SEARCH · Search NASA
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
The Goddard Modular Smallsat Architecture (GMSA) is developed at NASA Goddard Space Flight Center (GSFC) to address future reliability along with minimizing cost and schedule challenges for NASA Cubesat and Smallsat missions.
In this work we investigated the effect of proton irradiation on the performance of long wavelength infrared (LWIR) InAs/GaSb photodiodes (λ(sub c) = 10.2µm) based on the complementary barrier infrared detector (CBIRD) design. We found that irradiation with 68MeV protons up to the total ionizing dose TID = 200 kRad results in only small (about 15%) decrease of the Quantum Efficiency and does not increase the operational bias of the photodiodes. However, the irradiation causes a significant increase of the dark current from j(sub d) = 5x10(exp -5) A/sq cm at V(sub b) = 0.1V and T = 80K to j(sub d) = 6x10(exp -3) A/sq cm at TID = 200 kRad. This change in the dark current mechanism can be attributed to the onset of surface leakage current, generated by the trap assisted tunneling processes in the proton displacement damage areas near the device sidewalls.
No abstract available
Nanocrystal nonvolatile floating-gate memories are a good candidate for space applications - initial results suggest they are fast, more reliable and consume less power than conventional floating gate memories. In the nanocrystal based NVM device, charge is not stored on a continuous polysilicon layer (so-called floating gate), but instead on a layer of discrete nanocrystals. Charge injection and storage in dense arrays of silicon nanocrystals in Si02 is a critical aspect of the performance of potential nanocrystal flash memory structures. The ultimate goal for this class of devices is few- or single-electron storage in a small number of nanocrystal elements. In addition, the nanocrystal layer fabrication technique should be simple, 8-inch wafer compatible and well controlled.
For future deep space missions, significant reductions in the mass and power requirements for short-range telecommunication systems will be critical in enabling a wide variety of new mission concepts. These possibilites include penetrators, gliders, miniature rovers and sensor networks.
Onboard the Cassini spacecraft, and the subject of this paper, are two Solid State Recorders designed and built by TRW, Inc., of Redondo Beach, California, for NASA's Jet Propulsion Laboratory. These recorders, which were the first ones designed and selected by NASA for a space program, represent the new frontier and a new beginning for spaceborne data storage.
Explore the source record for details and available documents.
Explore the source record for details and available documents.
Explore the source record for details and available documents.
The availability of high density, radiation tolerant, nonvolatile memories is critical for space applications. Ferroelectric memories, when fabricated with radiation hardened complementary metal oxide semiconductors (CMOS), can be manufactured and packaged to provide high density replacements for Flash memory, which is not radiation tolerant. Previous work showed ferroelectric memory cells to be resistant to single event upsets and proton irradiation, and ferroelectric storage capacitors to be resistant to neutron exposure. In addition to radiation hardness, the fast programming times, virtually unlimited endurance, and low voltage, low power operation make ferroelectric memories ideal for space missions. Previously, a commercial double level metal 64-kilobit ferroelectric memory was presented. Although the capabilities of radiation hardened wafer fabrication facilities lag behind those of the most modern commercial wafer fabrication facilities, several paths to achieving radiation tolerant, dense ferroelectric memories are emerging. Both short and long term solutions are presented in this paper. Although worldwide major semiconductor companies are introducing commercial ferroelectric memories, funding limitations must be overcome to proceed with the development of high density, radiation tolerant ferroelectric memories.
Fabrication techniques to improve initial efficiency and radiation tolerance of radiation hardened lithium-diffused silicon solar cells
The space radiation environment can lead to extremely harsh operating conditions for on-board electronic box and systems. The characteristics of the radiation environment are highly dependent on the type of mission (date, duration and orbit). Radiation accelerates the aging of the electronic parts and material and can lead to a degradation of electrical performance; it can also create transient phenomena on parts. Such damage at the part level can induce damage or functional failure at electronic box, subsystem, and system levels. A rigorous methodology is needed to ensure that the radiation environment does not compromise the functionality and performance of the electronics during the system life. This methodology is called hardness assurance. It consists of those activities undertaken to ensure that the electronic piece parts placed in the space system perform to their design specifications after exposure to the space environment. It deals with system requirements, environmental definitions, part selection, part testing, shielding and radiation tolerant design. All these elements should play together in order to produce a system tolerant to.the radiation environment. An overview of the different steps of a space system hardness assurance program is given in section 2. In order to define the mission radiation specifications and compare these requirements to radiation test data, a detailed knowledge of the space environment and the corresponding electronic device failure mechanisms is required. The presentation by J. Mazur deals with the Earth space radiation environment as well as the internal environment of a spacecraft. The presentation by J. Schwank deals with ionization effects, and the presentation by T. Weatherford deals with Single particle Event Phenomena (SEP) in semiconductor devices and microcircuits. These three presentations provide more detailed background to complement the sections 3 and 4. Part selection and categorization are discussed in section 5. Section 6 presents the organization of the hardness assurance within a project. Section 7 discusses emerging radiation hardness assurance issues.
Methods to improve the radiation tolerance of silicon cells for spacecraft use are described. The major emphasis of the program was to reduce the process-induced carbon and oxygen impurities in the junction and base regions of the solar cell, and to measure the effect of reduced impurity levels on the radiation tolerance of cells. Substrates of 0.1, 1.0 and 10.0 ohm-cm float-zone material were used as starting material in the process sequence. High-dose, low-energy ion implantation was used to form the junction in n+p structures. Implant annealing was performed by conventional furnace techniques and by pulsed laser and pulsed electron beam annealing. Cells were tested for radiation tolerance at Spire and NASA-LeRC. After irradiation by 1 MeV electrons to a fluence of 10 to the 16th power per sq cm, the cells tested at Spire showed no significant process induced variations in radiation tolerance. However, for cells tested at Lewis to a fluence of 10 to the 15th power per sq cm, ion-implanted cells annealed in vacuum by pulsed electron beam consistently showed the best radiation tolerance for all cell resistivities.
The purpose of the Space Shuttle Cockpit Avionics Upgrade project was to reduce crew workload and improve situational awareness. The upgrade was to augment the Shuttle avionics system with new hardware and software. A major success of this project was the validation of the hardware architecture and software design. This was significant because the project incorporated new technology and approaches for the development of human rated space software. An early version of this system was tested at the Johnson Space Center for one month by teams of astronauts. The results were positive, but NASA eventually cancelled the project towards the end of the development cycle. The goal to reduce crew workload and improve situational awareness resulted in the need for high performance Central Processing Units (CPUs). The choice of CPU selected was the PowerPC family, which is a reduced instruction set computer (RISC) known for its high performance. However, the requirement for radiation tolerance resulted in the reevaluation of the selected family member of the PowerPC line. Radiation testing revealed that the original selected processor (PowerPC 7400) was too soft to meet mission objectives and an effort was established to perform trade studies and performance testing to determine a feasible candidate. At that time, the PowerPC RAD750s where radiation tolerant, but did not meet the required performance needs of the project. Thus, the final solution was to select the PowerPC 7455. This processor did not have a radiation tolerant version, but faired better than the 7400 in the ability to detect failures. However, its cache tags did not provide parity and thus the project incorporated a software strategy to detect radiation failures. The strategy was to incorporate dual paths for software generating commands to the legacy Space Shuttle avionics to prevent failures due to the softness of the upgraded avionics.
The purpose of the Space Shuttle Cockpit Avionics Upgrade project (1999 2004) was to reduce crew workload and improve situational awareness. The upgrade was to augment the Shuttle avionics system with new hardware and software. A major success of this project was the validation of the hardware architecture and software design. This was significant because the project incorporated new technology and approaches for the development of human rated space software. An early version of this system was tested at the Johnson Space Center for one month by teams of astronauts. The results were positive, but NASA eventually cancelled the project towards the end of the development cycle. The goal to reduce crew workload and improve situational awareness resulted in the need for high performance Central Processing Units (CPUs). The choice of CPU selected was the PowerPC family, which is a reduced instruction set computer (RISC) known for its high performance. However, the requirement for radiation tolerance resulted in the re-evaluation of the selected family member of the PowerPC line. Radiation testing revealed that the original selected processor (PowerPC 7400) was too soft to meet mission objectives and an effort was established to perform trade studies and performance testing to determine a feasible candidate. At that time, the PowerPC RAD750s were radiation tolerant, but did not meet the required performance needs of the project. Thus, the final solution was to select the PowerPC 7455. This processor did not have a radiation tolerant version, but had some ability to detect failures. However, its cache tags did not provide parity and thus the project incorporated a software strategy to detect radiation failures. The strategy was to incorporate dual paths for software generating commands to the legacy Space Shuttle avionics to prevent failures due to the softness of the upgraded avionics.
The Radiation Hardened Electronics for Space Environments (RHESE) project consists of a series of tasks designed to develop and mature a broad spectrum of radiation hardened and low temperature electronics technologies. Three approaches are being taken to address radiation hardening: improved material hardness, design techniques to improve radiation tolerance, and software methods to improve radiation tolerance. Within these approaches various technology products are being addressed including Field Programmable Gate Arrays (FPGA), Field Programmable Analog Arrays (FPAA), MEMS Serial Processors, Reconfigurable Processors, and Parallel Processors. In addition to radiation hardening, low temperature extremes are addressed with a focus on material and design approaches.