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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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58 records · Page 4

Activation Energy for Solder Bond Degradation: Thermal Cycling of Field-aged Modules at Multiple Upper Temperatures

The reliability of solder joints in the solar cell metallization-interconnect system influences the lifetime of photovoltaic modules. Two field-aged modules-one with Sn 62 Pb 36 Ag 2 solder at the solder joints (Solarex MSX 60), and the other with the standard Sn 60 Pb 40 solder (Siemens M55)-were subjected to a modified thermal cycling (TC) test of IEC 61215. Three sections in each module were maintained at 85 degrees C, 95 degrees C, and 105 degrees C during the 15-minute high temperature dwell time. Current equivalent to the module short-circuit current was injected through the module when the chamber temperature was above 25 degrees C to simulate regular field operation. This novel approach aims to induce thermomechanical fatigue (TMF) at the solder joints and intermetallic compound (IMC) formation at the metal/solder interfaces. The activation energy (E a ) for solder bond degradation was calculated based on the series resistance (R s ) increase in TC testing rather than power drop to avoid the effect of confounding variables. Module-level R s increase in MSX 60 module after TC800 cycles and in M55 module after TC400 cycles was 1.22% and 183.7%, respectively. The E a determined for the module with 2wt% Ag is 0.24 eV and for that with the standard solder is 0.27 eV. The solder bond degradation seems to have been driven by TMF rather than IMC formation for both modules.

14 SOLAR ENERGY↗

Analyzing the impact of design factors on solar module thermomechanical durability using interpretable machine learning techniques

Solar modules in utility-scale systems are expected to maintain decades of lifetime to rival conventional energy sources. However, cyclic thermomechanical loading often degrades their long-term performance, highlighting the importance of effective design to mitigate thermal expansion mismatches between module materials. Given the complex composition of solar modules, isolating the impact of individual components on overall durability remains a challenging task. In this work, we analyze a comprehensive data set that comprises bill-of-materials (BOM) and thermal cycling power loss from 251 distinct module designs to identify the predominant design factors and their impacts on the thermomechanical durability of modules. The methodology of our analysis combines machine learning modeling (random forest) and Shapley additive explanation (SHAP) to correlate design factors with power loss and interpret the model’s decision-making. The interpretation reveals that silicon type (monocrystalline or polycrystalline), encapsulant thickness, busbar numbers, and wafer thickness predominantly influence the degradation. With lower power loss of around 0.6% on average in the SHAP analysis, monocrystalline cells present better durability than polycrystalline cells. This finding is further substantiated by statistical testing on our raw data set. The SHAP analysis also demonstrates that while thicker encapsulants lead to reduced power loss, further increasing their thickness over around 0.6 to 0.7 mm does not yield additional benefits, particularly for the front side one. In addition, other important BOM features such as the number of busbars are analyzed. This study provides a blueprint for utilizing explainable machine learning techniques in a complex material system and can potentially guide future research on optimizing the design of solar modules.

14 SOLAR ENERGY↗

Cost Efficient and Highly Weather-Resistant Solar Panel Backsheet Produced through Continuous Co-Extrusion Processing

The efficient generation and delivery of ‘clean energy” through photovoltaic (PV) technology relies heavily on the cost, performance and reliability of solar panels, along with the individual components used in assembly of those panels. In order to continue towards the Department of Energy’s (DOE) goals of driving costs down, the lifetime of high-output power generation equipment (i.e. solar modules) must be extended to reduce costs associated with power output degradation and replacement of failed or degraded panels. One of the major sources of module failures in the past 30 years has been the failure of the solar panel backsheet. Failure of this component causes severe output losses due to oxidation and yellowing of the module while creating safety concerns as the major electrical insulation of the module is compromised. Tomark-Worthen LLC was formed in 2012 with the goal of designing and manufacturing novel PV backsheets and encapsulants that would be produced in the United States of America and exceed expectations of domestic and international module producers. These backsheets would improve upon known backsheet design failures (i.e. Isovoltaic’s AAA backsheet) and create domestic manufacturing jobs in the PV sector. This goal became a reality with a first-generation product in 2018 and now, with the support of the DOE, Tomark-Worthen has launched a second-generation product known as PhotoMark® Reflections™ 205-3 and 360-3. This 2+ year effort began in late 2017 with a screening of potential polymeric materials and backsheet structural designs. Performance evaluations of each material provided the necessary data needed to select the proper material combinations and move forward into the design of the manufacturing process. These decisions were made by teaming with a local university, well-respected government laboratories, and private research organizations who provided the tools necessary to predict long-term performance of these materials in much shorter periods of time. Once the go/no-go criteria were met at the mid-point of the project, the effort transitioned to predicting 30+ year performance, achieving certifications, and improving manufacturing efficiencies designed to lower costs in order to be competitive in a cost-driven market. Major project accomplishments include recognition of the new backsheet by Underwriters Laboratories (UL) and international certification for 1000V and 1500V modules by TUV Sud. Both 1000V and 1500V products have been proven on several module manufacturing lines and initial customer orders have been received by both domestic and international module producers. Accelerated exposure testing has shown that the performance of this backsheet exceeds the prior polyamide-based backsheet known to fail in the field. Cost-models and initial customer orders have shown the ability to produce this backsheet at a cost acceptable to many domestic manufacturers, while International costs for standard backsheet remains extremely low. Tomark-Worthen remains one of the only U.S. companies manufacturing backsheet domestically and this has drawn interest from many domestic module manufacturers looking to improve their material supply logistics by avoiding long lead times and custom’s headaches while avoiding current tariffs on Chinese-made components. Along with the launch of a new PV backsheet, this project has provided a critical deliverable to the PV R&D community. This deliverable is the knowledge that not all polyamide-containing backsheets are doomed to failure as the earlier versions did. There has been a fear amongst the PV community to consider these materials due to the failure of one design. This effort has brought a new level of interest to the scientific community as it has been shown that polyamides can be used successfully in a well-designed backsheet. As we move forward from this project, we are excited to see how backsheet technology and manufacturing in the U.S. will continue to progress and grow.

14 SOLAR ENERGY↗

Chemical Passivation of Crystalline Si by Al 2 O 3 Deposited Using Atomic Layer Deposition: Implications for Solar Cells

The atomistic-level mechanism for the chemical passivation of the monocrystalline Si (c-Si) surface with thermally annealed Al 2 O 3 was studied using in situ infrared spectroscopy and photoconductance decay measurements. Al 2 O 3 was deposited on high-lifetime, float-zone c-Si substrates using atomic layer deposition (ALD) from trimethylaluminum (TMA), and H 2 O or O 3 . Surface-sensitive attenuated total reflection Fourier transform infrared spectroscopy was used to monitor the c-Si/Al 2 O 3 interface, as well as the bulk of the Al 2 O 3 film during the entire process. Our results show that some surface Si–H bonds are preserved after the ALD of Al 2 O 3 on H-terminated Si. During the annealing step at 400 °C, restructuring occurs at the c-Si/Al 2 O 3 interface to form interfacial SiO x . Isotope labeling was used to differentiate interfacial SiD bonds on the c-Si surface from H incorporated in Al 2 O 3 . Within the sensitivity of our infrared setup (~10 13 cm –2 ), we did not observe any net migration of atomic H or D from Al 2 O 3 to the c-Si/Al 2 O 3 interface. To isolate the effects of chemical and field-effect passivation of Al 2 O 3 thin films, we carried out surface passivation studies on c-Si/SiO 2 /Al 2 O 3 stacks. We also annealed these stacks in different atmospheres to test the influence of annealing atmospheres on the chemical passivation of c-Si by Al 2 O 3 and observed that O 2 -containing atmosphere led to the best surface chemical passivation.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗