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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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DOE OSTI2023

Deploying Automation Technology Supporting Packaging and Transportation Operations

Various United States Department of Energy (DOE) sites are investigating the deployment of robotics to provide safer, effective, and more efficient operations. By implementing robotics in packaging and transportation operations, improvements toward production efficiency, worker ergonomics, radiological dose reduction, and security assurance can be realized. Robotic Systems must be designed and implemented in concert with a facility’s safety basis, classification, and security constraints, while improving overall operational effectiveness. The desired robotic implementation should provide a path to potential long-term cost savings, reduce/eliminate hazardous conditions and radiological exposure, while improving quality and reliability of an operation process. The Savannah River Site (SRS), a DOE Site located in Aiken South Carolina, has initiated several large scale projects supporting future nuclear material disposition activities. Incorporation of automation and robotic equipment in system designs will support effective and efficient material handling operations, including container movements and packaging activities. Robotic systems will execute tasks that are precise, procedural and integrated with control systems to verify and record data for material inventory and historical archiving. An overview of the current robotic system development to perform receipt inspection, packaging, storage and shipment preparation activities of designated Type A and B shipping packages will be presented.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

NASA NTRS1989

Hybrid propulsion technology program. Volume 2: Technology definition package

A concept design study was performed to configure two sizes of hybrid boosters; one which duplicates the advanced shuttle rocket motor vacuum thrust time curve and a smaller, quarter thrust level booster. Two sizes of hybrid boosters were configured for either pump-fed or pressure-fed oxygen feed systems. Performance analyses show improved payload capability relative to a solid propellant booster. Size optimization and fuel safety considerations resulted in a 4.57 m (180 inch) diameter large booster with an inert hydrocarbon fuel. The preferred diameter for the quarter thrust level booster is 2.53 m (96 inches). The demonstration plan would culminate with test firings of a 3.05 m (120 inch) diameter hybrid booster.

Jensen, Gordon E.↗

NASA NTRS2005

3-D Packaging: A Technology Review

Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

Strickland, Mark↗

NASA NTRS1999

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

Hunter, Don J.↗

NASA NTRS2014

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Ghaffarian, Reza↗

NASA NTRS2014

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

MLF↗

NASA NTRS1997

A Review of Chip Scale Package Assembled Reliability

NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.

Chip Scale Packaging Microspacecraft↗

DOE OSTI2025

Development of a Helical Closure for Radioactive Material Shipping Packages

The Savannah River National Laboratory (SRNL) Packaging Technology group proposed a closure design for the outer packaging of a prototype Type B shipping package being developed for the Department of Energy (DOE). The closure design provides an efficient means of securing the containment vessel (CV) within the radioactive material packaging. This design has a simplified operation, requires less components, and less maintenance when compared to current radioactive material package closure methods. This paper will review and discuss the materials, designs, processes, and testing activities that were considered and pursued in the development of the novel closure for the outer packaging of new radioactive material shipping packages.

Housley, William M. [Savannah River National Labor↗

NASA NTRS2000

Comparison of IC and MEMS packaging reliability approaches

This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally, proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

microelectromechanical systems (MEMS) chip scale p↗

NASA NTRS2000

Systems Engineering Programmatic Estimation Using Technology Variance

Unique and innovative system programmatic estimation is conducted using the variance of the packaged technologies. Covariance analysis is performed on the subsystems and components comprising the system of interest. Technological "return" and "variation" parameters are estimated. These parameters are combined with the model error to arrive at a measure of system development stability. The resulting estimates provide valuable information concerning the potential cost growth of the system under development.

Mog, Robert A.↗

NASA NTRS2000

Systems Engineering Programmatic Estimation Using Technology Variance

Unique and innovative system programmatic estimation is conducted using the variance of the packaged technologies. Covariance analysis is performed oil the subsystems and components comprising the system of interest. Technological "returns" and "variation" parameters, are estimated. These parameters are combined with the model error to arrive at a measure of system development stability. The resulting estimates provide valuable information concerning the potential cost growth of the system under development.

Mog, Robert A.↗

NASA NTRS2014

LISA Pathfinder and eLISA news

Two important gatherings of the space-based gravitational-wave detector community were held in Zurich, Switzerland this past March. The first was a meeting of the Science Working Team for LISA Pathfinder (LPF), a dedicated technology demonstrator mission for a future LISA-like gravitational wave observatory. LPF is entering an extremely exciting phase with launch less than 15 months away. All flight components for both the European science payload, known as the LISA Technology Package (LTP), and the NASA science payload, known as the Space Technology 7 Disturbance Reduction System (ST7-DRS), have been delivered and are undergoing integration. The final flight component for the spacecraft bus, a cold-gas thruster based on the successful GAIA design, will be delivered later this year. Current focus is on completing integration of the science payload (see Figures 1 and 2) and preparation for operations and data analysis. After a launch in Summer 2015, LPF will take approximately 90 days to reach its operational orbit around the Earth-Sun Lagrange point (L1), where it will begin science operations. After 90 days of LTP operations followed by 90 days of DRS operations, LPF will have completed its prime mission of paving the way for a space-based observatory of gravitational waves in the milliHertz band. Immediately following the meeting of the LPF team, the eLISA consortium held its third progress meeting. The consortium (www.elisascience.org) is the organizing body of the European space-based gravitational-wave community, and it was responsible for the "The Gravitational Universe" whitepaper that resulted in the November 2013 election of a gravitational-wave science theme for ESA's Cosmic Visions L3 opportunity. In preparation for an L3 mission concept call, which is expected later this decade, and for launch in the mid 2030s, the eLISA consortium members are coordinating technology development and mission study activities which will build on the LPF results. The final mission concept is expected to include some international (non-European) contributions, and NASA has expressed an interest in participating in this ground-breaking mission. The US research community supports such a collaboration, or any other mission scenario that achieves the high-priority science of a space-based gravitational-wave observatory at the earliest possible date.

pathfinder↗

NASA NTRS2017

Colloid Microthruster Flight Performance Results from Space Technology 7 Disturbance Reduction System

Space Technology 7 Disturbance Reduction System (ST7-DRS) is a NASA technology demonstration payload as part of the ESA LISA Pathfinder (LPF) mission, which launched on December 3, 2015. The ST7-DRS payload includes colloid microthrusters as part of a drag-free dynamic control system (DCS) hosted on an integrated avionics unit (IAU) with spacecraft attitude and test mass position provided by the LPF spacecraft computer and the highly sensitive gravitational reference sensor (GRS) as part of the LISA Technology Package (LTP). The objective of the DRS was to validate two technologies: colloid micro-Newton thrusters (CMNT) to provide low-noise control capability of the spacecraft, and drag-free flight control. The CMNT were developed by Busek Co., Inc., in a partnership with NASA Jet Propulsion Laboratory (JPL), and the DCS algorithms and flight software were developed at NASA Goddard Space Flight Center (GSFC). ST7-DRS demonstrated drag-free operation with 10nmHz level precision spacecraft position control along the primary axis of the LTP using eight CMNTs that provided 5-30 N each with 0.1 N precision. The DCS and CMNTs performed as required and as expected from ground test results, meeting all Level 1 requirements based on on-orbit data and analysis. DRS microthrusters operated for 2400 hours in flight during commissioning activities, a 90-day experiment and the extended mission. This mission represents the first validated demonstration of electrospray thrusters in space, providing precision spacecraft control and drag-free operation in a flight environment with applications to future gravitational wave observatories like LISA.

Ziemer, John↗

NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗

NASA NTRS1970

Packaging and container technology - A compilation

Technology utilization briefs on packaging and containers

Source record↗

NASA NTRS1985

Packaging for Food Service

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Stilwell, E. J.↗

NASA NTRS1990

Reliability and quality EEE parts issues

NASA policy and procedures are established which govern the selection, testing, and application of electrical, electronic, and electromechanical (EEE) parts. Recent advances in the state-of-the-art of electronic parts and associated technologies can significantly impact the electronic designs and reliability of NASA space transportation avionics. Significant issues that result from these advances are examined, including: recent advances in microelectronics technology (as applied to or considered for use in NASA projects); electron packaging technology advances (concurrent with, and as a result of, the development of the advanced microelectronic devices); availability of parts used in space avionics; and standardization and integration of parts activities between projects, centers, and contractors.

Barney, Dan↗

NASA NTRS2011

Comparison of Traditional and Innovative Techniques to Solve Technical Challenges

This slide presentation reviews the use of traditional and innovative techniques to solve technical challenges in food storage technology. The planning for a mission to Mars is underway, and the food storage technology improvements requires that improvements be made. This new technology is required, because current food storage technology is inadequate,refrigerators or freezers are not available for food preservation, and that a shelf life of 5 years is expected. A 10 year effort to improve food packaging technology has not enhanced significantly food packaging capabilities. Two innovation techniques were attempted InnoCentive and Yet2.com and have provided good results, and are still under due diligence for solver verification.

Perchonok, Michele↗