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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS2001

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗
NASA NTRS1983

Evolution of integrated panel structural design and interfaces for PV power plants

The evolution of integrated photovoltaic (PV) panel design at ARCO Solar is discussed. Historically, framed PV modules of about 1 x 4-ft size were individually mounted in the field on fixed support structures and interconnected electrically with cables to build higher-power arrays. When ARCO Solar saw the opportunity in 1982 to marry its PV modules with state-of-the-art heliostat trackers developed by ARCO Power Systems, it became obvious that mounting individual modules was impractical. For this project, the framed modules were factory-assembled into panels and interconnected with cables before being mounted on the trackers. Since then, ARCO Solar made considerable progress and gained substantial experience in the design and fabrication of large PV panels. Constraints and criteria considered in these design activities included static and dynamic loads; assembly and transportation equipment and logistics, structural and electrical interfaces, and safety and grounding concerns.

Arnett, J. C.↗
DOE OSTI2019

A method to identify weak points of interconnection of renewable energy resources

The increasing penetration of renewable energy resources (RERs) is challenging power grid planning and operation in maintaining grid reliability. Potential power grid reliability and stability issues may arise when large-scale RERs are connected to a weak power grid. These issues may become more significant due to the mutual interactions among RERs that are interconnected electrically close through a power network. Weakness analysis based on grid strength assessment is useful for identifying the potential weak grid issues. However, when taking into account the impact of the interactions among RERs, the weakness analysis becomes computationally challenging. Different combinations of points of interconnections (POIs) of RERs may have different impacts on grid strength at each POI. Due to the combination nature, such weakness analysis may be time-consuming when identifying the weakest combination of POIs from a large number of potential candidates in realistic power grids. To address this concern, the impact of the power network structure on grid strength is analyzed in this paper. It is found that the impact mainly depends on the impedance ratios at POIs. The findings can be summarized as two criteria to develop a recursive method for fast identification of the weakest combination in this paper. The efficacy of the proposed method is demonstrated through case studies on the IEEE 39-bus system and a realistic power grid.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2016

Virtual interconnection platform initiative scoping study

Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2024

Using Co-Simulation to Model Interconnect-Scale Power Systems from Loads to Generators

Co-simulation is a modeling technique that allows analysts to combine simulation tools and their corresponding models to exchange data during run-time, allowing the creation of larger and more complex models across heterogeneous domains. HELICS is a co-simulation platform developed over the past six years that has been shown to be effective for these multi-domain analysis. Recently, a HELICS-based analysis was completed where the ERCOT electrical interconnect in the United States was modeled in high detail from bulk power system generation to individual customer loads. This model was used to evaluate a flat-rate and transactive energy tariff with integrated wholesale and retail real-time and day-ahead energy markets. This modeling allows detailed analysis showing how the operations of the power system under these tariffs impact all actors in the power system, from individual customers to bulk power system operators.

co-simulation, HELICS, transactive energy system, ↗
NASA NTRS1984

NASA welding assessment program

A long duration test was conducted for comparing various methods of attaching electrical interconnects to solar cells for near Earth orbit spacecraft. Representative solar array modules were thermally cycled for 36,000 cycles between -80 and +80 C. The environmental stress of more than 6 years on a near Earth spacecraft as it cycles in and out of the earth's shadow was simulated. Evaluations of the integrity of these modules were made by visual and by electrical examinations before starting the cycling and then at periodic intervals during the cycling tests. Modules included examples of parallel gap and of ultrasonic welding, as well as soldering. The materials and fabrication processes are state of the art, suitable for forming large solar arrays of spacecraft quality. The modules survived this extensive cycling without detectable degradation in their ability to generate power under sunlight illumination.

Stofel, E. J.↗
DOE OSTI2020

Phase I Final Technical Report on Energy-Efficient Reconfigurable Universal Accelerator Interconnect

It is well known that application specific computing systems, optimally designed and configured for a given workload, offer much higher energy-efficiency and throughput than general purpose systems. In modern computing systems, heterogeneous computing systems have emerged that exploit the energy and performance benefits of combining various different domain-specific processor architectures. Application domains such as high-performance computing and machine learning now process terabyte-sized data sets, requiring enormous processing and memory resources. These applications have very high-power consumption due to bottlenecks in the electrical interconnection between processing units. This project aims to reduce both communication energy and latency by integrating universally available accelerators with silicon photonics. It also aims to increase system throughput by exploiting emerging technologies in silicon photonic reconfigurable interconnects; this will allow the system to balance itself in real time to accommodate changes in workloads and data flows.

2.5D/3D integration↗
NASA NTRS2008

Electromagnetically Clean Solar Arrays

The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.

Stem, Theodore G.↗
NASA NTRS1984

NASA welding assessment program

A long duration test has been conducted for comparing various methods of attaching electrical interconnects to solar cells for near Earth orbit spacecraft. Representative solar array modules have been thermally cycled for 36,000 cycles between -80 and +80 C on this JPL and NASA Lewis Research Center sponsored work. This test simulates the environmental stress of more than 6 years on a near Earth spacecraft as it cycles in and out of the Earth's shadow. Evaluations of the integrity of these modules were made by visual and by electrical examinations before starting the cycling and then at periodic intervals during the cycling tests. Modules included examples of parallel gap and of ultrasonic welding, as well as soldering. The materials and fabrication processes are state of the art, suitable for forming large solar arrays of spacecraft quality. The modules survived his extensive cycling without detectable degradation in their ability to generate power under sunlight illumination.

Stofel, E. J.↗
DOE OSTI2024

Exploring the impact of multivalent substitution on high-temperature electrical conductivity in doped lanthanum chromite perovskites: An experimental and ab-initio study

Doped LaCrO 3 perovskites hold promise as robust materials for electrical interconnects and sensor applications in harsh environments. In this work, we investigated the high-temperature behavior of La 1–x Sr x CrO 3 , La 1–x Ca x CrO 3 and La 0.8 Sr 0.2 Cr 1-x Mn x O3 (0.1 ≤ x ≤ 0.4) through a combination of computational modeling and physical characterization up to 1500 °C. Crystalline structural properties were determined and compared with ab-initio calculations, which demonstrated excellent agreement with experimental findings. High-temperature electrical conductivity measurements were performed under different atmospheres. Calcium and strontium/manganese co-doped lanthanum chromites exhibited typical semiconductor exponential trends and conductivity showed proportional correlation with substitutions levels up to 30 %. The DFT modelling was completed up to 1500 °C, including low and high temperature chromite phases and oxygen vacancies insertion. Calculations were correlated with experimental electrical properties. This work expands the understanding of doped lanthanum chromites and paves the way for the development of materials suitable for demanding high-temperature applications.

20 FOSSIL-FUELED POWER PLANTS↗
NASA NTRS1976

Solar cell array design handbook, volume 1

Twelve chapters discuss the following: historical developments, the environment and its effects, solar cells, solar cell filters and covers, solar cell and other electrical interconnections, blocking and shunt diodes, substrates and deployment mechanisms, material properties, design synthesis and optimization, design analysis, procurement, production and cost aspects, evaluation and test, orbital performance, and illustrative design examples. A comprehensive index permits rapid locating of desired topics. The handbook consists of two volumes: Volume 1 is of an expository nature while Volume 2 contains detailed design data in an appendix-like fashion. Volume 2 includes solar cell performance data, applicable unit conversion factors and physical constants, and mechanical, electrical, thermal optical, magnetic, and outgassing material properties. Extensive references are provided.

Rauschenbach, H. S.↗
DOE OSTI2022

Synchronization in electric power networks with inherent heterogeneity up to 100% inverter-based renewable generation

The synchronized operation of power generators is the foundation of electric power network stability and a key to the prevention of undesired power outages and blackouts. Here, we derive the conditions that guarantee synchronization in power networks with inherent generator heterogeneity when subjected to small perturbations, and perform a parametric sensitivity analysis to understand synchronization with varied types of generators. As inverter-based resources, which are the primary interfacing technology for many renewable sources of energy, have supplanted synchronous generators in ever growing numbers, the center of attention on associated integration challenges have resided primarily on the role of declining system inertia. Our results instead highlight the critical role of generator damping in achieving a stable state of synchronization. Additionally, we report the feasibility of operating interconnected electric grids with up to 100% power contribution from inverter-based renewable generation technologies. Our study has important implications as it sets the basis for the development of advanced control architectures and grid optimization methods that ensure synchronization and further pave the path towards the decarbonization of the electric power sector.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2018

Basic Research Needs for Microelectronics: Report of the Office of Science Workshop on Basic Research Needs for Microelectronics, October 23 – 25, 2018

Moore’s Law — realized via a combination of device physics advances, technology investments, and economic returns— allowed the number of transistors on a chip to double roughly every two years for over five decades. During those five decades, the cost of a unit of computing dropped by eight orders of magnitude. Those declines and the associated computing advances have dramatically affected every aspect of society, from science and technology through business and health to national security. Today, further computing advances are limited by the economics of chip fabrication and the physical limits on transistors, electrical interconnects, and memory elements at the nanoscale. If we are to evolve new generations of computing systems over the next decades that are both faster and more energy efficient, a complete reorganization of the science and technology underlying computing is needed. Within the Department of Energy’s (DOE’s) mission, which includes a pivotal and historical role in the evolution of computing, the needs are critical as well. Advanced computing and simulation underpin all aspects of DOE missions in energy, the environment, and national security, requiring energy-efficient computing beyond the exascale range. Edge computing, low-power computing technologies, and computers optimized for artificial intelligence are key to next-generation scientific facilities for high-energy physics research, as well as neutron and x-ray facilities. Finally, microelectronics will also play a major role in reshaping the U.S. electricity grid: from its current state to one that is cleaner, more efficient, cyber-secure, and resilient to widespread events, both natural and manmade. Realizing this vision will require advancements in both system architecture and power electronics. To enable continued advances in computing technologies, a fundamental rethinking is needed of the science behind the materials, synthesis and placement technologies, architectures, and algorithms. This cannot be modular and linear, as it has been in the past. Rather, these advances must be developed collectively, in a spirit of co-design, where each scientific discipline informs and engages the other to achieve orders of magnitude improvements in system-level performance. To explore these challenges, the Office of Science convened a Basic Research Needs Workshop for Microelectronics in October 2018 and charged workshop participants to conduct a thorough assessment of the scientific issues associated with advanced microelectronics technologies for applications relevant to the DOE mission. The workshop examined research relevant to the extension of complementary metal oxide semiconductor (CMOS) and beyond CMOS technologies; however, topics of direct relevance to quantum information science and quantum computing were outside the scope of this workshop.

42 ENGINEERING↗
NASA NTRS1993

Micro-opto-mechanical devices and systems using epitaxial lift off

The integration of high quality, single crystal thin film gallium arsenide (GaAs) and indium phosphide (InP) based photonic and electronic materials and devices with host microstructures fabricated from materials such as silicon (Si), glass, and polymers will enable the fabrication of the next generation of micro-opto-mechanical systems (MOMS) and optoelectronic integrated circuits. Thin film semiconductor devices deposited onto arbitrary host substrates and structures create hybrid (more than one material) near-monolithic integrated systems which can be interconnected electrically using standard inexpensive microfabrication techniques such as vacuum metallization and photolithography. These integrated systems take advantage of the optical and electronic properties of compound semiconductor devices while still using host substrate materials such as silicon, polysilicon, glass and polymers in the microstructures. This type of materials optimization for specific tasks creates higher performance systems than those systems which must use trade-offs in device performance to integrate all of the function in a single material system. The low weight of these thin film devices also makes them attractive for integration with micromechanical devices which may have difficulty supporting and translating the full weight of a standard device. These thin film devices and integrated systems will be attractive for applications, however, only when the development of low cost, high yield fabrication and integration techniques makes their use economically feasible. In this paper, we discuss methods for alignment, selective deposition, and interconnection of thin film epitaxial GaAs and InP based devices onto host substrates and host microstructures.

Camperi-Ginestet, C.↗
DOE OSTI2024

Establishing Co‐Continuous Network of Conjugated Polymers and Elastomers for High‐Performance Polymer Solar Cells with Extreme Stretchability

High power conversion efficiency (PCE) and mechanical robustness are prerequisites for wearable applications of organic solar cells (OSCs). However, stretchability of present active systems (i.e., crack-onset strain (COS) < 30%) should be improved. While introducing elastomers into active systems is considered a simple method for improving stretchability, the inclusion of elastomers typically results in a decrease in PCE of the OSC with a limited enhancement in the stretchability due to lack of interconnected electrical and mechanical pathways. In this study, it is developed efficient and intrinsically stretchable (IS)-OSCs with exceptional mechanical robustness, by constructing co-continuous networks of conjugated polymers (D18) and elastomers (SEBS) within active layers. It is demonstrated that the blend film with a specific ratio (40:60 w/w) of D18:SEBS is crucial for forming co-continuous structures, establishing well-connected mechanical and electrical channels. Consequently, D18 0.4 :SEBS 0.6 /L8-BO OSCs achieve 16-times higher stretchability (COS = 126%) than the OSCs based on D18/L8-BO (COS = 8%), while achieving 4-times higher PCE (12.13%) compared to the OSCs based on SEBS-rich active layers (D18 0.2 :SEBS 0.8 /L8-BO, PCE = 3.15%). Furthermore, D18 0.4 :SEBS 0.6 -based IS-OSCs preserve 86 and 90% of original PCEs at 50% strain and after 200 stretching/releasing cycles with 15% strain, respectively, demonstrating the highest mechanical robustness among reported IS-OSCs.

14 SOLAR ENERGY↗
DOE OSTI2019

Sensitivity of Western U.S. power system dynamics to droughts compounded with fuel price variability

The energy sector is heavily dependent on surface water availability for reliable electricity generation. Power system operations are usually evaluated through system reliability and economic perspectives, with assumptions based on market prices and normal water availability. As natural gas technologies continue to dominate new thermal capacity, replacing retiring coal and nuclear generators, natural gas price stability becomes increasingly important and the impact of price volatility on grid operations must be understood. Here, we explore the range of Western Electricity Coordinating Council (WECC) regional power operations, which represents the electric interconnection over the western half of the continental United States, using a production cost model driven by different fuel prices and an integrated hydrology model to simulate historical water availability. Our results show system-wide operation costs increasing in drought years or when gas prices increase, as expected. In addition, we found those system-wide increases can be of the same magnitude. Regional analysis of the responses to compounded droughts and price volatility highlight differences in magnitude and direction depending on regional generation technology portfolios. The Pacific Northwest is most sensitive to drought conditions, Southern California is most sensitive to gas prices, and the Desert Southwest is sensitive to both with the same magnitude. This analysis motivates further research in combined hydrology and power system modeling to characterize regional dynamics and associated uncertainties across scales, which is an important underpinning for the development of more resilient energy and water systems.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
DOE OSTI2018

Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain

Highlights: • A single-targeted Cu{sub 6}Sn{sub 5} grain adjacent to Sn-rich sites and Cu{sub 3}Sn was investigated using HVTEM. • Phase transformation from hexagonal to monoclinic in a single-targeted Cu{sub 6}Sn{sub 5} grains. • A time-temperature transformation (TTT) diagram was constructed using the HVTEM results. - Abstract: Cu{sub 6}Sn{sub 5} is an important intermetallic for electric interconnects and anode material of Li-ion batteries, with a polymorphic transformation from hexagonal eta-Cu{sub 6}Sn{sub 5} at temperatures higher than 186 °C to monoclinic eta′-Cu{sub 6}Sn{sub 5} at lower temperatures. The polymorphic transformation of Cu{sub 6}Sn{sub 5} has the potential to generate internal stresses in soldered joints during both the soldering process and subsequent device operation involving thermal cycling. Here we developed a systematic method to characterise the polymorphic transformations at localised points in a single grain of Cu{sub 6}Sn{sub 5} that is in intimate contact with adjacent Sn rich and Cu{sub 3}Sn phases to establish a time–temperature transformation (TTT) diagram of the eta to eta′-Cu{sub 6}Sn{sub 5} transformation. The method involves in situ temperature-controlled high-voltage transmission electron microscopy (HVTEM) of a single-targeted Cu{sub 6}Sn{sub 5} grain with observation of diffraction patterns during multiple heating and cooling experiments on a 0.5 μm thick sample made by focused ion beam milling (FIB). The results are compared to previously reported powder X-ray diffraction data. It is concluded that there is good agreement between both techniques and the transformations observed in the powder are representative of those in individual grains present in polycrystalline structures. Based on the newly developed TTT, it was established that the high-temperature eta-Cu{sub 6}Sn{sub 5} could be stablised down to room temperature if the cooling rate exceeded 20 °C min{sup −1}.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Increased thermal conductivity and decreased electron–phonon coupling factor of the aluminum scandium intermetallic phase (Al 3 Sc) compared to solid solutions

Aluminum scandium alloys and their intermetallic phases have arisen as potential candidates for the next generation of electrical interconnects. Here, in this work, we measure the in-plane thermal conductivity and electron–phonon coupling factor of aluminum scandium alloy thin films deposited at different temperatures, where the temperature is used to control the grain size and volume fraction of the Al 3 Sc intermetallic phase. As the Al 3 Sc intermetallic formation increases with higher deposition temperature, we measure increasing in-plane thermal conductivity and a decrease in the electron–phonon coupling factor, which corresponds to an increase in grain size. Our findings demonstrate the role that chemical ordering from the formation of the intermetallic phase has on thermal transport.

Chemical elements↗