Space Shuttle Program - Tin Whisker Mitigation
Space Shuttle Program implemented tin whisker remediation strategy following discovery of tin whiskers in Orbiter hardware.
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Space Shuttle Program implemented tin whisker remediation strategy following discovery of tin whiskers in Orbiter hardware.
A carbon nanofiber can have a surface and include at least one crystalline whisker extending from the surface of the carbon nanofiber. A battery anode composition can be formed from a plurality of carbon nanofibers each including a plurality of crystalline whiskers.
Effect of magnetic field on ferromagnetic metal whisker growth
Metal whiskers - induced growth, growth mechanism, energy sources for growth, magnetic properties, and radiation effects
Method for observing transition growth of graphite whiskers
Single crystal iron whiskers grow in alignment with field lines when subjected to magnetic field during growth process
Electroforming of aluminum composite structures by codeposition of high strength, high modulus fibers or whiskers
Gravity effects on crystal whisker growth
BeO whiskers formation on burning Be droplets surface using scanning electron microscopy, noting temperature effects
In-Bi whisker growth by squeeze technique, measuring crystal structure by X ray analysis and melting point method
A thorough study of the role which foreign atoms play in cone formation during sputtering of metals revealed many experimental facts. Two types of cone formation were distinquished, deposit cones and seed cones. Twenty-six combinations of metals for seed cone formation were tested. The sputtering yield variations with composition for combinations which form seed cones were measured. It was demonstrated that whisker growth becomes a common occurrence when low melting point material is sputter deposited on a hot nonsputtered high melting point electrode.
Pointed phosphor-bronze whiskers are commonly used to contact micron-size Schottky barrier diodes. A process is presented which allows pointing such wire and achieving the desired cone angle and tip diameter without the use of highly undesirable chemical reagents.
The use of ceramics components in gas turbines, cutting tools, and heat exchangers has been limited by the relatively low flaw tolerance of monolithic ceramics. The development of whisker toughened ceramic composites offers the potential for considerable improvement in fracture toughness as well as strength. However, the variability of strength is still too high for the application of deterministic design approaches. Several phenomenological reliability theories proposed for this material system are reviewed and the development is reported of a public domain computer algorithm. This algorithm, when coupled with a general purpose finite element program, predicts the fast fracture reliability of a structural component under multiaxial loading conditions.
Microstructural changes occurring during sliding wear of self-mated Al2O3-SiC whisker reinforced composites were studied using optical, scanning electron microscopy, and transmission electron microscopy. Pin-on-disk specimens were slid in air at 2.7 m/sec sliding velocity under a 26.5 N load for 1 hr. Wear tests were conducted at 23, 600, 800, and 1200 C. Mild wear with a wear factor of 2.4 times 10(exp -7) to 1.5 times 10(exp -6) cu mm/Nm was experienced at all test temperatures. The composite shows evidence of wear by fatigue mechanisms at 800 C and below. Tribochemical reaction (SiC oxidation and reaction of SiO2 and Al2O3) leads to intergranular failure at 1200 C. Distinct microstructural differences existing at each test temperature are reported.
The crystalline thermal expansion and elastic anisotropies of SiC and Al2O3 whiskers are considered in the process of evaluation of the anisotropy of the alpha-E product, the thermoelastic stress index. It is demonstrated to exhibit considerable crystalline anisotropy and a substantial temperature dependence, both of which will influence the thermal and residual stresses in composites using these materials for reinforcement.
The dynamic fatigue behavior of 30 vol pct SiC whisker-reinforced silicon nitride was determined in flexure as a function of temperature from 1100 to 1300 C in an air environment. The fatigue susceptibility parameter n decreased from 88.1 to 20.1 with increasing temperature from 1100 to 1300 C. A transition in the dynamic fatigue curve occurred at a lowest stressing rate of 2 MPa/min at a temperature of 1300 C, resulting in a considerably lower value of n = 5.8. This transition was primarily due to creep that was enhanced by a combination of high temperature and very slow deformation rate. The fatigue resistance of natural flaws at 1100 C was found to be greater than that of artificial flaws produced by indentation.