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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Applications of high thermal conductivity composites to electronics and spacecraft thermal design

Recently, high thermal conductivity continuous graphite fiber reinforced metal matrix composites (MMC's) have become available that can save much weight over present methods of heat conduction. These materials have two or three times higher thermal conductivity in the fiber direction than the pure metals when compared on a thermal conductivity to weight basis. Use of these materials for heat conduction purposes can result in weight savings of from 50 to 70 percent over structural aluminum. Another significant advantage is that these materials can be used without the plumbing and testing complexities that accompany the use of liquid heat pipes. A spinoff of this research was the development of other MMC's as electronic device heat sinks. These use particulates rather than fibers and are formulated to match the coefficient of thermal expansion of electronic substrates in order to alleviate thermally induced stresses. The development of both types of these materials as viable weight saving substitutes for traditional methods of thermal control for electronics packaging and also for spacecraft thermal control applications are the subject of this report.

Sharp, G. Richard↗
NASA NTRS1999

Two Phase Technology Development Initiatives

Three promising thermal technology development initiatives, vapor compression thermal control system, electronics cooling, and electrohydrodynamics applications are outlined herein. These technologies will provide thermal engineers with additional tools to meet the thermal challenges presented by increased power densities and reduced architectural options that will be available in future spacecraft. Goddard Space Flight Center and the University of Maryland are fabricating and testing a 'proto- flight' vapor compression based thermal control system for the Ultra Long Duration Balloon (ULDB) Program. The vapor compression system will be capable of transporting approximately 400 W of heat while providing a temperature lift of 60C. The system is constructed of 'commercial off-the-shelf' hardware that is modified to meet the unique environmental requirements of the ULDB. A demonstration flight is planned for 1999 or early 2000. Goddard Space Flight Center has embarked upon a multi-discipline effort to address a number of design issues regarding spacecraft electronics. The program addressed the high priority design issues concerning the total mass of standard spacecraft electronics enclosures and the impact of design changes on thermal performance. This presentation reviews the pertinent results of the Lightweight Electronics Enclosure Program. Electronics cooling is a growing challenge to thermal engineers due to increasing power densities and spacecraft architecture. The space-flight qualification program and preliminary results of thermal performance tests of copper-water heat pipes are presented. Electrohydrodynamics (EHD) is an emerging technology that uses the secondary forces that result from the application of an electric field to a flowing fluid to enhance heat transfer and manage fluid flow. A brief review of current EHD capabilities regarding heat transfer enhancement of commercial heat exchangers and capillary pumped loops is presented. Goddard Space Flight Center research efforts applying this technique to fluid management and fluid pumping are discussed.

Didion, Jeffrey R.↗
NASA NTRS1997

The Interplay of Surface Mount Solder Joint Quality and Reliability of Low Volume SMAs

Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. JPL has recently completed an extensive study, funded by NASA's code Q, of the interplay between manufacturing defects and reliability of ball grid array (BGA) and surface mount electronic components.

Spacecraft electronics electronic assemblies J-lea↗
NASA NTRS2003

On the Utilization of In-flight Radiation-induced Performance Data and Anomaly Resolution of Commercial Off the Shelf (COTS) Electronics

This viewgraph presentation presents an overview of the use of in-flight science data to review the radiation effects on commercial off the shelf (COTS) electronics used in recent spacecraft missions. The authors review the hazards that the space radiation environment pose for spacecraft electronics. They specifically discuss long term effects such as total ionizing dose (TID) and short term effects like single particle events (SEE). The advantages of using COTS electronics despite not being radiation hardened are mentioned. The reasons cite for tracking in-flight performance of COTS electronics include: anomaly resolution, validate ground tests and environmental predictions and provide lessons for future designers. Sample radiation impacts of science data from the following missions are analyzed: SOHO/LASCO 3 Coronograph, Microwave Anisotrophy Probe, Hubble Space Telescope and Chandra X-Ray Observatory.

Kenneth A. LeBel↗
NASA NTRS2004

Electronics packaging considerations for space applications

The functionality of spacecraft electronics must be maintained in the harsh environments found in space. The radiation environments can consist of either low-energy x-rays at the surface of the spacecraft or high-energy electrons, high-energy protons and high-energy photons withn the spacecraft.

electronics packaging↗
NASA NTRS1977

Pioneer Venus spacecraft charging model

Five environmental models were constructed to represent the solar wind and the upper, middle, and lower ionosphere of Venus. The spacecraft structure was modeled with over 140 passive electrical elements representing structural elements of the spacecraft. Electron, ion, secondary electron, and photocurrents to the spacecraft from the plasma were calculated, ignoring sheath effects. In all but one case, potentials of interest were less than 1 volt. Potential differences between widely separated points on the equipment shelf were less than 1 mV. The one area of concern is the solar panel potential when the orbiter is passing through the bowshock region.

Robinson, P. A., Jr.↗
NASA NTRS1996

Quality and Reliability of BGA and SMT Components

Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. More than 400 test vehicles were assembled using ceramic and plastic ball grid arrays (BGAs), LCCs, J-leads, and gull wing components.

BGA components SMT components BGA SMT spacecraft e↗