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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions

A thermal interface material is one of the many tools often used as part of the thermal control scheme for space-based applications. Historically, at Marshall Space Flight Center, CHO-THERM 1671 has primarily been used for applications where an interface material was deemed necessary. However, numerous alternatives have come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and do not take into consideration other design issues, such as off-gassing, electrical conduction, isolation, etc. The purpose of this Technical Memorandum is to detail the materials tested, test apparatus, procedures, and results of these tests. The results show that there are a number of better performing alternatives now available.

Glasgow, S. D.↗
NASA NTRS2003

Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions

A thermal interface material is one of the many tools that are often used as part of the thermal control scheme for space-based applications. These materials are placed between, for example, an avionics box and a cold plate, in order to improve the conduction heat transfer so that proper temperatures can be maintained. Historically at Marshall Space Flight Center, CHO-THERM@ 1671 has primarily been used for applications where an interface material was deemed necessary. However, there have been numerous alternatives come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and they do not take into consideration other design issues such as off-gassing, electrical conduction or isolation, etc. This paper details the materials tested, test apparatus, procedures, and results of these tests.

Glasgow, Shaun↗
DOE OSTI2020

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200°C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.

47 OTHER INSTRUMENTATION↗
DOE OSTI2024

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronic modules, especially in operating temperatures greater than 150 degrees Celsius. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees Celsius to 200 degrees Celsius) conditions. In the fabrication phase of the samples, we used different stencil patterns and found out that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality than a full-area print. The paste consisted of Cu microflakes and we performed sintering using a Budatec SP300 sintering press at 275 degrees Celsius with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained digital microscope images, which revealed adhesive fracture as the dominant failure mechanism.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2022

Forum on Materials and Interfaces for Energy Storage and Conversion

This ACS Applied Materials & Interfaces forum on energy storage and conversion contains the topics of research discoveries to advance energy technology development. The topics are focused on the efficient and sustainable use of energy in the fields of fuel cells, CO 2 conversion, water splitting, batteries, and electrochemical capacitor. This forum highlights recent achievements in these emerging technologies through the design and evaluation of novel materials and devices and theoretical study. Additionally, this forum also showcases the technology at all stages of development from “embryonic” conception to industrial adaptation.

25 ENERGY STORAGE↗
DOE OSTI2023

A review on experimentally observed mechanical and microstructural characteristics of interfaces in multi-material laser powder bed fusion

Additive manufacturing (AM) is a revolutionary technology. One of the key AM categories, metal powder-based fusion processes, has many advantages compared to conventional methods for fabricating structural materials, such as permitting increased geometric complexity. While single material metal powder AM has advanced significantly in the past decade, multi-material AM is gradually attracting more attention owing to the recent breakthrough in multi-material feedstock delivery and the growing interest of fabricating functionally graded components. Multi-material AM offers an alternative route for applications that require location dependent material properties and high geometrical complexity. The AM community has invented several ways to achieve compositional gradients and discrete boundaries in two and three dimensions using mechanical spreading, nozzle-based, electrophotographic, and hybrid techniques. This article reviews the current state of laser powder bed fusion based multi-material AM of metals with focuses on the characteristics of the material interface as well as the properties and performance of the AM built functionally graded materials. We show the common challenges and issues related to material transitions, such as defects, segregation, phase separation, and the efficacy of some potential solutions including material and process optimizations. Additionally, this study evaluates the applicability and limitations of the existing testing standards and methods for measuring mechanical performance of functionally graded materials. Finally, we discuss mechanical testing development opportunities, which can help multi-material AM move towards higher technological maturity. In general, we find that the link between gradient microstructure and mechanical properties is not well understood or studied and suggest several mechanical tests that may better inform this knowledge gap.

42 ENGINEERING↗
DOE OSTI2021

Numerical Diffusion (Mixing) of Material in Numerical Simulations of Hydrodynamics [Slides]

It is often assumed that a material interface between two materials is spread over a few numerical cells in numerical simulations for hydrodynamics. Also, we have the impression that higher order methods introduce less numerical diffusion (mixing) of material. As we know one of the purposes of adaptive mesh refinement (AMR) is to resolve interfaces between materials, but we would like to know how effective AMR is to reduce numerical diffusion of material. We will present our investigation about numerical diffusion (mixing) of material in xRage. The result of the investigation indicates that the assumptions mentioned above are not always valid. In this talk, we will also demonstrate the effectiveness of numerical techniques to reduce numerical diffusion of material, including contact discontinuity steepening, isotropic interface steepening, max interface steepening, material interface reconstruct.

36 MATERIALS SCIENCE↗
NASA NTRS2003

Conducting the Heat

Heat conduction plays an important role in the efficiency and life span of electronic components. To keep electronic components running efficiently and at a proper temperature, thermal management systems transfer heat generated from the components to thermal surfaces such as heat sinks, heat pipes, radiators, or heat spreaders. Thermal surfaces absorb the heat from the electrical components and dissipate it into the environment, preventing overheating. To ensure the best contact between electrical components and thermal surfaces, thermal interface materials are applied. In addition to having high conductivity, ideal thermal interface materials should be compliant to conform to the components, increasing the surface contact. While many different types of interface materials exist for varying purposes, Energy Science Laboratories, Inc. (ESLI), of San Diego, California, proposed using carbon velvets as thermal interface materials for general aerospace and electronics applications. NASA s Johnson Space Center granted ESLI a Small Business Innovation Research (SBIR) contract to develop thermal interface materials that are lightweight and compliant, and demonstrate high thermal conductance even for nonflat surfaces. Through Phase II SBIR work, ESLI created Vel-Therm for the commercial market. Vel-Therm is a soft, carbon fiber velvet consisting of numerous high thermal conductivity carbon fibers anchored in a thin layer of adhesive. The velvets are fabricated by precision cutting continuous carbon fiber tows and electrostatically flocking the fibers into uncured adhesive, using proprietary techniques.

Source record↗
DOE OSTI2019

Emerging Electron Microscopy Techniques for Probing Functional Interfaces in Energy Materials

Abstract Interfaces play a fundamental role in many areas of chemistry. However, their localized nature requires characterization techniques with high spatial resolution in order to fully understand their structure and properties. State‐of‐the‐art atomic resolution or in situ scanning transmission electron microscopy and electron energy‐loss spectroscopy are indispensable tools for characterizing the local structure and chemistry of materials with single‐atom resolution, but they are not able to measure many properties that dictate function, such as vibrational modes or charge transfer, and are limited to room‐temperature samples containing no liquids. Here, we outline emerging electron microscopy techniques that are allowing these limitations to be overcome and highlight several recent studies that were enabled by these techniques. We then provide a vision for how these techniques can be paired with each other and with in situ methods to deliver new insights into the static and dynamic behavior of functional interfaces.

Zachman, Michael J.↗
DOE OSTI2025

Characterizing Electrode Materials and Interfaces in Solid-State Batteries

Solid-state batteries (SSBs) could offer improved energy density and safety, but the evolution and degradation of electrode materials and interfaces within SSBs are distinct from conventional batteries with liquid electrolytes and represent a barrier to performance improvement. Over the past decade, a variety of imaging, scattering, and spectroscopic characterization methods has been developed or used for characterizing the unique aspects of materials in SSBs. These characterization efforts have yielded new understanding of the behavior of lithium metal anodes, alloy anodes, composite cathodes, and the interfaces of these various electrode materials with solid-state electrolytes (SSEs). This review provides a comprehensive overview of the characterization methods and strategies applied to SSBs, and it presents the mechanistic understanding of SSB materials and interfaces that has been derived from these methods. This knowledge has been critical for advancing SSB technology and will continue to guide the engineering of materials and interfaces toward practical performance.

25 ENERGY STORAGE↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

FSISPH: An SPH formulation for impacts between dissimilar materials

Here, we present an SPH formulation with several new features designed to better model the fully-compressible interaction of dissimilar materials. We developed the new method to simulate the atmospheric entry and break-up of small celestial bodies in planetary atmospheres. The formulation uses a unity-based, density-energy discretization of the hydrodynamic conservation laws with linear-corrected kernel gradients. To account for variations in compressibility, we use an HLLC approximate Riemann solver to adjust the velocity gradient at material interfaces. To handle large transverse velocity discontinuities, we introduce a simple slip interface model that limits the artificial viscosity at material interfaces. Diffusion is optionally applied through the velocity gradient and this allows the density and specific thermal energy to evolve in a manner more consistent with the first law of thermodynamics in comparison to other more direct diffusion schemes. We also introduce a material-local second-order artificial conduction scheme used to smooth the specific thermal energy field. Material damage fits neatly under this framework by treating the damage front as a material interface. The method has been implemented as a solver, FSISPH, within the code, Spheral++, and is publicly available on github. We test our new solver on a number of classic shock, mixing, and multi-material problem. The components we outline can significantly improve accuracy of SPH for problems with sharp contact discontinuities.

79 ASTRONOMY AND ASTROPHYSICS↗
DOE OSTI2020

An Eulerian multimaterial framework for simulating high-explosive aquarium tests

Aquarium tests of cylindrical high-explosive charges provide optical data of the detonation front velocity and shape, propagation of the shock wave in the surrounding water, and expansion rates of the detonation products behind the front. Data from aquarium experiments is often used for calibration of reactive burn models based on phenomenological equations of state (EOS) and reaction rate laws. This paper presents a multimaterial numerical modeling framework to solve the 2D axisymmetric reactive Euler equations for high-explosive aquarium tests, in particular for ammonium nitrate - fuel oil (ANFO) explosives. An extension of the Ghost Fluid Method (GFM) is used to handle the dynamic material interfaces for the ANFO explosion products, the charge-confining material (polymethyl methacrylate PMMA), and the surrounding water. This study analyzes the sensitivity of calculations (both computational efficiency and numerical accuracy) to different algorithms for the material interface models including the original GFM versus Riemann solver-based strategies. A novel method for defining the left and right states in the interfacial Riemann problem eliminates the need for sorting or nodal interpolation during the projection along the material interface. Numerical tests indicate that populating the interface node values using the Riemann solution mitigate the overheating error observed in steady-state calculations. Solution convergence and computational efficiency are explored as a function of the spatial and temporal order of the schemes. Results from the computational model with analytical equations of state and fitted reaction rate parameters show very good quantitative agreement with experimentally observed detonation front velocity, reaction products expansion, and shock wave propagation in the surrounding water for a cylindrical ANFO charge encased in PMMA. Finally, the proposed modeling framework, in conjunction with experimental tests, provides a reliable tool to assess equations of state and reaction rate expressions for reactive burn models of confined high explosives.

42 ENGINEERING↗
NASA NTRS2020

Molecular Simulations of Ultrafast Radiation Induced Melting at Metal-Semiconductor Interfaces

Understanding radiation induced ultrafast melting at material interfaces is essential in designing robust electronic devices for aviation/space applications and in laser machining. While it is difficult to achieve the spatial and temporal resolution required to quantify the phenomenon experimentally, simulations can provide the detailed mechanisms of the structural changes that happen during phase transition. In this work, we use molecular simulations to study the effect of radiation damage on silicon carbide (SiC) - tungsten (W) interfaces which is of interest in high power electronics. A multi-scale approach is involved wherein the reactions at the interfaces are quantified using ab-initio molecular dynamics (MD) simulations and classical MD simulations are employed to understand the structural and diffusional changes across the material interface. Finally, coarse-grained Lennard-Jones type models are used to study the larger scale mechanisms and structures obtained due to the induced damages. We show that the response of the material to radiation damage depends on factors such as energy of the incident radiation, thermal properties, and molecular structure of the material.

Ravichandran, Ashwin↗
DOE OSTI2024

Robust 3D multi-material hydrodynamics using discontinuous Galerkin methods

A high-order discontinuous Galerkin (DG) method is presented for nonequilibrium multi-material (m ≥ 2) flow with sharp interfaces. Material interfaces are reconstructed using the algebraic THINC approach, resulting in a sharp interface resolution. The system assumes stiff velocity relaxation and pressure nonequilibrium. The presented DG method uses Dubiner's orthogonal basis functions on tetrahedral elements. This results in a unique combination of sharp multimaterial interfaces and high-order accurate solutions in smooth single-material regions. A novel shock indicator based on the interface conservation condition is introduced to mark regions with discontinuities. Slope limiting techniques are applied only in these regions so that nonphysical oscillations are eliminated while maintaining high-order accuracy in smooth regions. A local projection is applied on the limited solution to ensure discrete closure law preservation. The effectiveness of this novel limiting strategy is demonstrated for complex three-dimensional multi-material problems, where robustness of the method is critical. The presented numerical problems demonstrate that more accurate and efficient multi-material solutions can be obtained by the DG method, as compared to second-order finite volume methods.

97 MATHEMATICS AND COMPUTING↗
NASA NTRSDate not supplied

Construction of an Exact Pressure-Equilibrium Scheme for the Five-Equation Two-Phase Flow Model With Thermal Relaxation

Numerical simulation of compressible multiphase flows based on the four-equation (homogeneous relaxation) model is known to suffer from two fundamental difficulties with (a) wave propagation and (b) pressure equilibrium preservation. First, the mixture sound speed exhibits non-monotonic dependency with respect to the volume fraction, which leads to robustness issues in the resolution of shocks and acoustic wave propagation across two-phase regions. This difficulty can be mitigated by solving Allaire’s five-equation model augmented with infinitely fast phasic temperature equilibrium, from which solutions of the four-equation model can be recovered. However, when temperature is non-uniform, this augmented five-equation formulation still fails to preserve pressure equilibrium across material interfaces. In this work, we propose a fully conservative numerical scheme that exactly preserves pressure equilibrium at the discrete level for the augmented five-equation model, for arbitrary initial distributions of temperature and volume fraction. Combined with the monotonic sound speed property of the five-equation formulation, the proposed pressure-equilibrium preserving scheme significantly improves robustness in the presence of strong multiphase interactions, including shock–interface interactions and advection of material interfaces.

ESG↗