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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Flow in the Proximity of the Pin-Tool in Friction Stir Welding and Its Relation to Weld Homogeneity

In the Friction Stir Welding (FSW) process a rotating pin inserted into a seam literally stirs the metal from each side of the seam together. It is proposed that the flow in the vicinity of the pin-tool comprises a primary rapid shear over a cylindrical envelope covering the pin-tool and a relatively slow secondary flow taking the form of a ring vortex about the tool circumference. This model is consistent with a plastic characterization of metal flow, where discontinuities in shear flow are allowed but not viscous effects. It is consistent with experiments employing several different kinds of tracer: atomic markers, shot, and wire. If a rotating disc with angular velocity w is superposed on a translating continuum with linear velocity omega, the trajectories of tracer points become circular arcs centered upon a point displaced laterally a distance v/omega from the center of rotation of the disc in the direction of the advancing side of the disc. In the present model a stream of metal approaching the tool (taken as the coordinate system of observation) is sheared at the slip surface, rapidly rotated around the tool, sheared again on the opposite side of the tool, and deposited in the wake of the tool. Local shearing rates are high, comparable to metal cutting in this model. The flow patterns in the vicinity of the pin-tool determine the level of homogenization and dispersal of contaminants that occurs in the FSW process. The approaching metal streams enfold one another as they are rotated around the tool. Neglecting mixing they return to the same lateral position in the wake of the tool preserving lateral tracer positions as if the metal had flowed past the tool like an extrusion instead of being rotated around it. (The seam is, however, obliterated.) The metal stream of thickness approximately that of the tool diameter D is wiped past the tool at elevated temperatures drawn out to a thickness of v/2(omega) in the wiping zone. Mixing distances in the wiping zone are multiplied in the unfolded metal. Inhomogeneities on a smaller scale than the mixing length are obliterated, but structure on a larger scale may be transmitted to the wake of a FSW weld.

Nunes, Arthur C., Jr.↗
NASA NTRS2005

Modeling of Unit-Cells With Z-Pins Using FLASH: Pre-Processing and Post Processing

Although the toughening properties of stitches, z-pins and similar structures have been studied extensively, investigations on the effect of z-pins on the in-plane properties of laminates are limited. A brief summary on the effect of z-pins on the in-plane tensile and compressive properties of composite laminates is presented together with a concise introduction into the finite element code FLASH. The remainder of the report illustrates the modeling aspect of unit cells with z-pins in FLASH and focuses on input and output data as well as post-processing of results.

Krueger, Ronald↗
NASA NTRS2007

Gratings and Random Reflectors for Near-Infrared PIN Diodes

Crossed diffraction gratings and random reflectors have been proposed as means to increase the quantum efficiencies of InGaAs/InP positive/intrinsic/ negative (PIN) diodes designed to operate as near-infrared photodetectors. The proposal is meant especially to apply to focal-plane imaging arrays of such photodetectors to be used for near-infrared imaging. A further increase in quantum efficiency near the short-wavelength limit of the near-infrared spectrum of such a photodetector array could be effected by removing the InP substrate of the array. The use of crossed diffraction gratings and random reflectors as optical devices for increasing the quantum efficiencies of quantum-well infrared photodetectors (QWIPs) was discussed in several prior NASA Tech Briefs articles. While the optical effects of crossed gratings and random reflectors as applied to PIN photodiodes would be similar to those of crossed gratings and random reflectors as applied to QWIPs, the physical mechanisms by which these optical effects would enhance efficiency differ between the PIN-photodiode and QWIP cases: In a QWIP, the multiple-quantum-well layers are typically oriented parallel to the focal plane and therefore perpendicular or nearly perpendicular to the direction of incidence of infrared light. By virtue of the applicable quantum selection rules, light polarized parallel to the focal plane (as normally incident light is) cannot excite charge carriers and, hence, cannot be detected. A pair of crossed gratings or a random reflector scatters normally or nearly normally incident light so that a significant portion of it attains a component of polarization normal to the focal plane and, hence, can excite charge carriers. A pair of crossed gratings or a random reflector on a PIN photodiode would also scatter light into directions away from the perpendicular to the focal plane. However, in this case, the reason for redirecting light away from the perpendicular is to increase the length of the optical path through the detector to increase the probability of absorption of photons and thereby increase the resulting excitation of charge carriers. A pair of crossed gratings or a random reflector according to the proposal would be fabricated as an integral part of photodetector structure on the face opposite the focal plane (see figure). In the presence of crossed gratings, light would make four passes through the device before departing. In the presence of a random reflector, a significant portion of the light would make more than four passes: After each bounce, light would be scattered at a different random angle, and would have a chance to escape only when it was reflected, relative to the normal, at an angle less than the critical angle for total internal reflection. Given the indices of refraction of the photodiode materials, this angle would be about 17 . This amounts to a very narrow cone for escape of trapped light.

Gunapala, Sarath↗
NASA NTRS1969

Gage provides audible signal to facilitate checkout of connector pins

Commercial push gage has been modified to enable rapid, accurate testing of paddle pins in distributors, bullet pins and patch boards. The purpose of the gage is to ensure that the pins will not break electrical contact when they are subjected to a minimum, preset pressure.

Northern, B. J.↗
NASA NTRS1969

An electrical connector pin protector

Spring loaded insert protects electrical connector pins from being bent due to improper mating, or probing the pins with a screwdriver. This device modifies existing electrical connectors using only springs and retaining pins.

Mc Quillen, R. B.↗
NASA NTRS1970

Foolproof quick-release locking pin

Locking pin can be withdrawn only when stress on the joint is negligible. Pin consists of a forward-pointing sleeve, a spring-loaded sliding handle, and a sliding plunger. Plunger movement controls installation and withdrawal of pin.

Nelson, E. P.↗
NASA NTRS1973

Irradiation of three T-111 clad uranium nitride fuel pins for 8070 hours at 990 C (1815 F)

The design and successful operation of three tantalum alloy (Ta-8W-2Hf) clad uranium mononitride (UN) fuel pins irradiated for 8070 hr at 990 C (1815 F) is described. Two pin diameters having measured burnups of 0.47 and 0.90 uranium atom percent were tested. No clad failures or swelling was detected; however, postirradiation clad samples tested failed with 1 percent strain. The fuel density decrease was 2 percent, and the fission gas release was less than 0.05 percent. Isotropic fuel swelling, which averaged about 0.5 percent, was less than fuel pin assembly clearances. Thus the clad was not strained. Thermocouples with a modified hot zone operated at average temperatures to 1100 C (2012 F) without failure. Factors that influence the ability to maintain uniform clad temperature as well as the results of the heat transfer calculations are discussed.

Slaby, J. G.↗
NASA NTRS1974

Tool for use in lifting pin supported objects

A tool for use in lifting a pin-supported, electronic package mounted in juxtaposition with the surface of an electronic circuit board is described. The tool is configured to be received beneath a pin-supported package and is characterized by a manually operable linkage, including an elongated, rigid link is supported for axial reciprocation and a pivotal link pinned to the body and supported for oscillation induced in response to axial motion imparted to the rigid link. A lifting plate is pivotally coupled to the distal end of the pivotal link so that oscillatory motion imparted to the pivotal link serves to move the plate vertically for elevating the plate into lifting engagement with the electronic package positioned thereabove.

Marzek, R. A.↗
NASA NTRS1977

Heat-transfer coefficients of pin-finned cylinders

Pin-finned cylinder can increase heat-transfer rate to more than 4 times that of plain cylinder, depending on pin diameter and spacing. Smallest diameter, closest spacing, and largest pin length-to-diameter ratio gives highest average effective heat-transfer coefficients.

Van Fossen, G. J., Jr.↗
NASA NTRS1976

Pin puller impact shock attenuation

Design of a pin arresting mechanism for a pyrotechnically actuated pin puller is reviewed. The investigative approach is discussed and the impact shock test results for various candidate designs are presented. The selected pin arresting design reduced the peak value of the shock response spectrum by five to one.

Auclair, G. F.↗
NASA NTRS1982

Tool Blunts Cotter Pin Legs for Safety

Jaws on new insertion tool contain upset point and anvil. Point forces cotter-pin legs into loop as it engages anvil. Cotter pin before insertion consists of loop and straight shaft composed of two legs welded together as tips. After insertion, welded legs have been shaped into loop. Tool used to prevent bent loose ends of cotter pins from scratching workers' fingers or cutting and entangling wires.

Stein, J. A.↗
NASA NTRS1985

Anvil for Flaring PCB Guide Pins

Spring-loaded anvil results in fewer fractured pins. New anvil for flaring guide pins in printed-circuit boards absorbs approximately 80 percent of press force. As result fewer pins damaged, and work output of flaring press greatly increased.

Winn, E.↗
NASA NTRS1985

Analysis of a finite composite plate with smooth rigid pin

An elastic continuum method of analysis developed for a smooth rigid pin in a finite composite plate by using complex potentials that satisfy the governing orthotropic differential equation is presented. The plate is subjected to uniaxial loading and the nonlinear problems of partial contact in the pin-plate are studied. Three types of pin fits are examined: interference, push, and clearance. The problems of stresses due to pure interference, load contact behavior, and stresses variations are addressed. The effects of the rectangular geometry and the orthotropic property of the plate are demonstrated through numerical results. It is found that the use of large hole diameter/plate width ratios have deleterious effects and the use of interference has beneficial effects. The solutions obtained will help in the development of special finite elements for fastener joints. Finally, the boundary conditions on the finite outer boundaries are found to be satisfied by a successive integration technique.

Naidu, A. C. B.↗
NASA NTRS1986

Measurement of contact angle in a clearance-fit pin-loaded hole

A technique which measures load-contact variation in a clearance-fit, pin-loaded hole is presented in detail. A steel instrumented pin, which activates a make-or-break electrical circuit in the pin-hole contact region, was inserted into one aluminum and one polycarbonate specimen. The resulting load-contact variations are indicated schematically. The ability to accurately determine the arc of contact at any load was crucial to this measurement. It is noted that this simple experimental technique is applicable to both conducting and nonconducting materials.

Prabhakaran, R.↗
NASA NTRS1990

Magnetic properties of high-T(sub c) superconductors: Rigid levitation, flux pinning, thermal depinning, and fluctuation

The levitation of high-T(sub c) superconductors is quite conspicuous: Above magnets of low symmetry a disk of these ceramics floats motionless, without vibration or rotation; it has a continuous range of stable positions and orientations as if it were stuck in sand. Some specimens may even be suspended above or below the same magnet. This fascinating stability, inherent to no other type of levitation, is caused by the pinning of magnetic flux lines by inhomogeneities inside these extreme type-2 superconductors. The talk deals with pinning of magnetic flux in these materials, with flux flow, flux creep, thermally activated depinning, and the thermal fluctuation of the vortex positions in the flux line lattice (often called flux lattice melting). Also discussed are the fluctuations of the (nearly periodic) magnetic field inside these superconductors which are caused by random pinning sites and by the finite temperature. These fluctuations broaden the van-Hove singularities observed in the density of the magnetic field by nuclear magnetic resonance and by muon spin rotation.

Brandt, E. H.↗