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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Direct-write printing↗
NASA NTRS2021

AIAA Ascend 2021 Conference On Demand Manufacturing of Electronics Panel Abstract

1. Session Proposal o Session Title NASA’s In Space Manufacturing and the On Demand Manufacturing of Electronics o Session Topic Primary -- Space Logistics, Autonomy, and Robotics; Secondary – Transformative Research and Technologies o Session Format: Panel Discussion. o Requested Session Duration: 60 minutes o Short Session Description: The goal of NASA’s On Demand Manufacturing of Electronics project is to develop and demonstrate the feasibility of a low-gravity, on-demand manufacturing system for flexible hybrid electronic devices on the International Space Station. This panel will feature several key collaborators and team members from the commercial sector, academia, and internal to NASA, each of which are contributing an unique and vital role to the design and implementation of this new technology system. o Extended Session Description (Please describe in detail the activity proposed, including how you intend to use the requested session duration. This session description will be provided to the reviewers for consideration and will not be displayed in the online agenda.): The session will be moderated by Curtis Hill, the Project Lead for the On Demand Manufacturing of Electronics (ODME), and he will start by giving a brief introduction to the ODME project which is working to produce a demo system for the manufacturing of electronic devices on the International Space Station. Panelists consisting of collaborators and team members to the ODME project will then give a brief (~5 min) introduction highlighting their contributions to the project, followed by time for Q&A from the audience. The panel will consist of: 1. Kenneth Church, nScrypt. nScrypt is a leader in multi-material printing with a modular system that incorporates a direct write thick film print head, a polymer fused filament fabrication print head, a laser sintering attachment, a drill head attachment for milling, and a pick and place. The system can print a layer and scan for accuracy of prints. The combination of multiple print heads and scanning allows for the on-demand production of intricate electronic components. 2. Andy Kurk, TechShot, Inc. Techshot, Inc. has collaborated extensively with NASA on the in space manufacturing of both printed electronics and fused metal materials. They are currently working to develop and integrate a test system for printed electronics, and a flight demonstration on the International Space Station is anticipated in 2024. 3. Ed Hendricks, NextFlex. NextFlex has the goal of advancing the manufacture of flexible hybrid electronics in the U.S. They are working with ODME on the development of AstroSense, an additively manufactured, wireless, flexible, and wearable health sensor. 4. Dr. Pradeep Lall, Auburn University. Professor Lall is the MacFarlane Endowed Distinguished Professor in the Department of Mechanical Engineering with a Courtesy Joint Appointment in the Department of Electrical and Computer Engineering and a Courtesy Joint Appointment in the Department of Finance. He is collaborating with NASA’s ODME project to develop multilayer printable devices and to develop techniques to test the quality of a printed electronic device. 5. Dr. Wei Gao, California Institute of Technology. Professor Gao is an Assistant Professor of Medical Engineering. His group is developing fully printed, flexible, and wearable biosensors for crew health monitoring in collaboration with NASA’s ODME project. In addition, they are working on using sweat to power biofuel cells for wearable, self-powered electronic devices. 6. Beth Paquette, NASA Goddard. The ODME branch at NASA Goddard is spearheading a sounding rocket flight demo to prove the capability of a printed electronic device with multiple sensors. In addition, they focus on thin film and flexible energy storage evaluations. o Session Goal(s)/Outcome(s): Please list the learning objectives and/or tangible outcomes (technical paper or other publication). The goal of this session is to highlight the internal and collaborative efforts of NASA’s On Demand Manufacturing of Electronics project to develop a system for printing electronics that will be tested on the International Space Station in 2024. In addition, the session with facilitate discussion with the community on the state of the art of printable electronics, current challenges, and new avenues for collaboration.

Jennifer McInnis Jones↗
NASA NTRS2017

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Additive Manufacturing↗
DOE OSTI2025

Tunable 3D Aerosol Jet Printing of Low‐Power Redox‐Gated Transistors with Multicomponent Inks

Printed hybrid electronics (PHE) offer a promising alternative for microelectronics fabrication, addressing some limitations of traditional subtractive manufacturing. Despite the versatility of PHE, particularly in the customization of printing inks, these devices have not yet matched the performance of silicon-based electronics due to challenges in gating mechanisms and operational stability. However, the potential of low-voltage redox-gating to achieve significant carrier modulations in correlated metal oxides remains unexplored in PHE. This study systematically investigates vanadium dioxide (VO 2 ) nanoparticles and redox inks, linking their organization in solution to their morphology, phase state, and properties in solid films and multilayered structures. Using an aerosol jet printer (AJP), a solid-state VO 2 transistor is fabricated, operating at just 0.4 V gating voltage. The printed VO 2 films demonstrate redox-modulated conductivity and consistent transistor behavior. The solid-state redox gating materials also provide long-term stability, with the device maintaining performance over 6000 cycles without degradation. These results highlight the potential of redox gating to enhance the application of functional nanoparticles in printed hybrid microelectronics, especially for flexible, low-voltage, and energy-efficient devices.

36 MATERIALS SCIENCE↗
NASA NTRSDate not supplied

Additive Manufacturing of Electronics for Space Applications

Additive manufacturing techniques for electronics will enable new detector and electronic assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument, and electronics concepts by printing fine feature sizes, printing on complex geometries, and allowing new concept production. This presentation summarizes efforts developing printing techniques to manufacture detectors and circuitry for two different space applications.

Additive Manufacturing↗
NASA NTRS1988

Vehicle antenna for the mobile satellite experiment

A low profile, low cost, printed circuit, electronically steered, right hand circularly polarized phase array antenna system has been developed for the Mobile Satellite Experiment (MSAT-X) Program. The success of this antenna is based upon the development of a crossed-slot element array and detailed trade-off analyses for both the phased array and pointing system design. The optimized system provides higher gain at low elevation angles (20 degrees above the horizon) and broader frequency coverage (approximately 8 1/2 percent bandwidth) than is possible with a patch array. Detailed analysis showed that optimum performance could be achieved with a 19 element array of a triangular lattice geometry of 3.9 inch element spacing. This configuration has the effect of minimizing grating lobes at large scan angles plus it improves the intersatellite isolation. The array has an aperture 20 inches in diameter and is 0.75 inch thick overall, exclusive of the RF and power connector. The pointing system employs a hybrid approach that operates with both an external rate sensor and an internal error signal as a means of fine tuning the beam acquisition and track. Steering the beam is done electronically via 18, 3-bit diode phase shifters. A nineteenth phase shifter is not required as the center element serves as a reference only. Measured patterns and gain show that the array meets the stipulated performance specifications everywhere except at some low elevation angles.

Peng, Sheng Y.↗
NASA NTRS1993

Voice-Recognition System Records Inspection Data

Main Injector Voice Activated Record (MIVAR) system acts on vocal commands and processes spoken inspection data into electronic and printed inspection reports. Devised to improve acquisition and recording of data from borescope inspections of interiors of liquid-oxygen-injecting tubes on main engine of Space Shuttle. With modifications, system used in other situations to relieve inspectors of manual recording of data. Enhances flow of work and quality of data acquired by enabling inspector to remain visually focused on workpiece.

Rochester, Larry L.↗
NASA NTRS2000

Attenuation of Weather Radar Signals Due to Wetting of the Radome by Rainwater or Incomplete Filling of the Beam Volume

A search of scientific literature, both printed and electronic, was undertaken to provide quantitative estimates of attenuation effects of rainfall on weather radar radomes. The emphasis was on C-band (5 cm) and S-Band (10 cm) wavelengths. An empirical model was developed to estimate two-way wet radome losses as a function of frequency and rainfall rate for both standard and hydrophobic radomes. The model fits most of the published data within +/- 1 dB at both target wavelengths for rain rates from less than ten to more than 200 mm/hr. Rainfall attenuation effects remain under 1 dB at both frequencies regardless of radome type for rainfall rates up to 10 mm/hr. S-Band losses with a hydrophobic radome such as that on the WSR-88D remain under 1 dB up to 100 mm/hr. C-Band losses on standard radomes such as that on the Patrick AFB (Air Force Base) WSR-74C can reach as much as 5 dB at 50 mm/hr. In addition, calculations were performed to determine the reduction in effective reflectivity, Z, when a radar target is smaller than the sampling volume of the radar. Results are presented for both the Patrick Air Force Base WSR-74C and the WSR-88D as a function of target size and range.

Merceret, Francis J.↗
NASA NTRS2011

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Ramesham, Rajeshuni↗
NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗
NASA NTRS2015

Pi-Sat: A Low Cost Small Satellite and Distributed Spacecraft Mission System Test Platform

Current technology and budget trends indicate a shift in satellite architectures from large, expensive single satellite missions, to small, low cost distributed spacecraft missions. At the center of this shift is the SmallSatCubesat architecture. The primary goal of the Pi-Sat project is to create a low cost, and easy to use Distributed Spacecraft Mission (DSM) test bed to facilitate the research and development of next-generation DSM technologies and concepts. This test bed also serves as a realistic software development platform for Small Satellite and Cubesat architectures. The Pi-Sat is based on the popular $35 Raspberry Pi single board computer featuring a 700Mhz ARM processor, 512MB of RAM, a flash memory card, and a wealth of IO options. The Raspberry Pi runs the Linux operating system and can easily run Code 582s Core Flight System flight software architecture. The low cost and high availability of the Raspberry Pi make it an ideal platform for a Distributed Spacecraft Mission and Cubesat software development. The Pi-Sat models currently include a Pi-Sat 1U Cube, a Pi-Sat Wireless Node, and a Pi-Sat Cubesat processor card.The Pi-Sat project takes advantage of many popular trends in the Maker community including low cost electronics, 3d printing, and rapid prototyping in order to provide a realistic platform for flight software testing, training, and technology development. The Pi-Sat has also provided fantastic hands on training opportunities for NASA summer interns and Pathways students.

Software↗
DOE OSTI2025

Impact of Synthesis and Aging on Titanium Carbide MXenes for Printed Microsystems

This work investigates the long-term electrical stability of Ti3C2Tx MXene Inks under accelerated aging conditions. Inks were synthesized from commercial MAX-Phase precursors, drop-cast onto custom PCB’s and monitored automated in-situ measurements. Samples aged at 85°C/85% RH, 85°C/0% RH and ambient conditions revealed distinct degradation trends. Wet aged inks showed rapid resistance increased while etched formulations exhibited long term stability. These findings highlight the influence of synthesis stage and environmental exposure on MXene Inks reliability, offering critical insights for printed MEMS and sensor applications. Ongoing measurements extend the aging timeline beyond prior studies, marking the longest evaluation under accelerated aging conditions to date.

Aging↗
NASA NTRS2018

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses.

Physics of Failure↗
DOE OSTI2024

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Additive manufacturing of functional devices on various rigid and flexible substrates is rising rapidly due to their design flexibility, rapid manufacturing, and lower cost. Current printing technologies are ink-based and focused on printing silver (Ag) as conductive lines due to its matured ink formulation process, low sintering temperature, ease of printing, and low oxidation rate. However, Ag is the 68th most abundant element on Earth, while copper (Cu) is the 25th, making it much cheaper (>100×) while having a comparable conductivity to Ag. Therefore, printing Cu has become technologically and economically more attractive than Ag. Nevertheless, Cu printing is still a significant challenge in ink-based printing methods due to the higher sintering temperature relative to the glass-transition temperature of most flexible substrates, the higher oxidation rate, the challenging ink formulation process, and ink stability concerns. Here, we demonstrate printing highly conductive Cu on flexible polyimide substrates using a dry printing technique. Cu nanoparticles (~3–30 nm) are generated by on-demand laser ablation of a solid Cu target inside the printer head and under argon background gas. These Cu nanoparticles are then transported through a nozzle and onto the substrate, where they are laser-sintered in real time. The argon gas plays three critical roles in laser plume condensation for nanoparticle generation, transport, and sheath gas to avoid oxidation during sintering. The sintered nanoparticles thus show high electrical conductivity and mechanical stability under static and cyclic tests. Our dry printing technique can potentially revolutionize how electronic devices and sensors are additively manufactured for earth and space applications.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS2018

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses

Electronics packaging↗
DOE OSTI2024

Precision Agriculture using Networks of Degradable Analytical Sensors (PANDAS) (Final Technical Report)

Precision agriculture, where sensing of soil, environment and crop conditions are used to precisely synchronize inputs (such as water and fertilizer) to crop needs enhances input use efficiency. This can improve yields and farm profitability while mitigating environmental losses, improving soil carbon content and substantially decreasing energy use for food, feed and fuel crops. Unfortunately, farmers are not yet able to harness the full potential of these management technologies as there is a lack of available management information, and there is therefore a need for sensors that are able to economically measure spatio-temporal variability in soil and crop properties of extremely heterogeneous farm fields precisely at high resolution and at low cost. Real-time, in-situ monitoring of agricultural soil conditions is today carried out using devices that limit the total number of nodes that can be used economically to typically one per acre or less. Higher spatio-temporal resolution sensing would enable more precise agricultural input optimization, with significant benefits to the farmer and the environment. In order to address this issue, this project focused on developing additively manufactured, biodegradable, soil sensors with predicted costs of < $\$$1 per unit to monitor crop inputs (such as water and fertilizer) that predictably, harmlessly degrade away into the soil when no longer needed. These sensor nodes should be easy to place, accurately and continuously monitor soil and crop conditions for an entire season, be read remotely using existing farm equipment, require no ongoing maintenance, not impede farm operations and produce no persistent waste. This approach could enable a >100× increase in information density over current solutions for precision farming of row and other crops, and lead to significant reductions in input energy use and provide increased yield for biofuel crops. Over the course of this project the team at the University of Colorado Boulder, University of California Berkeley, and Colorado State University/Kansas State University investigated a wide range of printable biodegradable electronic materials and sensor designs for determining soil moisture and soil nitrate concentration. These efforts expanded the available materials set for printed soil degradable electronic materials, particularly for conductors, enabling high conductivity and stability. Printed soil moisture and nitrate sensors with suitable sensitivity and selectivity were developed and characterized. Low power and passive wireless electronic systems were integrated with the soil sensors, and testing was carried out with completed sensors to understand their functionality under agricultural conditions. Additionally, other sensor types enabled by the biodegradable materials set created during this project, such as soil microbial activity sensors, were also developed and demonstrated. Project outputs include 10 peer reviewed publications, 4 patent applications, 21 technical presentations, 3 PhD thesis, 10 media reports, 8 additional grants worth over $\$$6M, and the formation of 3 start-up companies.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗