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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1971

Development of nondestructive testing techniques for plated-through holes in multilayer printed circuit boards

The development of a nondestructive test with the capability to interrogate plated-through holes as small as 0.51 millimeters inside diameter is discussed. The system can detect defects such as holes, voids, cracks, and thin spots that reduce the current carrying capability of plates-through interconnects by 20 percent or more. Efforts were directed toward the design and fabrication of magnetic circuitry mutual coupling probes and to evaluate the effectiveness of these devices for detecting in multilayer board plated-through holes.

Anthony, P. L.↗
NASA NTRS1976

Printed-circuit solar-cell array

Flexible solar-cell array is made thinner and lighter by placing array on substrate which is a lamination of two sheets of plastic film with etched electrical connector for cells between films.

Currier, R. F.↗
NASA NTRS1983

Printed Circuit Converts RF Energy to dc Power

Ultra-light-weight, large area, antenna/rectifier has 85 percent conversion efficiency. System consists of large number of repetitive circuits called "rectenna elements." Each element produces 2 W of power, comprises half-wave dipole, input filter, and Schottky barrier dipole. Two-wire microwave transmission lines act as dc power collecting buses.

Triner, J.↗
NASA NTRS1985

Crossover Concept for Optical Printed Circuits

It is possible to reduce crosstalk between optical signals in intersecting optical conductors by taking two steps: Minimize amount of light diffracted into wrong conductor by selecting optimum conductor width, and place light traps in each conductor. How well techniques work depends in part on quality of optical conductors (partically surface smoothness) and on how closely optical-signal mode of propagation approaches ideal. Nature of signals also important: With digital signals, less crosstalk attenuation required than for analog signals.

Jamieson, R. S.↗
NASA NTRS2004

Printed Circuit Board Design (PCB) with HDL Designer

Contents include the following: PCB design with HDL designer, design process and schematic capture - symbols and diagrams: 1. Motivation: time savings, money savings, simplicity. 2. Approach: use single tool PCB for FPGA design, more FPGA designs than PCB designers. 3. Use HDL designer for schematic capture.

Winkert, Thomas K.↗
NASA NTRS2017

Printed Circuit Board Assembly for Use in Space Missions

An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.

Petrick, David J.↗
NASA NTRS2016

Printed Circuit Board Quality Assurance

PCB Assurance Summary: PCB assurance actives are informed by risk in context of the Project. Lessons are being applied across Projects for continuous improvements. Newer component technologies, smaller/high pitch devices: tighter and more demanding PCB designs: Identifying new research areas. New materials, designs, structures and test methods.

Reliability↗
NASA NTRS2019

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗
NASA NTRS1966

Process produces accurate registry between circuit board prints

Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

Source record↗