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One of the elements of the Space Station Freedom power system is the Photovoltaic (PV) module. These modules will be assembled on-orbit during the assembly phase of the program. These modules will be assembled either from the shuttle orbiter or from the Mobile Servicing Center (MSC). The different types of assembly operations that will be used to assemble PV Modules are described.
One of the elements of the Space Station Freedom power system is the photovoltaic (PV) module. These modules will be assembled on-orbit during the assembly phase of the program. These modules will be assembled either from the Shuttle Orbiter or from the Mobile Servicing Center (MSC). The different types of assembly operations that will be used to assemble PV modules are described.
The life expectancies of Tedlar and other polymer films considered for use as cover materials in terrestrial photovoltaic (PV) modules were investigated by exposing them for more than 13,000 h on an outdoor test stand and for up to 10,000 h in several accelerated multistress environments. Visual observations and diagnostic analyses of weight and mechanical strength losses were periodically conducted to assess the nature and rate of degradation of mechanical properties and to assess the effects of film thickness and UV stabilizer content. Spectroscopic analyses of pristine and degraded materials linked weight and mechanical property losses to the underlying photothermal/photooxidation chemistry. It is shown that heavy doses of UV stabilizers prolong, while elevated temperatures shorten, the useful life of these materials; humidity plays only a minor role. The most heavily UV-stabilized films are expected to operate usefully in a PV module front-cover application for only five to ten years. The performance of none of the tested films appears consistent with the 20-30 year life goals of the PV industry.
In July of 1984, Hughes and JPL initiated a contract for Hughes to design, fabricate and test 10 thin film Amorphous Silicon (a-Si) photovoltaic power modules. These modules were to be 1 ft x 4 ft in size. They were to be preceded by the delivery of 10 a-Si 4 in. square test devices. This effort is very timely since thin film PV development has progressed to the point where intermediate load power applications are on the horizon. It is important to know if current a-Si submodule design and manufacturing processes yield a product that is compatible with the packaging needed to meet a 20 to 30 year life span expectancy. The term submodule is assigned to an interconnected assembly of 28 a-Si cells deposited on a 1 foot square glass superstrate. These assemblies are equipped with electrical terminations, i.e., copper tabs at the four corners of the inverted submodules. It is these submodules that are to be interconnected and packaged into power modules, as opposed to the interconnected individual crystalline cells packaged into todays PV modules. A discussion of the fabrication methods and results follows.
Statistical models developed to define the most likely sources of photovoltaic (PV) array failures and the optimum method of allowing for the defects in order to achieve a 20 yr lifetime with acceptable performance degradation are summarized. Significant parameters were the cost of energy, annual power output, initial cost, replacement cost, rate of module replacement, the discount rate, and the plant lifetime. Acceptable degradation allocations were calculated to be 0.0001 cell failures/yr, 0.005 module failures/yr, 0.05 power loss/yr, a 0.01 rate of power loss/yr, and a 25 yr module wear-out length. Circuit redundancy techniques were determined to offset cell failures using fault tolerant designs such as series/parallel and bypass diode arrangements. Screening processes have been devised to eliminate cells that will crack in operation, and multiple electrical contacts at each cell compensate for the cells which escape the screening test and then crack when installed. The 20 yr array lifetime is expected to be achieved in the near-term.
Electromigration as a possible thin-film module failure mechanism was investigated using several specially made, fully aluminized thin-film photovoltaic (TF-PV) modules. The effect of electromigration, as determined experimentally by measuring increases in electrical resistance across scribe lines, can be expressed as the product of a damage function, which correlates degradation rate with operating conditions such as current density and temperature, and a susceptibility function, which is defined by module design parameters, particularly aluminum purity and the configuration of the intercell region. Experimental measurements and derived acceleration factors suggest that open-circuit failure resulting from electromigration should not be a serious problem in present state-of-the-art TF-PV modules. Nevertheless, significant intercell resistance increases can result from long-term electromigration exposure, especially in future high-efficiency modules. The problem can be alleviated, however, by appropriate metallization applications and/or proper design of the intercell region.
Part of the effort of the Jet Propulsion Laboratory (JPL) Flat-Plate Solar Array Project (FSA) includes a program to improve module and array reliability. A collaborative activity with industry dealing with the problem of hot-spot heating due to the shadowing of photovoltaic cells in modules and arrays containing several paralleled cell strings is described. The use of multiparallel strings in large central-station arrays introduces the likelihood of unequal current sharing and increased heating levels. Test results that relate power dissipated, current imbalance, cross-strapping frequency, and shadow configuration to hot-spot heating levels are presented. Recommendations for circuit design configurations appropriate to central-station applications that reduce the risk of hot-spot problems are offered. Guidelines are provided for developing hot-spot tests for arrays when current imbalance is a threat.
Several statistical reliability studies have been conducted in areas of photovoltaic component design covering cell failure, interconnect fatigue, glass breakage and electrical insulation breakdown. This paper integrates the results from these various studies and draws general conclusions relative to optimal reliability features for future modules. The described analysis is based on designing for specified low levels of component failures and then controlling the degrading effects of the failures through the use of fault tolerant circuitry and module replacement. Means of selecting the cost-optimal level of component failures, circuit redundancy, and module replacement are described.
Computer program developed to estimate probabilistically total and component costs to end users of concentrating photovoltaic arrays in 1990's. Based on modified version of SIMRAND program, Simulation of Research and Development projects, -to estimate total cost of system for large number of module designs. Module design that yields minimum cost for total system then chosen as preferred design. To obtain distribution of expected module costs, simulation performed. Component estimates made by SIMRAND include efficiency of module and costs of cell, assembly of cells, lenses, and modules. Written in FORTRAN 77.
The bulk of the testing was the characterization of twenty-nine modules according to their nominal operating cell temperature (NOCT) and the effect on NOCT of changes in module design, various residential roof mounting configurations, and dirt accumulation. Other tests, often performed parallel with the NOCT measurements, evaluated the improvement in electrical performance by cooling the modules with water and by channeling the waste heat into a phase change material (wax). Electrical degradation resulting from the natural marriage of photovoltaic and solar water heating modules was also demonstrated. Cost effectiveness of each of these techniques are evaluated in light of the LSA cost goal of $0.50 per watt.
A method characterized by the steps of positioning a plurality of uniformly dimensioned photovoltaic cells in registered relation with a plurality of openings formed in a planar tool is disclosed. The method allows acess to the P contact surface of each of the cells. The steps of the method are: (1) connecting the N contact surface of alternate cells to the P contact surface of the cells interposed therebetween, (2) removing therefrom residue of solder flux, (3) applying to the N contact surfaces of the cells a transparent adhesive, (4) placing a common transparent cover plate in engaged relation with the adhesive, (5) placing a film over the circular openings for hermetically sealing the openings, and (6) establishing a vacuum between the film and the cover plate.
Tests of weathering and aging behavior are being developed to characterize the degradation and predict the lifetimes of low-cost photovoltaic arrays. Environmental factors which affect array performance include UV radiation, thermal energy, water, oxygen (generally involved in synergistic effects with UV radiation or high temperatures), physical stress, pollutants (oxides of nitrogen, sulfur dioxide and ozone), abrasives and dirt. A survey of photovoltaic array testing has shown the need to establish quantitative correlations between certain measurable properties (carbonyl formation, glass transition temperature, and molecular weight change) and modes of degradation and failure.
The environmental test requirements that have been developed for flat plate modules purchased through Department of Energy funding are described. Concurrent with the selection of the initial qualification tests from space program experience - temperature cycling and humidity - surveys of existing photovoltaic systems in the field revealed that arrays were experiencing the following failure modes: interconnect breakage, delamination, and electrical termination corrosion. These coupled with application-dependent considerations led to the development of additional qualification tests, such as cyclic pressure loading, warped mounting surface, and hail. Rationale for the selection of tests, their levels and durations is described. Comparisons between field-observed degradation and test-induced degradation show a positive correlation with some of the observed field effects. Also, the tests are proving useful for detecting design, process, and workmanship deficiencies. The status of study efforts for the development of environmental requirements for field-related problems is reviewed.
The design of a 1.2 by 2.4 m curved glass superstrate and support clip assembly is presented, along with the results of finite element computer analysis and a glass industry survey conducted to assess the technical and economic feasibility of the concept. Installed costs for four curved glass module array configurations are estimated and compared with cost previously reported for comparable flat glass module configurations. Electrical properties of candidate module encapsulation systems are evaluated along with present industry practice for the design and testing of electrical insulation systems. Electric design requirements for module encapsulation systems are also discussed.
Pertinent electrical termination attributes were identified and used in the development of selection criteria which included function, environmental durability, utility, manufacturing, code, and cost. Significant aspects of each criteria are discussed, and eight different types of terminations are ranked according to their performance in remote, residential, intermediate, and industrial applications.
Recent developments in the solar array manufacturing industry costing standards (SAMICS) are described. Consideration is given to the added capability to handle arbitrary operating schedules and the revised procedure for calculation of one-time costs. The results of an extensive validation study are summarized.
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The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.