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NASA NTRS2024

A Perspective on Multi-Source Energy Harvesting Technology Using Piezoelectric and Thermoelectric Materials

Energy harvesting using various locally available energy sources such as vibration energy, heat, sound, or magnetic field have become attractive topics for supplying power to modular electronic devices making them run independently in extreme environments. In this paper, we will be discussing the perspectives on thermoelectric (TE) and piezoelectric materials and devices, and then the concept of multi-source energy harvester using piezoelectric and thermoelectric devices and integration of them into a reliable and independent power source. TE materials having low thermal conductivity and high figure-of-merit ( zT ) are developed to convert even a small temperature gradient efficiently into electrical energy with the state-of-the-art conversion efficiency of ~15% and output power of ~56 W from single device. The piezoelectric device architecture is configured using high performance piezoelectric ceramics (Cu-Mn-PIN-PMN-PT). These ceramics exhibit high piezoelectric coefficient with high mechanical quality factor and low dielectric loss factor. Using these piezoelectric materials, power density as high a 2 mW/cm 2 is demonstrated in 1-1.5 g vibration environments. The piezoelectric device is attached on the surface of TE module to capture both the vibration and thermal energy sources to realize dual mode energy harvester. The multi-energy transfer strategy opens opportunities for a future generation of wireless and modular electronic devices. These devices would be useful in powering wearable electronic devices, micro sensor chargers, etc. in extreme environmental conditions using body heat/thermal sources and induced motion/vibrations.

Piezoelectric↗

NASA NTRSDate not supplied

Micro-grid for Future Planetary Surface Needs

Under the current Artemis Program, the National Aeronautics and Space Administration (NASA) will send its next set of astronauts (first woman and next man) to the Moon by 2024 and establish a sustainable presence on the lunar surface by 2028. The challenge of creating a sustained lunar surface presence is significantly different than previous efforts. Lunar surface operations will require access to continuous and highly reliable power to support mission needs, such as to support ISRU operations. Adding to this challenge, the lunar surface operations are not going to be established over a single effort, rather the system and operations will evolve and grow over time (years). The first initial loads that arrive on the lunar surface will be integrated to their own dedicated power sources. As the lunar surface operations grow, so will the demand for power and at some point these individual loads will require more power than can be generated with any single power device. This power demand drives the need for inter-connecting the loads and power devices to share power between them, resulting in a micro-grid. One of the advantages of developing a lunar surface micro-grid is that allows lunar surface operations to resemble electrical utility operations on Earth; it allows power to be generated where it is convenient and allows power to be consumed where it is convenient, rather than negotiating between generation and consumption. The micro-grid concept also provides another benefit of affording the ability to increase overall system reliability by integrating dissimilar power generation and energy storage devices together, for example modifying the power generation strategy to include both solar arrays and nuclear. Creating a lunar surface micro-grid has its advantages, however there are significant challenges associated with an evolvable micro-grid concept. The challenges include how to efficiently transmit large amounts of power (10kW+) long distances (1kW+), how to effectively integrate dissimilar power generation and energy storage devices to maximize power consumption and minimize downtime, and how to physically connect these devices together with a connector that can survive the lunar environment (dust, extreme cold temperatures) and is capable of both astronaut and robotic operation. The basic components of the micro-grid have to be designed to ensure the system is sustainable, modular, and reconfigurable. An interface to the micro-grid has to be designed that allows for additional technologies, some of which may not yet be fully designed, to easily integrate into the micro-grid concept. This presentation discusses these lunar challenges in some more depth and offers a path forward in designing an evolvable micro-grid to meet the needs of the lunar surface operations and proposes a Universal Micro-grid Interface Converter to connect these dissimilar power sources and mission loads to the micro-grid.

Jeffrey Csank↗

DOE OSTI2023

Suppressing Carbon Incorporation in Metal–Organic Chemical Vapor Deposition GaN Using High‐Offcut‐Angled Substrates

Carbon (C) is a common impurity that acts as a compensator within GaN grown via metal–organic chemical vapor deposition (MOCVD). Reducing C in GaN will help reduce the compensation level and provide a route to achieve GaN with reliably low effective doping for high-power device applications. GaN grown with fast growth rates on bulk GaN with various offcut angles via conventional-MOCVD (C-MOCVD) and laser-assisted MOCVD (LA-MOCVD) is compared and analyzed. C-incorporation effects are compared through quantitative secondary-ion mass spectroscopy analysis in GaN grown on GaN substrate with offcut angles of 4° and 0.3° toward m-plane over a wide range of growth rates by C-MOCVD and LA-MOCVD. For both growth techniques investigated, a significant reduction in C-incorporation is observed when a high-offcut-angle (4°) substrate is used as compared to a lower-offcut-angle (0.3°) substrate. Furthermore, with C-MOCVD, at the fastest growth condition investigated (17.26 μm h −1 at 0.3°-offcut, 15.25 μm h −1 at 4°-offcut), a reduction in [C] by 21.2X is observed with an increase in the offcut angle from 0.3° to 4°. A 82.6X reduction in [C] is observed with the similar fast growth condition via LA-MOCVD on GaN with 4° offcut angle (9.78 μm h −1 ) as compared to C-MOCVD at 0.3° offcut angle (17.26 μm h −1 ).

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2023

Envisioning the Future Renewable and Resilient Energy Grids—A Power Grid Revolution Enabled by Renewables, Energy Storage, and Energy Electronics

Today’s power grids are facing tremendous challenges because of the ever-increasing power demand, system complexity, infrastructure cost, knowledge base, and policy and regulatory issues to achieve supply–demand power balance and resiliency with respect to more frequent extreme weather events and cyberattacks. It is particularly challenging when the transition toward 100% intermittent renewable energy sources is considered. Many countries are calling for building up more transmission and distribution lines to increase power delivery capacities. This article is an attempt to answer two urgent questions: Is more transmission and distribution infrastructure really needed to meet the increasing power demand? What kind of future grid infrastructure should we envision and build? This article attempts to answer these questions and proposes the concept of community-centric asynchronous renewable and resilient energy grids. By clearly differentiating the concepts of grid resilience and reliability, the importance of building resilient power electronics’ devices and robust system-level control algorithms to achieve 100% renewable energy integrated resilient grids is presented. To identify the shortcomings and propose advancements, power electronics’ technologies are categorized using the proposed concepts of natural source frequencies (NSf), energy storage, direct energy conversion/control and fault protection (DeCaFp), and high-efficiency energy consumption and buffering (heECaB) technology. The ability of networked microgrids to greatly reduce power outages and power system restoration time is demonstrated by leveraging robust decentralized and centralized control algorithms, identified through a comprehensive literature review. Future research areas are proposed to further enhance grid stability, controllability, cybersecurity, and protection against faults in the presence of 100% renewable sources by leveraging the advanced capabilities of NSf, DeCaFp, and heECaB devices and system-level control algorithms.

14 SOLAR ENERGY↗

NASA NTRS2013

DSP/FPGA Design for a High-Speed Programmable S-Band Space Transceiver

Traditional command uplink receivers are very limited in performance capability, take a long time to acquire, cannot operate on both uplink bands (NASA & AFSCN), and only support low-rate communications. As a result, transceivers end up on many programs critical paths, even though they should be a standard purchased spacecraft subsystem. Also, many missions are impacted by the low effective uplink throughput. In order to tackle these challenges, a transceiver was developed that will provide on-site frequency agility, support of high uplink rates, and operation on both NASA and AFSCN frequency bands. The device is a low-power, high-reliability, and high-performance digital signal processing (DSP) demodulator for an on-orbit programmable command receiver.

Janicik, Jeffrey↗

NASA NTRS2004

Space Application Requirements for Organic Avionics

The NASA Marshall Space Flight Center is currently evaluating polymer based components for application in launch vehicle and propulsion system avionics systems. Organic polymers offer great advantages over inorganic corollaries. Unlike inorganics with crystalline structures defining their sensing characteristics, organic polymers can be engineered to provide varying degrees of sensitivity for various parameters including electro-optic response, second harmonic generation, and piezoelectric response. While great advantages in performance can be achieved with organic polymers, survivability in the operational environment is a key aspect for their practical application. The space environment in particular offers challenges that must be considered in the application of polymer based devices. These challenges include: long term thermal stability for long duration missions, extreme thermal cycling, space radiation tolerance, vacuum operation, low power operation, high operational reliability. Requirements for application of polymer based devices in space avionics systems will be presented and discussed in light of current polymer materials.

Watson, Michael D.↗

DOE OSTI2021

Critical Interference Mechanisms for Marine Renewable Energy-powered Ocean Observing Platforms

Marine renewable energy devices, such as wave energy converters or tidal turbines, not only have the potential to provide clean, reliable power to the grid but may also offer new opportunities for ocean exploration by providing power for oceanographic sensors where other sources cannot. However, an important consideration in making this vision a reality is understanding whether the marine energy devices may interfere with oceanographic measurements. Interference may occur through several pathways, including sound produced by the device and the motion of the device itself. In this report, we provide an overview of interference pathways and their implications before exploring two use cases for marine energy-powered ocean observing platforms: a tidal-powered passive acoustic monitoring system and wave-powered wave measurement buoys. For each use case, we review the relevant literature and underlying physics of the systems as they are relevant to the desired measurements before making recommendations for design of such systems.

16 TIDAL AND WAVE POWER↗

NASA NTRS1991

High-power single-element pseudomorphic InGaAs/GaAs/AlGaAs single quantum well lasers for pumping Er-doped fiber amplifiers

A 980-nm-ridge waveguide pseudomorphic InGaAs/GaAs/AlGaAs single-quantum-well laser with a maximum single-ended output power of 240 mW from a facet-coated device is fabricated from a graded-index separate-confinement heterostructure grown by molecular-beam epitaxy. The laser oscillates in the fundamental spatial mode, allowing 22 percent coupling efficiency into a 1.55-micron single-mode optical fiber. Life testing at an output power of 30 mW per facet from uncoated devices reveals a superior reliability to GaAs/AlGaAs quantum-well lasers but also the need for protective facet coatings for long term reliability at power levels required for pumping Er-doped fiber amplifiers.

Larsson, A.↗

DOE OSTI2021

A perspective on the electro-thermal co-design of ultra-wide bandgap lateral devices

Fundamental research and development of ultra-wide bandgap (UWBG) semiconductor devices are under way to realize next-generation power conversion and wireless communication systems. Devices based on aluminum gallium nitride (AlxGa1-xN, x is the Al composition), ..beta..-phase gallium oxide (..beta..-Ga2O3), and diamond give promise to the development of power switching devices and radio frequency power amplifiers with higher performance and efficiency than commercial wide bandgap semiconductor devices based on gallium nitride (GaN) and silicon carbide (SiC). However, one of the most critical challenges for the successful deployment of UWBG device technologies is to overcome adverse thermal effects that impact the device performance and reliability. Overheating of UWBG devices originates from the projected high power density operation and poor intrinsic thermal properties of AlxGa1-xN and ..beta..-Ga2O3. This Perspective delineates the need and process for the "electro-thermal co-design" of laterally configured UWBG electronic devices and provides a comprehensive review of current state-of-the-art thermal characterization methods, device thermal modeling practices, and both device- and package-level thermal management solutions.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

DOE OSTI2024

RaDIATE Collaboration for Material Studies

In the recent past, major accelerator facilities have been limited in beam power not by their accelerators, but by the beam intercepting device survivability. As next-generation accelerator target facilities (High Energy Physics, Spallation Sources, …) become increasingly more powerful and intense, high power target systems face key technical challenges. Beam-intercepting devices such as beam windows and secondary particle-production targets are continuously bombarded by high-energy high-intensity pulsed proton beams to produce secondary particles. Energy deposition from the primary beam induces near instantaneous heating (thermal shock) and microstructural changes (radiation damage) in the beam-intercepting materials. Both thermal shock and radiation damage ultimately degrade the performance and lifetime of targets and have been identified as the leading cross-cutting challenges of high-power target facilities. In order to operate reliable beam-intercepting devices in the framework of energy and intensity increase for next generation accelerators, the RaDIATE collaboration (Radiation Damage In Accelerator Target Environment) managed by Fermilab, brings together existing expertise in nuclear material and accelerator targets from 20 international institutions to execute a coordinated strategy for high power targetry R&D. This collaboration is generating new and useful materials data for application within the accelerator and the fission/fusion communities. I will give an overview of the RaDIATE R&D program and the achievement in the last few years on material studies in support of High Power Targetry development, including results obtained from irradiation test, development of novel materials and the prospective towards future irradiation campaign. A highlight will be given to the results in collaboration with our colleagues from J-PARC.

Pellemoine, Frederique↗

NASA NTRS1997

Thermophotovoltaic Cell Technology Transferred to the Department of Energy Laboratory and a Commercial Manufacturer

Researchers in the NASA Lewis Research Center's Photovoltaic Branch have developed novel photovoltaic device, called a Monolithically Interconnected Module (MIM), for use in thermophotovoltaic (TPV) power systems. TPV power systems function by heating an emitter to produce light. This light is then converted into electricity by a photovoltaic device or a solar cell. Possible heat sources for the system include concentrated solar energy, the combustion of various fuels, and nuclear decay. NASA has an interest in TPV systems for deep space (nuclear-powered) and near-Sun (solar-powered) missions. There also are many commercial and military applications for TPV, given its potential for high efficiency, low noise, and reliable power. The Monolithically Interconnected Module consists of many small solar cells that are series-interconnected on a common substrate. The cells are fabricated from indium gallium arsenide (InGaAs), which can convert the near-infrared portion of the emitter output spectrum into electricity. The InGaAs devices are deposited on an indium phosphide (InP) substrate that provides electrical isolation. On the bottom the InP substrate is an infrared reflector that returns all the photons that are not converted by the InGaAs device back to the emitter where they are absorbed. This process helps maintain the emitter temperature and dramatically improves the system efficiency. Monolithically Interconnected Module InGaAs thermophotovoltaic cell developed by Lewis. Compared with conventional TPV cells, this TPV device has higher output voltages and lower resistive losses, higher output power density, simplified thermal management, improved reliability, and higher efficiency. The Monolithically Interconnected Module was initially developed under an internally funded effort (Director's Discretionary Fund). Development is now being funded by another government agency, and prototype devices are being produced by a commercial solar cell manufacturer.

Wilt, David M.↗

NASA NTRS2006

Highly Efficient Multilayer Thermoelectric Devices

Multilayer thermoelectric devices now at the prototype stage of development exhibit a combination of desirable characteristics, including high figures of merit and high performance/cost ratios. These devices are capable of producing temperature differences of the order of 50 K in operation at or near room temperature. A solvent-free batch process for mass production of these state-of-the-art thermoelectric devices has also been developed. Like prior thermoelectric devices, the present ones have commercial potential mainly by virtue of their utility as means of controlled cooling (and/or, in some cases, heating) of sensors, integrated circuits, and temperature-critical components of scientific instruments. The advantages of thermoelectric devices for such uses include no need for circulating working fluids through or within the devices, generation of little if any noise, and high reliability. The disadvantages of prior thermoelectric devices include high power consumption and relatively low coefficients of performance. The present development program was undertaken in the hope of reducing the magnitudes of the aforementioned disadvantages and, especially, obtaining higher figures of merit for operation at and near room temperature. Accomplishments of the program thus far include development of an algorithm to estimate the heat extracted by, and the maximum temperature drop produced by, a thermoelectric device; solution of the problem of exchange of heat between a thermoelectric cooler and a water-cooled copper block; retrofitting of a vacuum chamber for depositing materials by sputtering; design of masks; and fabrication of multilayer thermoelectric devices of two different designs, denoted I and II. For both the I and II designs, the thicknesses of layers are of the order of nanometers. In devices of design I, nonconsecutive semiconductor layers are electrically connected in series. Devices of design II contain superlattices comprising alternating electron-acceptor (p)-doped and electron-donor (n)-doped, nanometer- thick semiconductor layers.

Boufelfel, Ali↗

NASA NTRS1995

Thermal Characterization of the Universal Multizone Crystallizator

The Universal Multizone Crystallizator (UMC) is a special apparatus for crystal growth under terrestrial and microgravity conditions. The use of twenty-five zones allows the, UMC to be used for several normal freezing growth techniques. The thermal profile is electronically translated along the stationary sample by systematically reducing the power to the control zones. Elimination of mechanical translation devices increases the systems reliability while simultaneously reducing the size and weight. This paper addresses the UMC furnace design, sample cartridge, typical thermal profiles and corresponding power requirements necessary for two normal freezing techniques: dynamic gradient freeze and zone melting crystal growth.

Watring, D. A.↗

DOE OSTI2023

Understanding Impacts of Frequency Calculations on Underfrequency Load Shedding

Power system fundamental frequency-dependent protection decisions and control decisions are increasingly common in the distribution system space. Understanding the algorithms used in frequency measurements is critical to understanding the decisions made by the many intelligent electronic devices in the power system. These decisions are critically important for reliability analysis for interconnected power systems as they bear directly on resource planning to mitigate under-frequency conditions that would result in under-frequency load shedding (UFLS). This work aims to improve the understanding of frequency measurement algorithms, evaluate the intelligent electronic devices that use frequency measurements for decision making, and understand the algorithms' direct impact on frequency related decision making. First, this work presents background information on the use of frequency measurements in protection logic, specifically UFLS. Second, the paper presents a relay hardware evaluation test bed used to detect and protect systems from under-frequency events. Finally, the paper presents the dynamic events used to evaluate commercially available, off-the-shelf relay equipment and the results from the relay evaluation.

COMTRADE↗

DOE OSTI2024

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronic modules, especially in operating temperatures greater than 150 degrees Celsius. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees Celsius to 200 degrees Celsius) conditions. In the fabrication phase of the samples, we used different stencil patterns and found out that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality than a full-area print. The paste consisted of Cu microflakes and we performed sintering using a Budatec SP300 sintering press at 275 degrees Celsius with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained digital microscope images, which revealed adhesive fracture as the dominant failure mechanism.

ADVANCED PROPULSION SYSTEMS↗

NASA NTRS1996

The Universal Multizone Crystallizator (UMC) Furnace: An International Cooperative Agreement

The Universal Multizone Crystallizator (UMC) is a special apparatus for crystal growth under terrestrial and microgravity conditions. The use of twenty-five zones allows the UMC to be used for several normal freezing growth techniques. The thermal profile is electronically translated along the stationary sample by systematically reducing the power to the control zones. Elimination of mechanical translation devices increases the systems reliability while simultaneously reducing the size and weight. This paper addresses the UMC furnace design, sample cartridge and typical thermal profiles and corresponding power requirements necessary for the dynamic gradient freeze crystal growth technique. Results from physical vapor transport and traveling heater method crystal growth experiments are also discussed.

Watring, D. A.↗

NASA NTRS2016

Long-Term Reliability of a Hard-Switched Boost Power Processing Unit Utilizing SiC Power MOSFETs

Silicon carbide (SiC) power devices have demonstrated many performance advantages over their silicon (Si) counterparts. As the inherent material limitations of Si devices are being swiftly realized, wide-band-gap (WBG) materials such as SiC have become increasingly attractive for high power applications. In particular, SiC power metal oxide semiconductor field effect transistors' (MOSFETs) high breakdown field tolerance, superior thermal conductivity and low-resistivity drift regions make these devices an excellent candidate for power dense, low loss, high frequency switching applications in extreme environment conditions. In this paper, a novel power processing unit (PPU) architecture is proposed utilizing commercially available 4H-SiC power MOSFETs from CREE Inc. A multiphase straight boost converter topology is implemented to supply up to 10 kilowatts full-scale. High Temperature Gate Bias (HTGB) and High Temperature Reverse Bias (HTRB) characterization is performed to evaluate the long-term reliability of both the gate oxide and the body diode of the SiC components. Finally, susceptibility of the CREE SiC MOSFETs to damaging effects from heavy-ion radiation representative of the on-orbit galactic cosmic ray environment are explored. The results provide the baseline performance metrics of operation as well as demonstrate the feasibility of a hard-switched PPU in harsh environments.

Ikpe, Stanley A.↗

NASA NTRS1972

Development of an inherently digital transducer

The term digital transducer normally implies the combination of conventional analog sensors with encoders or analog-to-digital converters. Because of the objectionable characteristics of most digital transducers, a program was instituted to investigate the possibility of producing a transducer that is inherently digital, instead of a transducer that is digital in the usual sense. Such a device would have improved accuracy and reliability and would have reduced power and bulk requirements because two processes, sensing and conditioning, would be combined into one processes. A Curie-point-temperature sensor is described that represents realization of the stated goal. Also, a metal-insulator semiconductor is described that does not conform precisely to the program goals but that appears to have applications as a new and interesting transduction device.

Richard, R. R.↗