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At least 73 records · Page 4

Electron and hole mobility of rutile GeO 2 from first principles: An ultrawide-bandgap semiconductor for power electronics

Rutile germanium dioxide (r-GeO 2 ) is a recently predicted ultrawide-bandgap semiconductor with potential applications in high-power electronic devices, for which the carrier mobility is an important material parameter that controls the device efficiency. We apply first-principles calculations based on density functional and density functional perturbation theory to investigate carrier-phonon coupling in r-GeO 2 and predict its phonon-limited electron and hole mobilities as a function of temperature and crystallographic orientation. The calculated carrier mobilities at 300 K are μ elec , ⊥ c → = 244 cm 2 V –1 s –1 , μ elec , ∥ c → = 377 cm 2 V –1 s –1 , μ hole , ⊥ c → = 27 cm 2 V –1 s –1 , and μ hole , ∥ c → = 29 cm 2 V –1 s –1 . At room temperature, carrier scattering is dominated by the low-frequency polar-optical phonon modes. The predicted Baliga figure of merit of n -type r-GeO 2 surpasses several incumbent semiconductors such as Si, SiC, GaN, and β -Ga 2 O 3 , demonstrating its superior performance in high-power electronic devices.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

A Remote Development Process and Platform for Power Electronic Systems

Like many areas in research and development, power electronic and distributed energy resource research and development slowed during the COVID pandemic. While the presence of the virus has reduced and workers are returning to shared offices, uncertainty of potential future challenges are still present. This work proposes a development and testing network that provides researchers the ability to operate remotely and coordinate control and debug activities for power electronic systems. This development and testing network has been demonstrated in both controller hardware-in-the-loop (C-HIL) and hardware testing.

Starke, Michael↗

Advanced Power Electronics and Electric Machines [Slides]

The presentation provides an overview of NREL's Advanced Power Electronics and Electric Machines (APEEM) group and its research activities. Power electronics thermal management systems for electric-drive vehicles are described and performance metrics are provided. Additionally, advanced cooling technologies developed at NREL are presented. Finally, an overview is provided for electric machine cooling, integrated drives, and thermomechanical research.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Reliability Aspects of Power-Dense Electric-Drive Power Electronics

This presentation provides a state of the art of electric-drive vehicle power electronics, and covers the APEEM Group research in thermomechanical and reliability aspects of advanced power electronics packaging. Some future directions are identified.

ADVANCED PROPULSION SYSTEMS↗

Analysis of Power Electronic Solutions for Wide-Range Wave Energy Input

Wave energy is a largely untapped energy source with the potential to provide 290 TWh per year to the continental United States. As a new technology, wave energy converters are less efficient and reliable compared to established energy sources, leaving the vast energy of the sea largely unutilized. Wave energy is uniquely inconsistent, with large fluctuations. Paired with harsh operating environments and difficulty in repair, the power electronics designed to harvest wave energy need to be reliable, cost-effective, and able to work in a wide operating band. The literature on existing power electronics in wave energy converters and lessons learned across other industries provide a framework of topologies to simulate. WEC-Sim, an open-source hydrodynamic platform in MATLAB Simulink developed by the National Laboratory of the Rockies, was used to simulate a wide range of power electronics under a variety of wave conditions. This paper provides a comprehensive investigation into existing wave energy power electronics converters, state-of-the-art topologies that can be applied to wave energy, and novel solutions to wave conversion.

16 TIDAL AND WAVE POWER↗

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Effective thermal management of traction-drive power electronics is critical to the advancement of electric-drive vehicles and is necessary for increasing power density and improving reliability. Replacing traditional silicon devices with more efficient, higher temperature, higher voltage, and higher frequency wide-bandgap (WBG) devices will enable increased power density but will result in higher device heat fluxes. Compact packaging of high-temperature WBG devices near low-temperature-rated components creates thermal management challenges that need to be addressed for future power-dense systems. This paper summarizes the thermal performance of on-road automotive power electronics thermal management systems and provides thermal performance and pumping-power metrics for select vehicles. Thermal analyses reveal that the package/conduction resistance dominates the total thermal resistance (for existing automotive systems). We model advanced packaging concepts and compare the results with existing packaging designs to quantify their thermal performance enhancements. Double-side-cooled configurations that do not use thermal interface materials are package concepts predicted to provide a low junction-to-fluid thermal resistance (compared to current packages). Dielectric-fluid-cooled concepts enable a redesign of the package to reduce the package resistance, can be implemented in single- and two-phase cooling approaches, and allow for cooling of passive components (e.g., capacitors) and bus bars.

33 ADVANCED PROPULSION SYSTEMS↗

Exploring the Limits of Cooling for Extreme Heat Flux Applications: Data Centers and Power Electronic

We developed an Extreme Heat Flux Micro-cooler (EHFµ-C) capable of removing heat flux of ~1 kW/cm 2 with a small temperature rise ~10°C. This represents greater than 10× reduction in thermal resistance compared to the state-of-the-art single-phase cooling technologies (~0.5 cm 2 -°C/W) that greatly increases the efficiency, resulting in improved performance and reliability for microprocessors and power electronics. The EHFµ-Cooler utilizes liquid wicking (no pump) and thin-film evaporation in a 30 µm thick wick porous microstructure such as copper inverse opal (CIO), silicon and AlN pin fins along with a 3D manifold (copper wiremesh and silicon) with liquid routing and vapor extraction channels achieving an unprecedented vapor quality ~ >0.9. The proposed EHFµ-Cooler significantly reduces device temperature, resulting in 25-50% improvement in reliability and device performance. Based on very conservative estimates, the total energy saving for data centers due to improved performance can be 6 billion kWh/year (>$300M). Better cooling, leading to more efficient, higher performance and more reliable power electronics, would save the nation 3 Quad of primary energy in 2030. Just for automotive application, a 10% increase in fuel efficiency for SiC-based power electronics equates to >20 million gallons of fuel savings annually. The proposed EHFµ-Cooler technology ensures the United States maintains its technological lead in high-performance computing and high-power electronics, while at the same time improving the energy efficiency, and as a result reducing energy-related emissions such as greenhouse gases.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

A Flexible and Secure Evaluation Platform for Overvoltage Protection in Power Electronics Systems

This paper summarizes the fault mechanisms specifically for the overvoltage protection schemes in power electronic converters and the resulted power electronics enabled systems. A flexible and secure evaluation platform for overvoltage protection, has also been presented based on this conceptual mechanism. The proposed platform aims at testing the protection performance of distinctive overvoltage protection schemes. It would be applied to verify the effectiveness, identify potential strengths and weaknesses, and obtain the most critical protection response time to provide sufficient engineering insights for the designer. The operation principle and detailed design guideline have been presented first. The comprehensive component stress has been analyzed. An intensive set of LTSpice simulations have been conducted to show the validity of the proposed assessment approach.

Zheng, Sheng↗

CONGO²: Scalable Online Anomaly Detection and Localization in Power Electronics Networks

Rapid and accurate detection and localization of electronic disturbances simultaneously are important for preventing its potential damages and determining potential remedies. Existing anomaly detection methods are severely limited by the low accuracy, the expensive computational cost and the need for highly trained personnel. There is an urgent need for a scalable online algorithm for in-field analysis of large-scale power electronics networks. Here in this paper, we propose a fast and accurate algorithm for anomaly detection and localization of power electronics networks: stratified colored-node graph (CONGO2). This algorithm hierarchically models the change of correlated waveforms and then correlated sensors using the colored-node graph. By aggregating the change of each sensor with its neighbors’ inputs, we can spontaneously identify and localize the anomaly that cannot be detected by data collected from a single sensor. As our proposed method only focuses on the changes within a short time frame, it is highly computational efficient and only needs small data storage. Thus, our method is ideal for online and reliable anomaly detection and localization of large-scale power electronic networks. Compared to existing anomaly detection methods, our method is entirely data-driven without training data, highly accurate and reliable for wide-spectrum anomalies detection, and more importantly, capable of both detection and localization. Thus, it is ideal for infield deployment for large-scale power electronic networks. As illustrated by a distributed energy resources (DERs) power grid with 37-node, our method can effectively detect and localize various cyber and physical attacks.

42 ENGINEERING↗

Modular Design of Receiver Side Power Electronics for 200 kW High Power Dynamic Wireless Charging System

Dynamic wireless power transfer (DWPT) can provide energy to EVs in motion and extend the drive range. By upscaling the charging power to 200 kW (High Power DWPT), the percentage of electrified roadway reduces and the solution becomes cost-effective. However, coil coupling-coefficient variation during vehicle movement fluctuates the transferred power which is unfavorable for vehicle battery. Secondary regulation design can smooth the power but the converter design becomes very challenging due to requirement in high power, high efficiency, fast control, as well as high power density since the unit will be onboard. This paper provides the modular design approach of a 200 kW secondary side unit to achieve high performance and scalability. The DC/DC converter using SiC devices demonstrated 98.3% efficiency.

Xue, Lincoln↗

Thermal Modeling and Limitations for Power Electronics Embedded in Medium-Voltage Cables

As next-generation energy technologies gain traction and power demand increases, the existing electrical infrastructure faces significant stress, prompting innovative solutions to enhance the grid's capacity and lifespan. This work explores the possibility of embedding medium-voltage (MV) power electronics directly inline with the cable, and the resulting thermal challenges. Since the majority of power distribution cables installed in the U.S. are passively cooled, the work focuses primarily on passive cooling, with an emphasis on the limitations of axial heat spreading within the cable. To date, literature on axial spreading of high incident heat loads on cables and cable environments is limited, typically reporting cases with <10 W of incident heat load. This work will explore the considerations, limits, and tradeoffs of cable-embedded heat loads significantly larger than the cable losses. Both external and internal effects are modeled analytically in nondimensional terms via a Biot number analysis, allowing fundamental limits and tradeoffs to be derived. The work culminates in the design and experimental validation of a cable-embedded thermal system capable of passively dissipating 300 W of heat from a coaxial SiC mosfet switch module over a length of 20 cm, thus validating the possibility of MV cable-embedded power electronics from a thermal standpoint.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Magnetic probe diagnostics of nonlinear standing waves and bulk ohmic electron power absorption in capacitive discharges

It is recognized that standing wave effects appearing in large-area, very-high-frequency capacitively coupled plasma (CCP) reactors cause center-high plasma non-uniformity. Using a high-frequency magnetic probe, we present a direct experimental diagnostic of the nonlinear standing waves and bulk ohmic electron power absorption dynamics in low pressure CCP discharges for different driving frequencies of 13.56, 30, and 60 MHz. The design, principle, calibration, and validation of the probe are described in detail. Spatial structures of the harmonics of the magnetic field, determined by the magnetic probe, were used to calculate the distributions of the harmonic current and the corresponding ohmic electron power deposition, providing insights into the behavior of nonlinear harmonics. At a low driving frequency, i.e. 13.56 MHz, no remarkable nonlinear standing waves were identified and the bulk ohmic electron power absorption was observed to be negligible. Here, the harmonic magnetic field/current was found to increase dramatically with the driving frequency, due to decreased sheath reactance and more remarkable nonlinear standing waves at a higher driving frequency, leading to the enhancements of the ohmic heating and the plasma density in the bulk, specifically at the electrode center. At a high driving frequency, i.e. 60 MHz, the high-order harmonic current density and the corresponding ohmic electron power absorption exhibited a similar node structure, with the main peak on axis, and one or more minor peaks between the electrode center and the edge, contributing to the center-high profile of the plasma density.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

β-Ga2O3-Based Heterostructures and Heterojunctions for Power Electronics: A Review of the Recent Advances

During the past decade, Gallium Oxide (Ga2O3) has attracted intensive research interest as an ultra-wide-bandgap (UWBG) semiconductor due to its unique characteristics, such as a large bandgap of 4.5–4.9 eV, a high critical electric field of ~8 MV/cm, and a high Baliga’s figure of merit (BFOM). Unipolar β-Ga2O3 devices such as Schottky barrier diodes (SBDs) and field-effect transistors (FETs) have been demonstrated. Recently, there has been growing attention toward developing β-Ga2O3-based heterostructures and heterojunctions, which is mainly driven by the lack of p-type doping and the exploration of multidimensional device architectures to enhance power electronics’ performance. This paper will review the most recent advances in β-Ga2O3 heterostructures and heterojunctions for power electronics, including NiOx/β-Ga2O3, β-(AlxGa1−x)2O3/β-Ga2O3, and β-Ga2O3 heterojunctions/heterostructures with other wide- and ultra-wide-bandgap materials and the integration of two-dimensional (2D) materials with β-Ga2O3. Discussions of the deposition, fabrication, and operating principles of these heterostructures and heterojunctions and the associated device performance will be provided. This comprehensive review will serve as a critical reference for researchers engaged in materials science, wide- and ultra-wide-bandgap semiconductors, and power electronics and benefits the future study and development of β-Ga2O3-based heterostructures and heterojunctions and associated power electronics.

Herath Mudiyanselage, Dinusha (ORCID:0000000186119↗

Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics

This paper describes the design and performance of a dielectric fluid cooling concept for automotive power electronics. The concept combines a low-thermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces). Modeling was first used to design the cooling system to maximize thermal performance and minimize pumping power. Additionally, a prototype was then fabricated, and experiments were conducted to validate the model predictions using three fluids at various fluid flow rates (16.7 cm 3 /s [1 L/min] to 68.3 cm 3 /s [4.1 L/min]) and inlet temperatures (30C and 70C). The final design was compact (120-cm 3 total volume, including heat exchanger and conceptual power modules) and cooled 12 devices (e.g., silicon carbide). The validated model was then used to predict the junction-to-fluid thermal resistance and pumping power for various conditions, including 40C fluid temperature. The results predict thermal resistance values as low as 19 mm 2 K/W are possible using the dielectric fluid cooling approach. The dielectric fluid cooling system is predicted to provide thermal resistance and pumping power values that are approximately 56% and 90% lower, respectively, compared to an automotive power electronics cooling system.

30 DIRECT ENERGY CONVERSION↗

Power Electronics Thermal Management

This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (250°C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers that will present reliability challenges and require higher-temperature substrates and bonding materials.

47 OTHER INSTRUMENTATION↗

Power Electronics Thermal Management

This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers, which will present reliability challenges and require higher-temperature substrates and bonding materials.

ADVANCED PROPULSION SYSTEMS↗

Power Electronics Manufacturing Improvements for Heavy-Duty Fuel Cell Vehicles

The Marel Power Solutions project, funded by the U.S. Department of Energy under Award DE-SC0023801, focused on advancing manufacturing techniques for power electronics in heavy-duty fuel cell vehicles. The research aimed to enhance system efficiency, reduce costs, and support broader adoption of hydrogen fuel cell technology. Key areas of investigation included power topology, thermal modeling, system architecture, and accessibility through software tools. Key Accomplishments: 1. Power Topology: - Developed an interleaved boost converter with optimized phase count, leveraging Marel’s proprietary Power Stacks. - Achieved reduced parasitic inductance and resistance, enabling high efficiency in DC-DC converters. 2. Thermal Modeling: - Integrated innovative cooling systems into compact Silicon Carbide (SiC) modules. - Simulations demonstrated the ability to dissipate significant heat (up to 7.5 kW), ensuring device reliability under heavy loads. 3. System Architecture: - Utilized simulation tools to analyze the impact of various fuel cell and vehicle parameters on efficiency. - Highlighted the role of smaller, modular improvements, such as enhanced DC-DC converters, in achieving system-wide gains. 4. Accessibility: - Evaluated and implemented MATLAB/Simulink code generation tools for real-world hardware applications. - Demonstrated the potential for rapid prototyping of custom power systems with reduced development costs. Impact and Benefits: - Efficiency and Cost Reduction: Marel’s cooling technology enhances SiC die performance, reducing the number of dies required and overall system size. - Scalability and Flexibility: The innovations support tailored solutions for diverse applications, from mass transit to mining vehicles. - Sustainability: The research promotes the integration of electrification technologies, helping meet rising energy demands sustainably. Conclusion: The project’s outcomes advance the state of power electronics for hydrogen fuel cell vehicles, enabling more efficient, compact, and cost-effective solutions. These developments lay a foundation for future innovation, contributing to the broader adoption of clean energy technologies in transportation and other industries.

08 HYDROGEN↗

Dielectric Fluids for the Direct Forced Convection Cooling of Power Electronics

The future of electrification of vehicles and other systems will require the creation of high-power density power electronics with low junction-to-fluid thermal resistance cooling solutions. One way to create this solution is to move high-heat-flux liquid cooling (single- or two-phase) as close to the power electronics components as possible. One novel approach involves submersion in dielectric fluids as the cooling solution. We first provide the range of fluid properties and develop a figure of merit (FOM) to aid in dielectric fluid selection. Next, we perform computational fluid dynamics/heat transfer (CFD/HT) modeling using single-phase cooling (submerged jet impingement on an enhanced surface) to validate the dielectric fluid FOM. Results of the study show that the developed FOM is a good representation of the performance of the fluids when compared to the results of the CFD/HT analysis. Both FOM and the CFD/HT analysis show that based on pure thermohydraulic considerations, several commercially available fluids present higher performance, on the order of 5% of water. Finally, the FOM can be used to quickly assess the thermohydraulic performance of a dielectric fluid, as well as the secondary application-specific properties such as boiling point, saturation pressure, flash point, and global warming potential, thereby allowing for fluid candidates to be readily compared.

computational fluid dynamics↗