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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Infant Mortality and Wear-Out Failures in Polymer and MnO2 Tantalum Capacitors

Reliability testing of modern tantalum capacitors shows the presence of both types, infant mortality (IM) and wearout (WO) failures. To assure reliable operation, the probability of IM failures should be reduced to below the specified level, and the time of WO inception should be greater than the required useful life of the parts at operation conditions. In this work, several types of MnO2 and polymer cathode tantalum capacitors have been tested at highly accelerated conditions to assess voltage acceleration factors, determine adequate burn-in conditions, and assess the useful life. A modified time dependent dielectric breakdown (TDDB) model has been suggested to explain both types of failure, and a physical mechanism of degradation that is based on migration and reactions of oxygen vacancies explains increase of the defect related, IM failures with the level of stress.

tantalum capacitors↗
NASA NTRS2023

Guidelines for Screening, Lot Acceptance, and Derating for Polymer Tantalum Capacitors

These guidelines have been developed for NASA space projects that are planning to use new technology hermetic and chip polymer cathode tantalum capacitors. Polymer Tantalum Capacitors (PTC) selected from MIL-PRF-32700, automotive grade (AEC-Q200) parts, or COTS+ (hi-rel COTS) capacitors should be screened and qualified as suggested in Tables 1-3 and derated per section 9 below. Screening and lot acceptance tests that were carried out for a lot that is intended for flight as a part of the manufacturing process do not need to be repeated

tantalum capacitors↗
NASA NTRS1968

Reaction studied of steam with niobium and tantalum

Study reveals the kinetics of niobium and tantalum with steam at elevated temperatures to determine the suitability of high melting metals for fabrication of equipment for temperature steam environments. Niobium obeyed linear kinetics from 1050 degrees to 1500 degrees C but tantalum followed a paralinear rate law.

Kilpatrick, M.↗
NASA NTRS1972

Iridium and tantalum foils for spaceflight neutron dosimetry.

Description of a two-foil system of iridium and tantalum which can measure thermal and intermediate energy neutrons at flux densities of 1 neutron/sq cm-sec over a ten-day lunar mission (1,000,000 neutrons/sq cm). The foils are chemically inert and nontoxic, weigh less than 1 g each, and require only routine gamma pulse height analysis for activation measurement. Detection of fluences below 1,000,000 neutrons/sq cm are achieved for counts of foil activity made as late as two months following neutron exposure. Tantalum foils flown in Apollo 11 indicated a mean dose equivalent to the astronauts of less than 16 mrem from thermal plus intermediate energy neutrons, while nuclear emulsion track analysis indicated approximately 17 mrem from neutrons of energy greater than 0.6 MeV. Iridium foils flown on Apollo 12 indicated dose equivalents of 1.8 to 2.8 mrem from thermal neutrons, excluding tissue thermalized SNAP-27 neutrons.

English, R. A.↗
NASA NTRS1974

Evaluation of wet tantalum capacitors after exposure to extended periods of ripple current, volume 1

The application of tantalum capacitors in the Viking Lander includes both dc voltage and ripple current electrical stress, high temperature during nonoperating times (sterilization), and high vibration and shock loads. The capacitors must survive these severe environments without any degradation if reliable performance is to be achieved. A test program was established to evaluate both wet-slug tantalum and wet-foil capacitors under conditions accurately duplicating actual Viking applications. Test results of the electrical performance characteristics during extended periods of ripple current, the characteristics of the internal silver migration as a function for extended periods of ripple current, and the existence of any memory characteristics are presented.

Watson, G. W.↗
NASA NTRS1975

High strength forgeable tantalum base alloy

Increasing tungsten content of tantalum base alloy to 12-15% level will improve high temperature creep properties of existing tantalum base alloys while retaining their excellent fabrication and welding characteristics.

Buckman, R. W., Jr.↗
NASA NTRS1974

Tantalum capacitor behavior under fast transient overvoltages

Tantalum capacitors were tested to determine failure time when subjected to short-duration, high-voltage surges caused by lightning strikes. Lightning is of concern to NASA because of possible damage to critical spacecraft circuits. The test was designed to determine the minimum time for tantalum capacitor failure and the amount of overvoltage a capacitor could survive, without permanent damage, in 100 microseconds. All tested exhibited good recovery from the transient one-shot pulses with no failure at any voltage, forward or reverse, in less than 25 microseconds.

Zill, J. A.↗
NASA NTRS1970

Development of advanced high strength tantalum base alloys. Part 2: Scale-up investigation

Three experimental tantalum alloy compositions containing 14-16% W, 1% Re, 0.7% Hf, 0.025% C or 0.015% C and 0.015% N were prepared as two inch diameter ingots by consumable electrode vacuum arc melting. The as-cast ingots were processed by extrusion and swaging to one inch and 0.4 inch diameter rod and evaluated. Excellent high temperature forging behavior was exhibited by all three compositions. Creep strength at 2000 F to 2400 F was enhanced by higher tungsten additions as well as substitution of nitrogen for carbon. Weldability of all three compositions was determined to be adequate. Room temperature ductility was retained in the advanced tantalum alloy compositions as well as a notched/unnotched strength ratio of 1.4 for a notched bar having a K sub t = 2.9.

Ammon, R. L.↗
NASA NTRS1975

Evaluation of wet tantalum capacitors after exposure to extended periods of ripple current, volume 2

The application of tantalum capacitors in the Viking Lander includes dc voltage and ripple current electrical stress, high temperature during nonoperating times (sterilization), and high vibration and shock loads. The capacitors must survive these severe environments without any degradation if reliable performance is to be achieved. A test program was established to evaluate both wet-slug tantalum and wet-foil capacitors under conditions accurately duplicating actual Viking applications. Test results of the electrical performance characteristics during extended periods of ripple current, the characteristics of the internal silver migration as a function of extended periods of ripple current, and the existence of any memory characteristics are presented.

Ward, C. M.↗
NASA NTRS1975

Alkali oxide-tantalum, niobium and antimony oxide ionic conductors

The phase equilibrium relations of four systems were investigated in detail. These consisted of sodium and potassium antimonates with antimony oxide and tantalum and niobium oxide with rubidium oxide as far as the ratio 4Rb2O:llB2O5 (B=Nb, Ta). The ternary system NaSbO3-Sb2O4-NaF was investigated extensively to determine the actual composition of the body centered cubic sodium antimonate. Various other binary and ternary oxide systems involving alkali oxides were examined in lesser detail. The phases synthesized were screened by ion exchange methods to determine mobility of the mobility of the alkali ion within the niobium, tantalum or antimony oxide (fluoride) structural framework. Five structure types warranted further investigation; these structure types are (1) hexagonal tungsten bronze (HTB), (2) pyrochlore, (3) the hybrid HTB-pyrochlore hexagonal ordered phases, (4) body centered cubic antimonates and (5) 2K2O:3Nb2O5. Although all of these phases exhibit good ion exchange properties only the pyrochlore was prepared with Na(+) ions as an equilibrium phase and as a low porosity ceramic. Sb(+3) in the channel interferes with ionic conductivity in this case, although relatively good ionic conductivity was found for the metastable Na(+) ion exchanged analogs of RbTa2O5F and KTaWO6 pyrochlore phases.

Roth, R. S.↗
NASA NTRS1982

Mechanical properties of low tantalum alloys

The mechanical property behavior of equiaxed cast B-1900 + Hf alloy as a function of tantalum content was studied. Tensile and stress rupture characterization was conducted on cast to size test bars containing tantalum at the 4.3% (standard level), 2.2% and 0% levels. Casting parameters were selected to duplicate conditions used to prepare test specimens for master metal heat qualification. The mechanical property results as well as results of microstructural/phase analysis of failed test bars are presented.

Kortovich, C. S.↗
NASA NTRS1983

Thermal and electrical interaction of tantalum with a low temperature chemically active plasma flow

The paper deals with an experimental study of radiative heat transfer and charge transfer processes from the surface of tantalum plates under conditions of unsteady high-temperature heating and oxidation. It is shown that at plate temperatures of 1800 K, the heat flux may be as high as 400 kW/sq m. Heating is shown to stimulate the emissivity of tantalum and the temperature of the free electrons which surface, through a gas boundary layer, from the plasma onto the metal.

Zake, M. V.↗
NASA NTRS2007

Effect of Mechanical Stresses on Characteristics of Chip Tantalum Capacitors

The effect of compressive mechanical stresses on chip solid tantalum capacitors is investigated by monitoring characteristics of different part types under axial and hydrostatic stresses. Depending on part types, an exponential increase of leakage currents was observed when stresses exceeded 10 MPa to 40 MPa. For the first time, reversible variations of leakage currents (up to two orders of magnitude) with stress have been demonstrated. Mechanical stresses did not cause significant changes of AC characteristics of the capacitors, whereas breakdown voltages measured during the surge current testing decreased substantially indicating an increased probability of failures of stressed capacitors in low impedance applications. Variations of leakage currents are explained by a combination of two mechanisms: stress-induced scintillations and stress-induced generation of electron traps in the tantalum pentoxide dielectric.

Teverovsky, Alexander A.↗
NASA NTRS2008

Effect of Surge Current Testing on Reliability of Solid Tantalum Capacitors

Tantalum capacitors manufactured per military specifications are established reliability components and have less than 0.001% of failures per 1000 hours for grades D or S, thus positioning these parts among electronic components with the highest reliability characteristics. Still, failures of tantalum capacitors do happen and when it occurs it might have catastrophic consequences for the system. To reduce this risk, further development of a screening and qualification system with special attention to the possible deficiencies in the existing procedures is necessary. The purpose of this work is evaluation of the effect of surge current stress testing on reliability of the parts at both steady-state and multiple surge current stress conditions. In order to reveal possible degradation and precipitate more failures, various part types were tested and stressed in the range of voltage and temperature conditions exceeding the specified limits. A model to estimate the probability of post-surge current testing-screening failures and measures to improve the effectiveness of the screening process has been suggested.

Teverovsky, Alexander↗
NASA NTRS2010

High efficiency tantalum-based ceramic composite structures

Tantalum-based ceramics are suitable for use in thermal protection systems. These composite structures have high efficiency surfaces (low catalytic efficiency and high emittance), thereby reducing heat flux to a spacecraft during planetary re-entry. These ceramics contain tantalum disilicide, molybdenum disilicide and borosilicate glass. The components are milled, along with a processing aid, then applied to a surface of a porous substrate, such as a fibrous silica or carbon substrate. Following application, the coating is then sintered on the substrate. The composite structure is substantially impervious to hot gas penetration and capable of surviving high heat fluxes at temperatures approaching 3000.degree. F. and above.

Stewart, David A.↗
NASA NTRS2010

Degradation of Leakage Currents in Solid Tantalum Capacitors Under Steady-State Bias Conditions

Degradation of leakage currents in various types of solid tantalum capacitors under steady-state bias conditions was investigated at temperatures from 105 oC to 170 oC and voltages up to two times the rated voltage. Variations of leakage currents with time under highly accelerated life testing (HALT) and annealing, thermally stimulated depolarization currents, and I-V characteristics were measured to understand the conduction mechanism and the reason for current degradation. During HALT the currents increase gradually up to three orders of magnitude in some cases, and then stabilize with time. This degradation is reversible and annealing can restore the initial levels of leakage currents. The results are attributed to migration of positively charged oxygen vacancies in tantalum pentoxide films that diminish the Schottky barrier at the MnO2/Ta2O5 interface and increase electron injection. A simple model allows for estimation of concentration and mobility of oxygen vacancies based on the level of current degradation.

Teverovsky, Alexander A.↗
NASA NTRS2014

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

multilayer ceramic capacitor (MLCC)↗