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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

FTMP - A highly reliable Fault-Tolerant Multiprocessor for aircraft

The FTMP (Fault-Tolerant Multiprocessor) is a complex multiprocessor computer that employs a form of redundancy related to systems considered by Mathur (1971), in which each major module can substitute for any other module of the same type. Despite the conceptual simplicity of the redundancy form, the implementation has many intricacies owing partly to the low target failure rate, and partly to the difficulty of eliminating single-fault vulnerability. An extensive analysis of the computer through the use of such modeling techniques as Markov processes and combinatorial mathematics shows that for random hard faults the computer can meet its requirements. It is also shown that the maintenance scheduled at intervals of 200 hr or more can be adequate most of the time.

Hopkins, A. L., Jr.↗
NASA NTRSDate not supplied

Developing Approaches for Certification of Uninspectable Fracture Critical AM Components

Introduction - Human-rated spaceflight hardware is subject to the Fracture Control requirements in NASA-STD5019, which are intended to control the risk of component failure due to undetected cracks or defects. - All hardware in this mission class is classified for Fracture Control – Exempt, Non-fracture Critical, or Fracture Critical - Fracture Critical: A classification that identifies a part where failure due to the presence of a crack is a catastrophic hazard ➔ Pressure vessels, engine components, primary structure, etc. - Axiom 1: Material and manufacturing process produce structures and components with cracks or defects. - Axiom 2: The presence of a crack or defect of sufficient size reduces the strength and life of the structure. - Damage Tolerance: demonstration that a component can survive the service life (with a safety factor) in the presence of an undetected flaw or damage. - Components are manufactured from aerospace quality materials using controlled processes. - Components are inspected for damage (cracks, flaws, defects, etc.). - Components are shown by test or analysis to be tolerant to undetected flaws.

Will Tilson↗
NASA NTRS1994

Estimating Lives Of Space Shuttle Parts

SSPOC (Space Shuttle Probabilistic Optimization Code) computer program, implements probabilistic mathematical model, accepts defined distributions of parameters controlling life of Space Shuttle main engine. Used to perform tradeoff studies to optimize between service life and acceptable level of risk, with greater accuracy. Also includes probability of removal and failure of parts, along with number of surviving parts for each interval of inspections. Written in FORTRAN 77, and user interface written in PASCAL(R).

Watkins, Tommie, Jr.↗
DOE OSTI2023

Grayscale Digital Light Processing Gradient Printing for Stress Concentration Reduction and Material Toughness Enhancement

Avoiding stress concentrations is essential to achieve robust parts since failure tends to originate at such concentrations. With recent advances in multimaterial additive manufacturing, it is possible to alter the stress (or strain) distribution by adjusting the material properties in selected locations. Here, we investigate the use of grayscale digital light processing (g-DLP) 3D printing to create modulus gradients around areas of high stress. These gradients prevent failure by redistributing high stresses (or strains) to the neighboring material. The improved material distributions are calculated using finite element analysis. The much-enhanced properties are demonstrated experimentally for thin plates with circular, triangular, and elliptical holes. In conclusion, this work suggests that multimaterial additive manufacturing techniques like g-DLP printing provide a unique opportunity to create tougher engineering materials and parts.

36 MATERIALS SCIENCE↗
NASA NTRS2008

Scintillation Breakdowns in Chip Tantalum Capacitors

Scintillations in solid tantalum capacitors are momentarily local breakdowns terminated by a self-healing or conversion to a high-resistive state of the manganese oxide cathode. This conversion effectively caps the defective area of the tantalum pentoxide dielectric and prevents short-circuit failures. Typically, this type of breakdown has no immediate catastrophic consequences and is often considered as nuisance rather than a failure. Scintillation breakdowns likely do not affect failures of parts under surge current conditions, and so-called "proofing" of tantalum chip capacitors, which is a controllable exposure of the part after soldering to voltages slightly higher than the operating voltage to verify that possible scintillations are self-healed, has been shown to improve the quality of the parts. However, no in-depth studies of the effect of scintillations on reliability of tantalum capacitors have been performed so far. KEMET is using scintillation breakdown testing as a tool for assessing process improvements and to compare quality of different manufacturing lots. Nevertheless, the relationship between failures and scintillation breakdowns is not clear, and this test is not considered as suitable for lot acceptance testing. In this work, scintillation breakdowns in different military-graded and commercial tantalum capacitors were characterized and related to the rated voltages and to life test failures. A model for assessment of times to failure, based on distributions of breakdown voltages, and accelerating factors of life testing are discussed.

Teverovsky, Alexander↗
DOE OSTI2023

Review of internal and external surface finishing technologies for additively manufactured metallic alloys components and new frontiers

Surface finishing in additive manufacturing (AM) is a technological bottleneck. The field of surface finishing of AM parts is vast because it not only focuses on roughness reduction in the hard-to-access internal surfaces but also includes the scope of adding coatings and sensors. Even though metal AM component is reaching the density and bulk microstructure at par or even better than conventionally produced components, adverse impact of surface roughness and imperfections is becoming the major obstruction. It is observed that external and internal surface roughness of AM components is a high probability cause of many unavoidable issues such as corrosion, incorrect tolerance estimations during the build stage, and the fatigue failure of parts before the expected life cycle. At present, AM field mainly focuses on improving and enhancing the internal and external surface roughness to pass the stringent qualification requirements for actual applications. To address these challenges, researchers worldwide are conducting many experiments and developing different surface finishing techniques. This paper reviews the state-of-the-art knowledge and processes of different surface finishing technology that can be applied to AM metal components. This article mainly highlights several liquid-based surfaces finishing approaches to develop promising surface microstructures on interior and exterior surfaces as a micromachining tool. The future of making strong and self-monitoring AM component requires broadening of surface finishing field and including advanced topics such as coatings and adding sensor technology. We also discuss new frontiers and the scope of future work in the surface finishing field to bring attention to related concerns and possibilities associated with making smart and strong AM components for twenty-first-century integrated engineering systems.

36 MATERIALS SCIENCE↗
NASA NTRS2011

A Piloted Evaluation of Damage Accommodating Flight Control Using a Remotely Piloted Vehicle

Toward the goal of reducing the fatal accident rate of large transport airplanes due to loss of control, the NASA Aviation Safety Program has conducted research into flight control technologies that can provide resilient control of airplanes under adverse flight conditions, including damage and failure. As part of the safety program s Integrated Resilient Aircraft Control Project, the NASA Airborne Subscale Transport Aircraft Research system was designed to address the challenges associated with the safe and efficient subscale flight testing of research control laws under adverse flight conditions. This paper presents the results of a series of pilot evaluations of several flight control algorithms used during an offset-to-landing task conducted at altitude. The purpose of this investigation was to assess the ability of various flight control technologies to prevent loss of control as stability and control characteristics were degraded. During the course of 8 research flights, data were recorded while one task was repeatedly executed by a single evaluation pilot. Two generic failures, which degraded stability and control characteristics, were simulated inflight for each of the 9 different flight control laws that were tested. The flight control laws included three different adaptive control methodologies, several linear multivariable designs, a linear robust design, a linear stability augmentation system, and a direct open-loop control mode. Based on pilot Cooper-Harper Ratings obtained for this test, the adaptive flight control laws provided the greatest overall benefit for the stability and control degradation scenarios that were considered. Also, all controllers tested provided a significant improvement in handling qualities over the direct open-loop control mode.

Cunningham, Kevin↗
NASA NTRS2000

Optoelectronic Devices with Complex Failure Modes

This part of the NSREC-2000 Short Course discusses radiation effects in basic photonic devices along with effects in more complex optoelectronic devices where the overall radiation response depends on several factors, with the possibility of multiple failure modes.

optoelectronics space radiation↗
NASA NTRS1986

System for Automated Troubleshooting

New algorithms for diagnosing problems in electromechanical systems based on artificial intelligence techniques used to locate faults with minimal human intervention. After given information on system architecture, electrical connections, types of parts, and failure modes, algorithms apply "reasoning" processes patterned after those of humans.

Friedman, L.↗
NASA NTRS2013

Discovery: Under the Microscope at Kennedy Space Center

The National Aeronautics & Space Administration (NASA) is known for discovery, exploration, and advancement of knowledge. Since the days of Leeuwenhoek, microscopy has been at the forefront of discovery and knowledge. No truer is that statement than today at Kennedy Space Center (KSC), where microscopy plays a major role in contamination identification and is an integral part of failure analysis. Space exploration involves flight hardware undergoing rigorous "visually clean" inspections at every step of processing. The unknown contaminants that are discovered on these inspections can directly impact the mission by decreasing performance of sensors and scientific detectors on spacecraft and satellites, acting as micrometeorites, damaging critical sealing surfaces, and causing hazards to the crew of manned missions. This talk will discuss how microscopy has played a major role in all aspects of space port operations at KSC. Case studies will highlight years of analysis at the Materials Science Division including facility and payload contamination for the Navigation Signal Timing and Ranging Global Positioning Satellites (NA VST AR GPS) missions, quality control monitoring of monomethyl hydrazine fuel procurement for launch vehicle operations, Shuttle Solids Rocket Booster (SRB) foam processing failure analysis, and Space Shuttle Main Engine Cut-off (ECO) flight sensor anomaly analysis. What I hope to share with my fellow microscopists is some of the excitement of microscopy and how its discoveries has led to hardware processing, that has helped enable the successful launch of vehicles and space flight missions here at Kennedy Space Center.

Howard, Philip M.↗
NASA NTRS1986

Stratified processes to analyze SSME parts and subsystems using Weibull methodology

Due to the various parts found in a Space Shuttle Main Engine (SSME), analyzation of every part is not feasible or needed. Based on previous mathematical modeling experience of high velocity cryogenic equipment, the environmental traits of location of the part, temperature range, fluid velocity, pressure range, and elevation variation of fluid flow as being significant factors were determined. Six parts categories were developed. The part categories are: (1) fuel turbomachinery, (2) oxidizer, (3) combustion devices, (4) valves, (5) ducts, and (6) lines. Due to a suspicion that superficial failure modes exist, six status codes were developed. The codes are: (1) part is in service presently, (2) part is out-of-service due to its own failure, (3) part is out-of-service due to engine (or some other part failure), (4) part is out-of-service because it's retired/obsolete (time related), (5) never fired-scrapped due to own problem or part is store, and (6) part is out-of-service for repair. It was suggested that to properly model failure behavior of SSME parts that: (1) significant factors contributing to failure must be examined, (2) relatively precision based on real life data must be examined, and (3) alternative definitions of failure must be initialized by the engineers.

Gray, Lou Allen Bell↗
NASA NTRS1971

Failure-rate computations based on Mariner Mars 1969 spacecraft data

An analysis of in-flight spacecraft part hours and failure data from the Mariner Mars 1969 Project is given. It contains failure rates computed from this data for all electronic and electromagnetic parts on the Mariners 6 and 7 spacecraft. Also included are failure rates based on combining flight data from Mariners 4,5,6, and 7.

Chelson, P. O.↗
NASA NTRS2012

Common Cause Failures and Ultra Reliability

A common cause failure occurs when several failures have the same origin. Common cause failures are either common event failures, where the cause is a single external event, or common mode failures, where two systems fail in the same way for the same reason. Common mode failures can occur at different times because of a design defect or a repeated external event. Common event failures reduce the reliability of on-line redundant systems but not of systems using off-line spare parts. Common mode failures reduce the dependability of systems using off-line spare parts and on-line redundancy.

reliability↗
NASA NTRS1978

Viking Lander reliability program

The Viking Lander reliability program is reviewed with attention given to the development of the reliability program requirements, reliability program management, documents evaluation, failure modes evaluation, production variation control, failure reporting and correction, and the parts program. Lander hardware failures which have occurred during the mission are listed.

Pilny, M. J.↗
NASA NTRS1953

Some problems on the theory of creep

The term creep of metals is applied to the phenomenon in which, at temperatures beyond a certain limit, the metal subjected to a load slowly undergoes deformation with time. For the case of steel, the creep phenomenon must be taken into account at temperatures above 400 degrees C. Very slow deformations for a prolonged period are cumulative and lead either to inadmissible changes in the dimensions of a structural part or to its failure. The theory of creep constitutes part of the mechanics of dense media and the mechanical formulation of the problem may be given as the following: a body is subjected to the action of a given system of forces, or initial displacements are prescribed on its surface. It is required to find the stress distribution in the body and the changes or its deformations with time. For the solution of the problem of creep as thus formulated, a mechanical theory of creep is required. Such theory must necessarily bear an external, overall character based, not on the investigation of microprocesses, but on the results of mechanical tests.

METALS - CREEP↗