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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Derivation and test of elevated temperature thermal-stress-free fastener concept

Future aerospace vehicles must withstand high temperatures and be able to function over a wide temperature range. New composite materials are being developed for use in designing high-temperature lightweight structures. Due to the difference between coefficients of thermal expansion for the new composite materials and conventional high-temperature metallic fasteners, innovative joining techniques are needed to produce tight joints at all temperatures without excessive thermal stresses. A thermal-stress-free fastening technique is presented that can be used to provide structurally tight joints at all temperatures even when the fastener and joined materials have different coefficients of thermal expansion. The derivation of thermal-stress-free fasteners and joint shapes is presented for a wide variety of fastener materials and materials being joined together. Approximations to the thermal-stress-free shapes that result in joints with low-thermal-stresses and that simplify the fastener/joint shape are discussed. The low-thermal-stress fastener concept is verified by thermal and shear tests in joints using oxide-dispersion-strengthened alloy fasteners in carbon-carbon material. The test results show no evidence of thermal stress damage for temperatures up to 2000 F and the resulting joints carried shear loads at room temperature typical of those for conventional joints.

Sawyer, J. W.↗
NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗
NASA NTRS1998

Deterministic Multiaxial Creep and Creep Rupture Enhancements for CARES/Creep Integrated Design Code

High temperature and long duration applications of monolithic ceramics can place their failure mode in the creep rupture regime. A previous model advanced by the authors described a methodology by which the creep rupture life of a loaded component can be predicted. That model was based on the life fraction damage accumulation rule in association with the modified Monkman-Grant creep rupture criterion. However, that model did not take into account the deteriorating state of the material due to creep damage (e.g., cavitation) as time elapsed. In addition, the material creep parameters used in that life prediction methodology, were based on uniaxial creep curves displaying primary and secondary creep behavior, with no tertiary regime. The objective of this paper is to present a creep life prediction methodology based on a modified form of the Kachanov-Rabotnov continuum damage mechanics (CDM) theory. In this theory, the uniaxial creep rate is described in terms of sum, temperature, time, and the current state of material damage. This scalar damage state parameter is basically an abstract measure of the current state of material damage due to creep deformation. The damage rate is assumed to vary with stress, temperature, time, and the current state of damage itself. Multiaxial creep and creep rupture formulations of the CDM approach are presented in this paper. Parameter estimation methodologies based on nonlinear regression analysis are also described for both, isothermal constant stress states and anisothermal variable stress conditions This creep life prediction methodology was preliminarily added to the integrated design code CARES/Creep (Ceramics Analysis and Reliability Evaluation of Structures/Creep), which is a postprocessor program to commercially available finite element analysis (FEA) packages. Two examples, showing comparisons between experimental and predicted creep lives of ceramic specimens, are used to demonstrate the viability of Ns methodology and the CARES/Creep program.

Jadaan, Osama M.↗
NASA NTRS1980

A conceptual design study of a high temperature solar thermal receiver (added tasks 6 and 7)

The key component of this concept is a coiled tube of silicon nitride which acts as a heat exchanger appears to be ideal from the standpoint of utilizing structural ceramics at around 2500 F under severe thermal shock conditions. However the size and configuration of this coil are beyond the state of the art for fabricating such materials as silicon nitride and carbide. A two-task program to develop and demonstrate the feasibility of extruding and forming a section of thin walled silicon nitride tubing was undertaken as an addition to the original program. A promising polyvinyl butyral-based binder lubricant was identified. Fourteen full size extrusion experiments were conducted. Two trial firings of 1-1/4 turn helices were made.

Robertson, C. S.↗
NASA NTRS1987

Advanced solar receiver conceptual design study

High temperature solar dynamic Brayton and Stirling receivers are investigated as candidate electrical power generating systems for future LEO missions. These receivers are smaller and more efficient than conventional receivers, and they offer less structural complexity and fewer thermal stress problems. Use of the advanced Direct Absorption Storage Receiver allows many of the problems associated with working with high-volumetric-change phase-change materials to be avoided. A specific mass reduction of about 1/3 with respect to the baseline receiver has been realized.

Kesseli, J. B.↗
NASA NTRS1998

Flashback Arrestor for LPP, Low NOx Combustors

Lean premixed, prevaporized (LPP) high temperature combustor designs as explored for the Advanced Subsonic Transport (AST) and High Speed Civil Transport (HSCT) combustors can achieve low NO(x), emission levels. An enabling device is needed to arrest flashback and inhibit preignition at high power conditions and during transients (surge and rapid spool down). A novel flashback arrestor design has demonstrated the ability to arrest flashback and inhibit preignition in a 4.6 cm diameter tubular reactor at full power inlet temperatures (725 C) using Jet-A fuel at 0.4 less than or equal To phi less than or equal to 3.5. Several low pressure loss (0.2 to 0.4% at 30 m/s) flashback arrestor designs were developed which arrested flashback at all of the test conditions. Flame holding was also inhibited off the flash arrestor face or within the downstream tube even velocities (less than or equal to 3 to 6 m/s), thus protecting the flashback arrestor and combustor components. Upstream flow conditions influence the specific configuration based on using either a 45% or 76% upstream geometric blockage. Stationary, lean premixed dry low NO(x) gas turbine combustors would also benefit from this low pressure drop flashback arrestor design which can be easily integrated into new and existing designs.

Kraemer, Gil↗
NASA NTRS1978

Development of methodology for optimum design of structures at elevated temperatures

This paper surveys a number of activities aimed at applying optimum design techniques to structures where high temperatures are important design considerations. An improved variant of fully-stressed design (FSD), denoted thermal fully-stressed design (TFSD), is described which converges significantly faster than FSD for problems where thermal stresses are comparable in magnitude to mechanical stresses. Second, an optimality criterion is described for sizing structures subjected to temperature constraints. Simultaneous requirements on strength and temperatures are handled by two different techniques: (1) a state-of-the-art mathematical programming method and (2) the optimality criterion technique for temperature constraints combined with FSD for strength constraints. A method is described to optimize the insulation and ply thicknesses of an insulated composite panel with a time-varying temperature applied to the outer surface of the insulation and a general set of in-plane loads applied to the panel.

Adelman, H. M.↗
NASA NTRS1996

High temperature braided rope seals for static sealing applications

Achieving efficiency and performance goals of advanced aircraft and industrial systems are leading designers to implement high temperature materials such as ceramics and intermetallics. Generally these advanced materials are applied selectively in the highest temperature sections of the engine system including the combustor and high pressure turbine, amongst others. Thermal strains that result in attaching the low expansion-rate components to high expansion rate superalloy structures can cause significant life reduction in the components. Seals are being designed to both seal and to serve as compliant mounts allowing for relative thermal growths between high temperature but brittle primary structures and the surrounding support structures. Designers require high temperature, low-leakage, compliant seals to mitigate thermal stresses and control parasitic and cooling airflow between structures. NASA is developing high temperature braided rope seals in a variety of configurations to help solve these problems. This paper will describe the types of seals being developed, describe unique test techniques used to assess seal performance, and present leakage flow data under representative pressure, temperature and scrubbing conditions. Feasibility of the braided rope seals for both an industrial tube seal and a turbine vane seal application is also demonstrated.

Adams, Michael L.↗
NASA NTRS1978

Advanced solid electrolyte cell for CO2 and H2O electrolysis

A solid electrolyte cell with improved sealing characteristics was examined. A tube cell was designed, developed, fabricated, and tested. Design concepts incorporated in the tube cell to improve its sealing capability included minimizing the number of seals per cell and moving seals to lower temperature regions. The advanced tube cell design consists of one high temperature ceramic cement seal, one high temperature gasket seal, and three low temperature silicone elastomer seals. The two high temperature seals in the tube cell design represent a significant improvement over the ten high temperature precious metal seals required by the electrolyzer drum design. For the tube cell design the solid electrolyte was 8 mole percent yttria stabilized zirconium oxide slip cast into the shape of a tube with electrodes applied on the inside and outside surfaces.

Shumar, J. W.↗
NASA NTRS1993

Fuels and Combustion Technology for Advanced Aircraft Engines [Les Propergols et les Systèmes de Combustion pour les Moteurs d'Aéronefs]

The Conference Proceedings contains the 38 papers presented at the Propulsion and Energetics Panel 81st Symposium on "Fuels and Combustion Technology for Advanced Aircraft Engines" which was held from 10th-14th May 1993, in Fiuggi, Italy. The Technical Evaluation Report and the Keynote Address are included at the beginning, and discussions follow most papers. The Symposium was arranged in the following Sessions: Technology Overview Papers (2); Modelling: Pollutant Formation (4); Modelling: Combustor Design (5); High Temperature Fuels and Fuel Systems (6); Combustion Research: Performance (6); Combustion Research: Emissions (5); Fuel Atomization: Diagnostics and Modelling (5); and Combustion Research: Flowfleld and Mixing (4). The last paper is a contribution from Russia not allocated to a session. New technologies for low NOx combustors and advanced high-pressure/high temperature cycle engines result in unique problems in design and performance. There have been significant advances in modelling and diagnostics to aid the development of these technologies. The purpose of the Symposium was to bring together experts from industry, research establishments and universities to discuss fundamental and applied research in these areas as relevant to the development of advanced gas turbine engines, to exchange practical experience and to discuss the state of the art.

Fuels for aircraft↗
NASA NTRS1997

The Diagnostics of the External Plasma for the Plasma Rocket

Three regions of plasma temperature/energy are being investigated to understand fully the behavior of the plasma created by the propulsion device and the operation of the RPA. Each type of plasma has a RPA associated with it; i.e. a thermal RPA, a collimated RPA, and a high temperature RPA. Through the process of developing the thermal and collimated RPAs, the proper knowledge and experience has been gained to not only design a high temperature RPA for the plasma rocket, but to understand its operation, results, and uncertainty. After completing a literature search for, reading published papers on, and discussing the operation of the RPA with electric propulsion researchers, I applied the knowledge gained to the development of a RPA for thermal plasma. A design of a thermal RPA was made which compensates for a large Debye length and low ionized plasma. From this design a thermal RPA was constructed. It consists of an outer stainless steel casing, a phenolic insulator (outgases slightly), and stainless steel mesh for the voltage screens. From the experience and knowledge gained in the development of the thermal RPA, a RPA for collimated plasma was developed. A collimated RPA has been designed and constructed. It compensate for a smaller Debye length and much higher ionization than that existing in the thermal plasma. It is 17% of the size of the thermal RPA. A stainless steel casing shields the detector from impinging electrons and ions. An insulating material, epoxy resin, was utilized which has a negligible outgassing. This material can be molded in styrofoam and machined quite nicely. It is capable of withstanding moderately high temperatures. Attached to this resin insulator are inconel screens attached by silver plated copper wire to a voltage supply. All the work on the RPAs and thermal ion source, I performed in the University of Alabama in Huntsville's (UAH) engineering machine shop.

Karr, Gerald R.↗
NASA NTRS2001

Challenges and Opportunities in Design, Fabrication, and Testing of High Temperature Joints in Ceramics and Ceramic Composites

Ceramic joining has been recognized as an enabling technology for successful utilization of advanced ceramics and composite materials. A number of joint design and testing issues have been discussed for ceramic joints in silicon carbide-based ceramics and fiber-reinforced composites. These joints have been fabricated using an affordable, robust ceramic joining technology (ARCJoinT). The microstructure and good high temperature mechanical capability (compressive and flexural strengths) of ceramic joints in silicon carbide-based ceramics and composite materials are reported.

Singh, M.↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
NASA NTRS1980

Design and cold-air test of single-stage uncooled turbine with high work output

A solid version of a 50.8 cm single stage core turbine designed for high temperature was tested in cold air over a range of speed and pressure ratio. Design equivalent specific work was 76.84 J/g at an engine turbine tip speed of 579.1 m/sec. At design speed and pressure ratio, the total efficiency of the turbine was 88.6 percent, which is 0.6 point lower than the design value of 89.2 percent. The corresponding mass flow was 4.0 percent greater than design.

Moffitt, T. P.↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗