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At least 73 records · Page 4

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NASA NTRS1981

Stresses in adhesively bonded joints - A closed-form solution

The general plane strain problem of adhesively bonded structures consisting of two different, orthotropic adherends is considered, under the assumption that adherend thicknesses are constant and small in relation to the lateral dimensions of the bonded region, so that they may be treated as plates. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form, with a single lap joint and a stiffened plate under various loading conditions being considered as examples. It is found that the plate theory used in the analysis not only predicts the correct trend for adhesive stresses but gives surprisingly accurate results, the solution being obtained by assuming linear stress-strain relations for the adhesive.

Delale, F.↗

NASA NTRS1982

A critical study of the role of the surface oxide layer in titanium bonding

The molecular understanding of the role which the surface oxide layer of the adherend plays in titanium bonding is studied. The effects of Ti6-4 adherends pretreatment, bonding conditions, and thermal aging of the lap shear specimens were studied. The use of the SEM/EDAX and ESCA techniques to study surface morphology and surface composition was emphasized. In addition, contact angles and both infrared and visible reflection spectroscopy were used in ancillary studies.

Dias, S.↗

NASA NTRS1982

Geometrically nonlinear analysis of adhesively bonded joints

A geometrically nonlinear finite element analysis of cohesive failure in typical joints is presented. Cracked-lap-shear joints were chosen for analysis. Results obtained from linear and nonlinear analysis show that nonlinear effects, due to large rotations, significantly affect the calculated mode 1, crack opening, and mode 2, inplane shear, strain-energy-release rates. The ratio of the mode 1 to mode 2 strain-energy-relase rates (G1/G2) was found to be strongly affected by he adhesive modulus and the adherend thickness. The ratios between 0.2 and 0.8 can be obtained by varying adherend thickness and using either a single or double cracked-lap-shear specimen configuration. Debond growth rate data, together with the analysis, indicate that mode 1 strain-energy-release rate governs debond growth. Results from the present analysis agree well with experimentally measured joint opening displacements.

Dattaguru, B.↗

NASA NTRS1983

Optimization of bonded joints

A procedure for minimizing the elastic shear stress concentration in adhesive lap joints is presented. The proposed method is based upon tapering the adherends to achieve smooth stiffness transitions and uniform shear stresses. Both single and double lap splices are considered, but numerical examples are restricted to the case of double lap joints. Nonisotropic materials and nonoptimum design limitations, such as minimum and maximum thickness adherends, load-line eccentricity, and peel stresses are treated, and typical results are presented.

Ojalvo, I. U.↗

NASA NTRS1983

Effect of stitching on the strength of bonded composite single lap joints

An experimental investigation has been conducted to determine the effect of stitching on the static and fatigue failure load of bonded composite single lap joints. The variables considered in the static tests included adherend thickness, overlap length, stitch spacing, and number of rows of stitches. A limited fatigue program was conducted for one configuration to compare the fatigue life of stitched and unstitched joints. Up to a 38 percent improvement in static failure load and an order of magnitude increase in fatigue life compared with unstiffened results are obtained by a single row of stitches near the end of the overlap. Additional rows of stitching or different stitch spacing has little effect on static joint failure load. Thicker adherends and larger overlap length result in larger improvements in static failure load with stitching. Further research is needed to refine the stitching process in order to obtain the maximum improvements in joint failure load.

Sawyer, J. W.↗

NASA NTRS1984

Rapid adhesive bonding concepts

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process is often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid adhesive bonding concepts were developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens are cut by a factor of 10 to 100 compared to standard press bonding. The development of rapid adhesive bonding for lap shear specimens (per ASTM D1003 and D3163), for aerospace panel bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric matrix composite structures are reviewed.

Stein, B. A.↗

NASA NTRS1984

Geometrically nonlinear analysis of adhesively bonded joints

A geometrically nonlinear finite element analysis of cohesive failure in typical joints is presented. Cracked-lap-shear joints were chosen for analysis. Results obtained from linear and nonlinear analysis show that nonlinear effects, due to large rotations, significantly affect the calculated mode 1, crack opening, and mode 2, inplane shear, strain-energy-release rates. The ratio of the mode 1 to mode 2 strain-energy-release rates (G1/G2) was found to be strongly affected by the adhesive modulus and the adherend thickness. The ratios between 0.2 and 0.8 can be obtained by varying adherend thickness and using either a single or double cracked-lap-shear specimen configuration. Debond growth rate data, together with the analysis, indicate that mode 1 strain-energy-release rate governs debond growth. Results from the present analysis agree well with experimentally measured joint opening displacements. Previously announced in STAR as N83-13497

Dattaguru, B.↗

NASA NTRS1985

Elasticity Solution of an Adhesively Bonded Cover Plate of Various Geometries

The plane strain of adhesively bonded structures consisting of two different isotropic adherends is considered. By expressing the x-y components of the displacements in terms of Fourier integrals and using the corresponding boundary and continuity conditions, the integral equations for the general problem are obtained and solved numerically by applying Gauss-Chebyshev integration scheme. The shear and the normal stresses in the adhesive are calculated for various geometries and material properties for a stiffened plate under uniaxial tension. Numerical results involving the stress intensity factors and the strain energy release rate are presented. The closed-form expressions for the Fredholm kernels are provided to obtain the solution for an arbitrary geometry and material properties. For the general geometry, the contribution of the normal stress is quite significant, while for symmetric geometries, the shear stress is dominant, the normal stress vanishes if the adherends are of the same material and the same thickness.

Aksel, G. N.↗

NASA NTRS1985

Rapid adhesive bonding of advanced composites and titanium

Rapid adhesive bonding (RAB) concepts utilize a toroid induction technique to heat the adhesive bond line directly. This technique was used to bond titanium overlap shear specimens with 3 advanced thermoplastic adhesives and APC-2 (graphite/PEEK) composites with PEEK film. Bond strengths equivalent to standard heated-platen press bonds were produced with large reductions in process time. RAB produced very strong bonds in APC-2 adherend specimens; the APC-2 adherends were highly resistant to delamination. Thermal cycling did not significantly affect the shear strengths of RAB titanium bonds with polyimide adhesives. A simple ultrasonic non-destructive evaluation process was found promising for evaluating bond quality.

Stein, B. A.↗

NASA NTRS1985

High-temperature Adhesive Development and Evaluation

High-temperature adhesive systems are evaluated for short and long-term stability at temperatures ranging from 232C to 427C. The resins selected for characterization include: NASA Langley developed polyphenylquinoxaline (PPQ), and commercially available polyimides (PI). The primary method of bond testing is single lap shear. The PPQ candidates are evaluated on 6A1-4V titanium adherends with chromic acid anodize and phosphate fluoride etch surface preparations. The remaining adhesives are evaluated on 15-5 PH stainless steel with a sulfuric acid anodize surface preparation. Preliminary data indicate that the PPQ adhesives tested have stability to 3000 hours at 450F with chromic acid anodize surface preparation. Additional studies are continuing to attempt to improve the PPQ's high-performance by formulating adhesive films with a boron filler and utilizing the phosphate fluoride surface preparation on titanium. Evaluation of the polyimide candidates on stainless-steel adherends indicates that the FM-35 (American Cyanamid), PMR-15 (U.S. Polymeric/Ferro), TRW partially fluorinated polyimide and NR 150B2S6X (DuPont) adhesives show sufficient promise to justify additional testing.

Hendricks, C. L.↗

NASA NTRS1985

Rapid adhesive bonding and field repair of aerospace materials

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process are often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid Adhesive Bonding concepts are developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens can be cut by a factor of 10 to 100 compared to standard press or autoclave bonding. The development of Rapid Adhesive Bonding for lap shear specimens (per ASTM D1002 and D3163), for aerospace panel or component bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric-matrix composite structures is reviewed. Equipment and procedures are described for bonding and repairing thin sheets, simple geometries, and honeycomb core panels.

Stein, B. A.↗

NASA NTRS1985

Evaluation of a high temperature adhesive for fabricating graphite/PMR-15 polyimide structures

Tests are conducted to measure shear strength, shear modulus and flatwise tensile strength of the A7F (amide-imide modified LARC-13) adhesive system. An investigation is also conducted to determine the effect of geometric material parameters, and elevated temperature on the static strength of standard joints. Single-lap and double-lap composite joints, and single, double and step lap composite to metal joints are characterized. A series of advanced joints consisting of preformed adherends, adherends with scalloped edges and joints with hybrid interface plies are tested and compared to baseline single and double-lap designs.

Hill, S. G.↗

NASA NTRS1986

Mode 1 delamination growth in adhesively bonded joints under static and fatigue loads

The objective of this investigation was to characterize the pure mode 1 delamination growth in metal to metal adhesively bonded joints under static and fatigue loading conditions, using FM 73 adhesive. Double cantilever beam specimens (DCB) were used for pure mode 1 tests. Aluminum 2024-T3 adherends were bonded with FM 73 adhesive. Delamination was introduced during fabrication by inserting a Teflon film between the two adherends. The mode 1 strain energy release rate G sub I sub c was obtained directly from static DCB tests conducted in accordance with the ASTM designation D1876-12. Constant amplitude fatigue tests on DCB specimens were conducted to determine the relationship between delamination growth rate da/dN and strain energy release rate G sub I sub c for a pure mode 1 delamination growth. It is found that the debond propagation rate in adhesive joints using FM 73 is more sensitive to errors in design load than is typical crack growth rate in metallic structures.

Biswas, S. C.↗

NASA NTRS1986

Factors influencing elastic stresses in double cantilever beam specimens

An elastic stress analysis was conducted for a double cantilever beam (DCB) specimen using finite-element methods. The purpose of this study was to identify the important parameters that influence stresses ahead of the delamination front. The study focused on an aluminum DCB specimen, typical of adhesively-bonded joints, and on a graphite/epoxy specimen representing a cocured composite. Opening mode sigma sub y stresses ahead of the crack tip were calculated and compared with those for a monolithic reference specimen. Beyond the singularity-dominated region very near the crack tip, the sigma sub y distribution was elevated compared to the monolithic case. Both the adhesive thickness and the adherend transverse (thickness-direction) stiffness were found to influence the elevation of sigma sub y. In contrast, adherend thickness and longitudinal stiffness has very little effect on this stress distribution. Estimates for adhesive yielding beyond the aluminum DCB crack tip showed that both the area and height of the plastic zone increased to a peak value for increasing adhesive thicknesses. Results from this study would provide insight for comparing data from different DCB specimens and for designing new DCB specimens.

Crews, J. H., Jr.↗

NASA NTRS1985

Equipment and techniques for rapid bonding of composites

Rapid adhesive bonding concepts have been developed at NASA Langley which employ induction heating of thermoplastic composite matrices directly along the bond line and/or adherends without heating the entire structure, the supports, and the fixtures of the bonding assembly. Short term thermal cycling and water boil exposures have shown encouraging environmental stability for these rapid bonds. These bonding techniques have been extended to continuous seam bonding of metallic and composite panels with promising results for the bonding of both like and unlike adherends; the portability of the apparatus suggests that field repairs of damaged structures are possible.

Buckley, John D.↗

NASA NTRS1988

Factors influencing elastic stresses in double cantilever beam specimens

Crews, J. H., Jr.↗

NASA NTRS1997

Comparison of the Effects of Debonds and Voids in Adhesive Joints

An analytical model is developed to compare the effects of voids an debonds on the interfacial shear stresses between the adherends and the adhesive in simple lap joints. Since the adhesive material above the debond may undergo some extension (either due to applied load or thermal expansion or both), a modified shear lag model, where the adhesive can take an extensional as well as shear deformation, is used in the analysis. The adherends take on only axial loads and act as membranes. Two coupled nondimensional differential equations are derived, and in general, five parameters govern the stress distribution in the overlap region. As expected, the major differences between the debond and the void occur for the stresses near the edge of the defect itself. Whether the defect is a debond or a void, is hardly discernible by the stresses at the overlap region. If the defect occurs precisely at or very close to either end of the overlap, however, differences of the order of 20 percent in the peak stresses can be obtained.

Rossettos, J. N.↗

NASA NTRS1997

Theoretical and Experimental Evaluation of the Bond Strength Under Peeling Loads

Reliable applications of adhesively bonded joints require understanding of the stress distribution along the bond-line and the stresses that are responsible for the joint failure. To properly evaluate factors affecting peel strength, effects of defects such as voids on the stress distribution in the overlap region must be understood. In this work, the peel stress distribution in a single lap joint is derived using a strength of materials approach. The bonded joint is modeled as Euler-Bernoulli beams, bonded together with an adhesive. which is modeled as an elastic foundation which can resist both peel and shear stresses. It is found that for certain adhesive and adherend geometries and properties, a central void with the size up to 50 percent of the overlap length has negligible effect on the peak peel and shear stresses. To verify the solutions obtained from the model, the problem is solved again by using the finite element method and by treating the adherends and the adhesive as elastic materials. It is found that the model used in the analysis not only predicts the correct trend for the peel stress distribution but also gives rather surprisingly close results to that of the finite element analysis. It is also found that both shear and peel stresses can be responsible for the joint performance and when a void is introduced, both of these stresses can contribute to the joint failure as the void size increases. Acoustic emission (AE) activities of aluminum-adhesive-aluminum specimens with different void sizes were monitored. The AE ringdown counts and energy were very sensitive and decreased significantly with the void size. It was observed that the AE events were shifting towards the edge of the overlap where the maximum peeling and shearing stresses were occurring as the void size increased.

Nayeb-Hashemi, Hamid↗