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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1987

Study of the production of some superconducting and magnetic materials by solidification in the drop tube and drop tower

A systematic study on the relationship between the microstructure and physical properties of several superconducting materials prepared by solidification in low gravity was conducted. Further study of the materials, such as the applications of hydrostatic pressure which is known to be an effective mean to vary the electronic structure of materials, in conjunction with the detailed microstructure analysis of the samples was also performed to better understand the low gravity effects on the enhancement of the electronic properties. Results of the studies on the directionally solidified AlInSn alloys processed in the KC-135 aircraft and immiscible GaBi alloy prepared during free fall in the Marshall Space Flight Center Drop Tower are presented.

Wu, M. K.↗
NASA NTRS2007

Spacecraft Charging in Low Temperature Environments

Spacecraft charging in plasma and radiation environments is a temperature dependent phenomenon due to the reduction of electrical conductivity in dielectric materials at low temperatures. Charging time constants are proportional to l/conductivity may become very large (on the order of days to years) at low temperatures and accumulation of charge densities in insulators in charging environments traditionally considered benign at ambient temperatures may be sufficient to produce charge densities and electric fields of concern in insulators at low temperatures. Low temperature charging is of interest because a number of spacecraft-primarily infrared astronomy and microwave cosmology observatories-are currently being design, built, and or operated at very cold temperatures on the order of 40K to 100K. This paper reviews the temperature dependence of spacecraft charging processes and material parameters important to charging as a function of temperature with an emphasis on low temperatures regimes.

Parker, Linda N.↗
NASA NTRS2007

Composite Pulse Tube

A modification of the design of the pulse tube in a pulse-tube cryocooler reduces axial thermal conductance while preserving radial thermal conductance. It is desirable to minimize axial thermal conductance in the pulse-tube wall to minimize leakage of heat between the warm and cold ends of the pulse tube. At the same time, it is desirable to maximize radial thermal conductance at the cold end of the pulse tube to ensure adequate thermal contact between (1) a heat exchanger in the form of a stack of copper screens inside the pulse tube at the cold end and (2) the remainder of the cold tip, which is the object to which the heat load is applied and from which heat must be removed. The modified design yields a low-heat-leak pulse tube that can be easily integrated with a cold tip. A typical pulse tube of prior design is either a thin-walled metal tube or a metal tube with a nonmetallic lining. It is desirable that the outer surface of a pulse tube be cylindrical (in contradistinction to tapered) to simplify the design of a regenerator that is also part of the cryocooler. Under some conditions, it is desirable to taper the inner surface of the pulse tube to reduce acoustic streaming. The combination of a cylindrical outer surface and a tapered inner surface can lead to unacceptably large axial conduction if the pulse tube is made entirely of metal. Making the pulse-tube wall of a nonmetallic, lowthermal- conductivity material would not solve the problem because the wall would not afford the needed thermal contact for the stack of screens in the cold end. The modified design calls for fabricating the pulse tube in two parts: a longer, nonmetallic part that is tapered on the inside and cylindrical on the outside and a shorter, metallic part that is cylindrical on both the inside and the outside. The nonmetallic part can be made from G-10 fiberglass-reinforced epoxy or other low-thermal-conductivity, cryogenically compatible material. The metallic part must have high thermal conductivity in the cryogenic temperature range and would typically be made of pure copper to satisfy this requirement. The metallic part is bonded to the nonmetallic part with epoxy. Copper screens are inserted in the metallic part to form the cold-end heat exchanger, then the assembled pulse tube is inserted in the cold tip.

Martin, Jerry L.↗
NASA NTRS1994

Aerogels in Space-Based Applications

Aerogel materials have two major space applications. Aerogels have already been used in Shuttle-based experiments to capture micrometeorites for earth-based investigation of the captured particles. To exploit the well-known low thermal conductivity of these materials, the use of aerogels for thermal insulation of spacecraft is under investigation. This paper will draw on published information about aerogels and other materials, and will include only noncritical technology. No discussion will be included of specific chemical processing techniques or of advanced, technologically critical concepts.

White, Susan M.↗
NASA NTRS2000

Near-Net-Shape Processing of Sintered Fibrous Ceramics Achieved

A variety of sintered fibrous ceramic (SFC) materials have been developed over the last 50 years as thermal barrier materials for reentry applications. SFC materials typically exhibit very low thermal conductivities combined with low densities and good thermal stability up to 2500 F. These materials have flown successfully on the space shuttle orbiters since the 1960's. More recently, the McDonnell Douglas Corporation successfully used SFC tiles as a heat shield on the underside of its DC X test vehicle. For both of these applications, tiles are machined from blocks of a specific type of SFC called an alumina-enhanced thermal barrier (AETB). The sizes of these blocks have been limited by the manufacturing process. In addition, as much as 80 to 90 percent of the material can be lost during the machining of tiles with significant amounts of curvature. To address these problems, the NASA Glenn Research Center at Lewis Field entered a cooperative contract with the Boeing Company to develop a vacuum-assisted forming process that can produce large (approximately 4 square feet), severely contoured panels of AETB while saving costs in comparison to the conventional cast-and-machine billet process. For shuttle use, AETB is slurry cast, drained, and fired to form square billets conforming to the shape of the filtration box. The billets are then cut into tiles of the appropriate size for thermally protecting the space shuttle. Processing techniques have limited the maximum size of AETB billets to 21.5 square inches by 6.5-in. thick, but the space shuttles use discrete heat shield tiles no more than 8 to 12 square inches. However, in other applications, large, complex shapes are needed, and the tiling approach is undesirable. For such applications, vacuum-assisted forming can produce large parts with complex shapes while reducing machining waste and eliminating cemented joints between bonded billets. Because it allows contoured shapes to be formed, material utilization is inherently high. Initial estimates show that the amount of material lost during machining can be reduced by 50 percent or more. In addition, a fiber alignment favorable for minimum heat transfer is maintained for all panel shapes since the fibers are aligned parallel to the contoured surface of the forming tool or mold. The vacuum-assisted forming process can complete the entire forming operation in a matter of minutes and can produce multiple parts whose size is limited only by the size of the forming tool. To date, panels as large as 2 square feet have been demonstrated The vacuum-assisted forming process starts with the fabrication of a permeable forming tool, or mold, with the proper part contour. This reusable tool is mounted over an internal rib support structure, as depicted in the diagram, such that a vacuum can be pulled on the bottom portion of the tool. AETB slurry is then poured over and around the tool, liquid is drawn from the slurry, and the part forms over the tool surface. The part is then dried, fired, and finished machined. Future plans include an evaluation of the need for additional coatings and surface-toughness treatments to extend the durability and performance of this material.

Angel, Paul W.↗
NASA NTRS1987

High temperature thermoelectric energy conversion

The theory and current status of materials research for high-temperature thermoelectric energy conversion are reviewed. Semiconductors are shown to be the preferred class of materials for this application. Optimization of the figure of merit of both broadband and narrow-band semiconductors is discussed as a function of temperature. Phonon scattering mechanisms are discussed, and basic material guidelines are given for reduction of thermal conductivity. Two general classes of materials show promise for high temperature figure of merit (Z) values, namely the rare earth chalcogenides and the boron-rich borides. The electronic transport properties of the rare earth chalcogenides are explicable on the basis of degenerate or partially degenerate n-type semiconductors. Boron and boron-rich borides exhibit p-type hopping conductivity, with detailed explanations proposed for the transport differing from compound to compound. Some discussion is presented on the reasons for the low thermal conductivities in these materials. Also, ZTs greater than one appear to have been realized at high temperature in many of these compounds.

Wood, Charles↗
NASA NTRS1984

High-temperature thermoelectric energy conversion. II - Materials survey

The current status of materials research for high-temperature thermoelectric energy conversion is reviewed. Two general classes of materials show promise for high temperature figure of merit (Z) values, viz, the rare-earth chalcogenides and the boron-rich borides. The electronic transport properties of the rare-earth chalcogenides are explicable on the basis of degenerate or partially degenerate n-type semiconductors. Boron and boron-rich borides exhibit p-type hopping conductivity, with detailed explanations proposed for the transport differing from compound to compound. Some discussion is presented on the reasons for the low thermal conductivities in these materials. Also, ZTs greater than one appear to have been realized at high temperature in many of these compounds.

Wood, C.↗
NASA NTRS2009

Novel Materials Containing Single-Wall Carbon Nanotubes Wrapped in Polymer Molecules

In this design, single-wall carbon nanotubes (SWNTs) have been coated in polymer molecules to create a new type of material that has low electrical conductivity, but still contains individual nanotubes, and small ropes of individual nanotubes, which are themselves good electrical conductors and serve as small conducting rods immersed in an electrically insulating matrix. The polymer is attached through weak chemical forces that are primarily non-covalent in nature, caused primarily through polarization rather than the sharing of valence electrons. Therefore, the electronic structure of the SWNT involved is substantially the same as that of free, individual (and small ropes of) SWNT. Their high conductivity makes the individual nanotubes extremely electrically polarizable, and materials containing these individual, highly polarizable molecules exhibit novel electrical properties including a high dielectric constant.

Smalley, Richard E.↗
NASA NTRS2013

Conductive Carbon Nanotube Inks for Use with Desktop Inkjet Printing Technology

Inkjet printing is a common commercial process. In addition to the familiar use in printing documents from computers, it is also used in some industrial applications. For example, wire manufacturers are required by law to print the wire type, gauge, and safety information on the exterior of each foot of manufactured wire, and this is typically done with inkjet or laser printers. The goal of this work was the creation of conductive inks that can be applied to a wire or flexible substrates via inkjet printing methods. The use of inkjet printing technology to print conductive inks has been in testing for several years. While researchers have been able to get the printing system to mechanically work, the application of conductive inks on substrates has not consistently produced adequate low resistances in the kilohm range. Conductive materials can be applied using a printer in single or multiple passes onto a substrate including textiles, polymer films, and paper. The conductive materials are composed of electrical conductors such as carbon nanotubes (including functionalized carbon nanotubes and metal-coated carbon nanotubes); graphene, a polycyclic aromatic hydrocarbon (e.g., pentacene and bisperipentacene); metal nanoparticles; inherently conductive polymers (ICP); and combinations thereof. Once the conductive materials are applied, the materials are dried and sintered to form adherent conductive materials on the substrate. For certain formulations, increased conductivity can be achieved by printing on substrates supported by low levels of magnetic field alignment. The adherent conductive materials can be used in applications such as damage detection, dust particle removal, smart coating systems, and flexible electronic circuitry. By applying alternating layers of different electrical conductors to form a layered composite material, a single homogeneous layer can be produced with improved electrical properties. It is believed that patterning alternate layers of different conductors may improve electrical pathways through alignment of the conductors and band gap optimization. One feature of this innovation is that flexible conductive traces could be accomplished with a conductive ink having a surface resistivity of less than 10 ohms/square. Another result was that a composite material comprising a mixture of carbon nanotubes and metallic nanoparticles could be applied by inkjet printing to flexible substrates, and the resulting applied material was one to two orders of magnitude more conductive than a material made by printing inks containing carbon nanotubes alone.

Roberson, Luke↗
NASA NTRS1984

Multiple parent bodies of ordinary chondrites

Thermal histories of chondrite parent bodies are calculated from an initial state with material in a powder-like form, taking into account the effect of consolidation state on thermal conductivity. The very low thermal conductivity of the starting materials makes it possible for a small body with a radius of less than 100 km to be heated by several hundred degrees even if long-lived radioactive elements in chondritic abundances are the only source of heat. The maximum temperature is determined primarily by the temperature at which sintering of the constituent materials occurs. The thermal state of the interior of a chondrite parent body after sintering has begun is nearly isothermal. Near the surface, however, where the material is unconsolidated and the thermal conductivity is much lower, the thermal gradient is quite large. This result contradicts the conventional 'onion-shell' model of chondrite parent bodies. But because the internal temperature is almost constant through the whole body, it supports a 'multiple-parent bodies' model, according to which each petrologic type of chondrite comes from a different parent body.

Yomogida, K.↗
NASA NTRS1974

Infrared observations of Phobos from Mariner 9

Radiometric measurements of Phobos at 10 and 20 microns show that the surface is covered by a material whose conductivity is extremely low, around .000001 cal per cm per sec per deg K. It is concluded that Phobos is covered with a layer of dust at least 1 mm thick.

Gatley, I.↗
NASA NTRS2019

Interface Conductance Under a Real Electronics Box

Electronics Boxes with high heat dissipations use a thermal interface material to increase heat transfer to the radiator in a vacuum/space environment. There are lots of materials to choose from, but for Spacecraft applications, there are more than high heat transfer metrics which must be met. Contamination (both particle generation and outgassing), ease of cutting, and removal are just as important metrics in material selection. However, vendor data of material thermal conductance is usually based on a 1" X 1" piece of material under high uniform pressures. Large Electronics boxes almost never have optimal pressures, as they are bolted along the perimeter and leave gaps in the center regions. In order to characterize the relative thermal conductance for large Electronics boxes, an 8" X 8" plate was fabricated to simulate an electronics box bottom and bolted around the perimeter to a cold plate. Various thermal interface materials were inserted between the box and cold plate, and overall thermal conductance's were calculated. A table was generated which compares the full gamut of thermal interface materials for large boxes, from a dry joint to a wet joint. Materials were placed in order of high to low conductance's, so an engineer can compare the benefit of each material in a real-world scenario.

Thermal Interface Conductance↗
NASA NTRS1990

Multiple sensor multifrequency eddy current monitor for solidification and growth

A compact cylindrical multisensor eddy current measuring system with integral furnace was develop to monitor II-VI crystal growth to provide interfacial information, solutal segregation, and conductivities of the growth materials. The use of an array of sensors surrounding the furnace element allows one to monitor the volume of interest. Coupling these data with inverse multifrequency analysis allows radial conductivity profiles to be generated at each sensor position. These outputs were incorporated to control the processes within the melt volume. The standard eddy current system functions with materials whose electric conductivities are as low as 2E2 Mhos/m. A need was seen to extend the measurement range to poorly conducting media so the unit was modified to allow measurement of materials conductivities 4 order of magnitude lower and bulk dielectric properties. Typically these included submicron thick films and semiinsulating GaAs. This system was used to monitor complex heat transfer in grey bodies as well as semiconductor and metallic solidification.

Wallace, John↗
NASA NTRS1994

Electrically conductive, thermally insulating cryogenic current leads

An electrically conductive, thermally insulating current lead assembly has been developed for cryogenic systems. This lead assembly consists of thick film elements of high temperature superconductive materials deposited onto a low thermal conductivity substrate. The superconductor elements provide current transport but minimize heat transfer. The substrate provides the mechanical durability necessary for cryogenic and other environments.

Wise, Stephanie A.↗
NASA NTRS1971

Thermal conductivity and electrical resistivity of porous material

Thermal conductivity and electrical resistivity of porous materials, including 304L stainless steel Rigimesh, 304L stainless steel sintered spherical powders, and OFHC sintered spherical powders at different porosities and temperatures are reported and correlated. It was found that the thermal conductivity and electrical resistivity can be related to the solid material properties and the porosity of the porous matrix regardless of the matrix structure. It was also found that the Wiedermann-Franz-Lorenz relationship is valid for the porous materials under consideration. For high conductivity materials, the Lorenz constant and the lattice component of conductivity depend on the material and are independent of the porosity. For low conductivity, the lattice component depends on the porosity as well.

Koh, J. C. Y.↗
NASA NTRS2009

Method for Measuring Thermal Conductivity of Small Samples Having Very Low Thermal Conductivity

This paper describes the development of a hot plate method capable of using air as a standard reference material for the steady-state measurement of the thermal conductivity of very small test samples having thermal conductivity on the order of air. As with other approaches, care is taken to ensure that the heat flow through the test sample is essentially one-dimensional. However, unlike other approaches, no attempt is made to use heated guards to block the flow of heat from the hot plate to the surroundings. It is argued that since large correction factors must be applied to account for guard imperfections when sample dimensions are small, it may be preferable to simply measure and correct for the heat that flows from the heater disc to directions other than into the sample. Experimental measurements taken in a prototype apparatus, combined with extensive computational modeling of the heat transfer in the apparatus, show that sufficiently accurate measurements can be obtained to allow determination of the thermal conductivity of low thermal conductivity materials. Suggestions are made for further improvements in the method based on results from regression analyses of the generated data.

Miller, Robert A.↗
NASA NTRS1996

Growth and Some Properties of Cr(sub 11)Ge(sub 19)

Cr(sub 11)Ge(sub 19) belongs to a large family of materials known as the Nowtny chimney-ladder compounds, some of which were recently proposed as advanced thermoelectric materials because of their low thermal conductivity related to their relatively complex crystal structure. In order to assess the potential of the compound Cr(sub 11)Ge(sub 19) for thermoelectric applications, we grew large single crystals of this peritectic compound by a vertical gradient freeze technique and measured the thermoelectric properties of the crystals.

Nowotny chimney-ladder compounds thermoelectric ma↗
NASA NTRSDate not supplied

Engineering the Interface: Advanced Surface Technologies for Lunar Dust Management and Equipment Longevity

Through the Artemis program, NASA intends to develop a sustainable human foothold on the Moon, ultimately paving the way for crewed exploration of Mars. The Moon's hostile environment poses numerous obstacles, including exposure to radiation, temperature extremes, micrometeoroid threats, and particularly the persistent problem of lunar dust. Lunar dust impacts nearly every aspect of surface operations through adhesion and abrasion mechanisms, with contamination from anthropogenic activities (landing, rovers) far outweighing natural phenomena. Multiple adhesion pathways contribute to surface contamination in the lunar environment, including van der Waals forces, electrostatic forces, chemical reaction, and magnetic forces from elemental iron deposits. Sharp asperities from micrometeoroid bombardment and atmospheric absence increase interaction potential and enable mechanical interlocking. Low cohesion between dust particles exacerbates these challenges, as minimal interaction potential between dust and nearby surfaces overcomes particle cohesion, causing contamination. Lunar dust adhesion mitigation technologies can be categorized as either active, requiring external energy, or passive, relying on intrinsic material properties. Ultrasonic and electrodynamic technologies have been developed to the highest technology readiness level for active approaches. Passive strategies primarily focus on surface chemistry and topography modifications. At NASA Langley Research Center, approaches include surface migration agents to reduce surface energy, topographical modification using laser ablation patterning, and tailored surface conductivity to reduce intrinsic adhesion force. Performance has been evaluated using custom-built ultrasonic and centrifuge instruments. Plume-surface interactions from lunar landers can propel micrometer-sized particles at velocities up to 1000 m s-1.8 These particles pose risks to landers, habitats and infrastructure, leading to erosion, degradation, and reduced component lifespan. A panel recovered from Surveyor III was determined to have been severely abraded because of lunar dust displaced from the Apollo 12 lunar module that landed 160 m away. The performance of metallic surfaces has been evaluated via high velocity single particle impact using the laser-induced project impact test (LIPIT) facility at the University of Utah. Peridynamics modeling, a form of continuum mechanics that uses a nonlocal approach enabling greater simulation capabilities of crack initiation and fracture, has also been utilized to gain greater insight into material response during impact events. Lunar dust contamination challenges extend to power generation systems and moving equipment. Cables, rotation stages, and other mechanisms may experience limited range of motion and reduced lifetime due to dust infiltration. NASA Langley Research Center has evaluated traditional aerospace alloys, softgoods, wear resistant ceramics, and several polymer and polymer composite materials. Test methods have included traditional techniques like Taber abrasion testing, as well as designed test configurations developed in the DUSTE (dust, ultraviolet radiation, and space thermal environmental) chamber that reproduce mechanism functions in operational environment. Beyond laboratory experiments, several flight experiments have been conducted. Materials were exposed to the low Earth orbit environment on the Materials International Space Station Experiment (MISSE) and to the lunar surface environment through the Aegis Aerospace Regolith Adherence Characterization (RAC) payload and the Honeybee Robotics PlanetVac payload. Determining lunar dust's impact on surface exploration and habitation requires comprehensive experimental and computational capabilities combined with lessons learned from initial lunar activities. Identifying the greatest environmental challenges and developing mitigation technologies provides the clearest path toward successfully, expeditiously, and efficaciously completing NASA's mission. This presentation will discuss ongoing efforts at NASA Langley Research Center and collaborator contributions to these critical objectives.

Surface Engineering↗