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At least 73 records · Page 4

A Survey of Power Electronics Applications in Aerospace Technologies

The insertion of power electronics in aerospace technologies is becoming widespread. The application of semiconductor devices and electronic converters, as summarized in this paper, includes the International Space Station, satellite power system, and motor drives in 'more electric' technology applied to aircraft, starter/generators and reusable launch vehicles. Flywheels, servo systems embodying electromechanical actuation, and spacecraft on-board electric propulsion are discussed. Continued inroad by power electronics depends on resolving incompatibility of using variable frequency for 400 Hz-operated aircraft equipment. Dual-use electronic modules should reduce system development cost.

Kankam, M. David↗

Start-up Optimization Considering Integrated Power Electronic Systems

The startup of systems composed of power electronic systems is becoming more complex. As the systems grow, standard pre-configuration sequencing methods will struggle. This work proposes a linear programming optimization method to couple power electronic systems in a series of startup commands. This formulation is demonstrated in a real-time implementation on hardware.

Starke, Michael↗

Automated Design-for-Reliability of a Power Electronics Module

The design of a power electronics module is a multiphysics problem and involves electrical, thermal, and reliability targets and constraints. Although the electrical and thermal design consider multiple aspects such as materials, geometry, and energy losses, reliability design is often limited to the selection of the attachment materials and electrical interconnect types. In this paper, we incorporate reliability metrics in the design phase by investigating the impact of package geometry on the thermomechanical behavior of the die-attachment material. To this end, we conducted thermal and power cycling simulations of a commercial six-pack power module with silicon carbide devices to compute junction temperature and strain energy density per cycle, respectively. We performed multiple simulations with different geometric dimensions and established a correlation between input features and output variables using subspace-based dimension reduction. The machine learning-based dimension reduction method serves as a surrogate model, which can be employed to identify the optimal module design from a thermal and reliability standpoint.

design-for-reliability↗

A 1kV, 480V Power Electronics Hub for DER Integration in Commercial Buildings

Power electronic (PE) systems are increasingly being integrated into distribution and sub-distribution networks in support of distributed energy resource integration (DERs), electric vehicle (EV) charging (particularly in the case of fast charging infrastructure), and improvement in power quality for high performance computing and/or servers farms. This provides an opportunity to research and develop integrated PE systems that can function as single systems thereby bringing additional functionality and benefits to the overall system. The goal of this paper is to demonstrate foundational technologies and capabilities for a multiport power electronics energy hub that can intelligently coordinate and control integrated sources and loads. The focus for this digest is on a commercial building use case which is demonstrated in hardware.

Starke, Michael↗

Development of a Power Electronics Controller for the Advanced Stirling Radioisotope Generator

Under a U.S. Department of Energy program for radioisotope power systems, Lockheed Martin is developing an Engineering Unit of the Advanced Stirling Radioisotope Generator (ASRG). This is an advanced version of the previously reported SRG110 generator. The ASRG uses Advanced Stirling Convertors (ASCs) developed by Sunpower Incorporated under a NASA Research Announcement contract. The ASRG makes use of a Stirling controller based on power electronics that eliminates the tuning capacitors. The power electronics controller synchronizes dual-opposed convertors and maintains a fixed frequency operating point. The controller is single-fault tolerant and uses high-frequency pulse width modulation to create the sinusoidal currents that are nearly in phase with the piston velocity, eliminating the need for large series tuning capacitors. Sunpower supports this effort through an extension of their controller development intended for other applications. Glenn Research Center (GRC) supports this effort through system dynamic modeling, analysis and test support. The ASRG design arrived at a new baseline based on a system-level trade study and extensive feedback from mission planners on the necessity of single-fault tolerance. This paper presents the baseline design with an emphasis on the power electronics controller detailed design concept that will meet space mission requirements including single fault tolerance.

Leland, Douglas K.↗

A graphical user interface platform to support power electronic converters and integrated systems

Power Electronic Systems have grown in size and complexity over the past years. Therefore, users require interfaces to properly configure, develop, and deploy these systems. This work presents a Graphical User Interface that dynamically adapts to the system and allows the user to control and monitor its operation. This GUI uses networked communication and open-source Python libraries to allow the user to interact with the system at its different hierarchical layers, as well as visualize the interconnection of the full system. This is demonstrated by showing the user interface applied to a megawatt class charging station that consists of various energy resources.

Dean, Ben↗

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗

Electron and hole mobility of rutile GeO 2 from first principles: An ultrawide-bandgap semiconductor for power electronics

Rutile germanium dioxide (r-GeO 2 ) is a recently predicted ultrawide-bandgap semiconductor with potential applications in high-power electronic devices, for which the carrier mobility is an important material parameter that controls the device efficiency. We apply first-principles calculations based on density functional and density functional perturbation theory to investigate carrier-phonon coupling in r-GeO 2 and predict its phonon-limited electron and hole mobilities as a function of temperature and crystallographic orientation. The calculated carrier mobilities at 300 K are μ elec , ⊥ c → = 244 cm 2 V –1 s –1 , μ elec , ∥ c → = 377 cm 2 V –1 s –1 , μ hole , ⊥ c → = 27 cm 2 V –1 s –1 , and μ hole , ∥ c → = 29 cm 2 V –1 s –1 . At room temperature, carrier scattering is dominated by the low-frequency polar-optical phonon modes. The predicted Baliga figure of merit of n -type r-GeO 2 surpasses several incumbent semiconductors such as Si, SiC, GaN, and β -Ga 2 O 3 , demonstrating its superior performance in high-power electronic devices.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

A Remote Development Process and Platform for Power Electronic Systems

Like many areas in research and development, power electronic and distributed energy resource research and development slowed during the COVID pandemic. While the presence of the virus has reduced and workers are returning to shared offices, uncertainty of potential future challenges are still present. This work proposes a development and testing network that provides researchers the ability to operate remotely and coordinate control and debug activities for power electronic systems. This development and testing network has been demonstrated in both controller hardware-in-the-loop (C-HIL) and hardware testing.

Starke, Michael↗

Advanced Power Electronics and Electric Machines [Slides]

The presentation provides an overview of NREL's Advanced Power Electronics and Electric Machines (APEEM) group and its research activities. Power electronics thermal management systems for electric-drive vehicles are described and performance metrics are provided. Additionally, advanced cooling technologies developed at NREL are presented. Finally, an overview is provided for electric machine cooling, integrated drives, and thermomechanical research.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Reliability Aspects of Power-Dense Electric-Drive Power Electronics

This presentation provides a state of the art of electric-drive vehicle power electronics, and covers the APEEM Group research in thermomechanical and reliability aspects of advanced power electronics packaging. Some future directions are identified.

ADVANCED PROPULSION SYSTEMS↗

Thermal Analysis of the Advanced Modular Power Systems (AMPS) Power Electronic Modules

In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.

Modular Power Electronics↗

Analysis of Power Electronic Solutions for Wide-Range Wave Energy Input

Wave energy is a largely untapped energy source with the potential to provide 290 TWh per year to the continental United States. As a new technology, wave energy converters are less efficient and reliable compared to established energy sources, leaving the vast energy of the sea largely unutilized. Wave energy is uniquely inconsistent, with large fluctuations. Paired with harsh operating environments and difficulty in repair, the power electronics designed to harvest wave energy need to be reliable, cost-effective, and able to work in a wide operating band. The literature on existing power electronics in wave energy converters and lessons learned across other industries provide a framework of topologies to simulate. WEC-Sim, an open-source hydrodynamic platform in MATLAB Simulink developed by the National Laboratory of the Rockies, was used to simulate a wide range of power electronics under a variety of wave conditions. This paper provides a comprehensive investigation into existing wave energy power electronics converters, state-of-the-art topologies that can be applied to wave energy, and novel solutions to wave conversion.

16 TIDAL AND WAVE POWER↗

Functional models of power electronic components for system studies

A novel approach to model power electronic circuits has been developed to facilitate simulation studies of system-level issues. The underlying concept for this approach is to develop an equivalent circuit, the functional model, that performs the same functions as the actual circuit but whose operation can be simulated by using larger time step size and the reduction in model complexity, the computation time required by a functional model is significantly shorter than that required by alternative approaches. The authors present this novel modeling approach and discuss the functional models of two major power electronic components, the DC/DC converter unit and the load converter, that are being considered by NASA for use in the Space Station Freedom electric power system. The validity of these models is established by comparing the simulation results with available experimental data and other simulation results obtained by using a more established modeling approach. The usefulness of this approach is demonstrated by incorporating these models into a power system model and simulating the system responses and interactions between components under various conditions.

Tam, Kwa-Sur↗

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Effective thermal management of traction-drive power electronics is critical to the advancement of electric-drive vehicles and is necessary for increasing power density and improving reliability. Replacing traditional silicon devices with more efficient, higher temperature, higher voltage, and higher frequency wide-bandgap (WBG) devices will enable increased power density but will result in higher device heat fluxes. Compact packaging of high-temperature WBG devices near low-temperature-rated components creates thermal management challenges that need to be addressed for future power-dense systems. This paper summarizes the thermal performance of on-road automotive power electronics thermal management systems and provides thermal performance and pumping-power metrics for select vehicles. Thermal analyses reveal that the package/conduction resistance dominates the total thermal resistance (for existing automotive systems). We model advanced packaging concepts and compare the results with existing packaging designs to quantify their thermal performance enhancements. Double-side-cooled configurations that do not use thermal interface materials are package concepts predicted to provide a low junction-to-fluid thermal resistance (compared to current packages). Dielectric-fluid-cooled concepts enable a redesign of the package to reduce the package resistance, can be implemented in single- and two-phase cooling approaches, and allow for cooling of passive components (e.g., capacitors) and bus bars.

33 ADVANCED PROPULSION SYSTEMS↗

Exploring the Limits of Cooling for Extreme Heat Flux Applications: Data Centers and Power Electronic

We developed an Extreme Heat Flux Micro-cooler (EHFµ-C) capable of removing heat flux of ~1 kW/cm 2 with a small temperature rise ~10°C. This represents greater than 10× reduction in thermal resistance compared to the state-of-the-art single-phase cooling technologies (~0.5 cm 2 -°C/W) that greatly increases the efficiency, resulting in improved performance and reliability for microprocessors and power electronics. The EHFµ-Cooler utilizes liquid wicking (no pump) and thin-film evaporation in a 30 µm thick wick porous microstructure such as copper inverse opal (CIO), silicon and AlN pin fins along with a 3D manifold (copper wiremesh and silicon) with liquid routing and vapor extraction channels achieving an unprecedented vapor quality ~ >0.9. The proposed EHFµ-Cooler significantly reduces device temperature, resulting in 25-50% improvement in reliability and device performance. Based on very conservative estimates, the total energy saving for data centers due to improved performance can be 6 billion kWh/year (>$300M). Better cooling, leading to more efficient, higher performance and more reliable power electronics, would save the nation 3 Quad of primary energy in 2030. Just for automotive application, a 10% increase in fuel efficiency for SiC-based power electronics equates to >20 million gallons of fuel savings annually. The proposed EHFµ-Cooler technology ensures the United States maintains its technological lead in high-performance computing and high-power electronics, while at the same time improving the energy efficiency, and as a result reducing energy-related emissions such as greenhouse gases.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

A Flexible and Secure Evaluation Platform for Overvoltage Protection in Power Electronics Systems

This paper summarizes the fault mechanisms specifically for the overvoltage protection schemes in power electronic converters and the resulted power electronics enabled systems. A flexible and secure evaluation platform for overvoltage protection, has also been presented based on this conceptual mechanism. The proposed platform aims at testing the protection performance of distinctive overvoltage protection schemes. It would be applied to verify the effectiveness, identify potential strengths and weaknesses, and obtain the most critical protection response time to provide sufficient engineering insights for the designer. The operation principle and detailed design guideline have been presented first. The comprehensive component stress has been analyzed. An intensive set of LTSpice simulations have been conducted to show the validity of the proposed assessment approach.

Zheng, Sheng↗