PCB-contaminated soil and concrete was initially removed from the LOC 2D and LOC 2E areas, as defined in the IMWP. An additional 4.35 tons of soil and concrete were removed based on verification sampling, which was conducted until the cleanup goal was achieved. The total area of excavation from both LOC 2D and LOC 2E was approximately 5,186 square feet (0.12 acres), and excavation depths ranged from 0.5 to 4.0 feet below land surface Excavated soils and concrete were stockpiled based on waste stream and subsequently transported and disposed of at Waste Connections of Osceola County, LLC – JED Landfill in St. Cloud, Florida (PCBs less than 50 mg/kg) or the Chemical Waste Management Landfill in Emelle, Alabama (PCBs greater than or equal to 50 mg/kg). Following excavation, clean backfill was brought to the site and provided to the Demolition Contractor to complete backfill and grading in conjunction with their final site restoration activities from building demolition. Post-IM groundwater sampling was conducted in May 2022 at three monitoring wells installed in April 2022 to confirm that PCBs did not leach into groundwater. These wells were installed where the highest PCB concentrations were detected at LOC 2D, LOC 2E, and from the Building Perimeter IM (previously completed in 2020). All PCB results in groundwater were non-detect. Volatile organic compounds were also analyzed based on potential past use of solvents in transformers with PCB-dielectric fluids and the potential release of dielectric fluids containing volatile organic compounds, and all results were non-detect. Based on completion of a successful IM at LOC 2D and LOC 2E, as well as previous remedial actions that have addressed other contamination at KHQA (SWMU 104), No Further Action without controls will be recommended for SWMU 104. NASA will submit separate Site Rehabilitation Completion Order request documentation for SWMU 104 to support an NFA without controls recommendation.

PCB↗

NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗

NASA NTRS2010

Controlling Precision Stepper Motors in Flight Using (Almost) No Parts

This concept allows control of high-performance stepper motors with minimal parts count and minimal flight software complexity. Although it uses a small number of common flight-qualified parts and simple control algorithms, it is capable enough to meet demanding system requirements. Its programmable nature makes it trivial to implement changes to control algorithms both during integration & test and in flight. Enhancements such as microstepping, half stepping, back-emf compensation, and jitter reduction can be tailored to the requirements of a large variety of stepper motor based applications including filter wheels, focus mechanisms, antenna tracking subsystems, pointing and mobility. The hardware design (using an H-bridge motor controller IC) was adapted from JPL's MER mission, still operating on Mars. This concept has been fully developed and incorporated into the MCS instrument on MRO, currently operating in Mars orbit. It has been incorporated into the filter wheel mechanism and linear stage (focus) mechanism for the AMT instrument. On MCS/MRO, two of these circuits control the elevation and azimuth of the MCS telescope/radiometer assembly, allowing the instrument to continuously monitor the limb of the Martian atmosphere. Implementation on MCS/MRO resulted in a 4:1 reduction in the volume and mass required for the motor driver electronics (100:25 square inches of PCB space), producing a very compact instrument. In fact, all of the electronics for the MCS instrument are packaged within the movable instrument structure. It also saved approximately 3 Watts of power. Most importantly, the design enabled MCS to meet very its stringent maximum allowable torque disturbance requirements.

Randall, David↗

NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗