Analytical Predictions of Thermal Stress in the Stardust PICA Heatshield Under Reentry Flight Conditions
We performed finite element analyses on a model of the Phenolic Impregnated Carbon Ablator (PICA) heatshield from the Stardust sample return capsule (SRC) to predict the thermal stresses in the PICA material during reentry. The heatshield on the Stardust SRC was a 0.83 m sphere cone, fabricated from a single piece of 5.82 cm-thick PICA. The heatshield performed successfully during Earth reentry of the SRC in January 2006. Material response analyses of the full, axisymmetric PICA heatshield were run using the Two-Dimensional Implicit Ablation, Pyrolysis, and Thermal Response Program (TITAN). Peak surface temperatures were predicted to be 3385K, while the temperature at the PICA backface remained at the estimated initial cold-soak temperature of 278K. Surface recession and temperature distribution results from TITAN, at several points in the reentry trajectory, were mapped onto an axisymmetric finite element model of the heatshield. We used the finite element model to predict the thermal stresses in the PICA from differential thermal expansion. The predicted peak compressive stress in the PICA heatshield was 1.38 MPa. Although this level of stress exceeded the chosen design limit for compressive stresses in PICA tiles for the design of the Orion crew exploration vehicle heatshield, the Stardust heatshield exhibited no obvious mechanical failures from thermal stress. The analyses of the Stardust heatshield were used to assess and adjust the level of conservatism in the finite element analyses in support of the Orion heatshield design.