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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

MEMS Rate Sensors for Space

Micromachined Electro Mechanical System (MEMS) Rate Sensors are an enabling technology for Nanosatellites. The recent award of a Nanosatellite program to the Goddard Space Flight Center (GSFC) underscores the urgency of the development of these systems for space use. The Guidance Navigation and Control Center (GNCC) at the GSFC is involved in several efforts to develop this technology. The GNCC seeks to improve the performance of these sensors and develop flight ready systems for spacecraft use by partnering with industry leaders in MEMS Rate Sensor development. This paper introduces Microgyros and discusses the efforts in progress at the GNCC to improve the performance of these units and develop MEMS Rate Sensors for space use.

Gambino, Joel↗
NASA NTRS2006

Tuning of MEMS Gyroscope using Evolutionary Algorithm and "Switched Drive-Angle" Method

We propose a tuning method for Micro-Electro-Mechanical Systems (MEMS) gyroscopes based on evolutionary computation that has the capacity to efficiently increase the sensitivity of MEMS gyroscopes through tuning and, furthermore, to find the optimally tuned configuration for this state of increased sensitivity. We present the results of an experiment to determine the speed and efficiency of an evolutionary algorithm applied to electrostatic tuning of MEMS micro gyros. The MEMS gyro used in this experiment is a pyrex post resonator gyro (PRG) in a closed-loop control system. A measure of the quality of tuning is given by the difference in resonant frequencies, or frequency split, for the two orthogonal rocking axes. The current implementation of the closed-loop platform is able to measure and attain a relative stability in the sub-millihertz range, leading to a reduction of the frequency split to less than 100 mHz.

Micro-Electro-Mechanical Systems (MEMS)↗
NASA NTRS2003

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Jah, Muzar↗
DOE OSTI2023

MEMS-tunable optical ring resonator

A microelectromechanical systems (MEMS)-tunable optical ring resonator is described herein. The ring resonator includes a resonator ring and a tuner ring, along with one or more springs. The springs may be internal or external, i.e., either within or outside the areal footprint of the resonator ring and the tuner ring. The one or more springs are configured to displace the tuner ring from the resonator ring by a desired gap based upon a desired resonant wavelength of the resonator ring. Tuning is implemented by applying a voltage to the ring resonator, with motion of the tuner ring causing a corresponding change in the effective index of the resonator ring. As the ring resonator is essentially a capacitive device, it draws very little power once tuning is achieved.

Wood, Michael↗
DOE OSTI2022

Atomic-resolution lithography with an on-chip scanning tunneling microscope

In this work, atomic-resolution lithography with a Microelectromechanical-System (MEMS) based Scanning Tunneling Microscope (STM) is demonstrated for the first time. The microscope consists of a commercial UltraHigh-Vacuum (UHV) STM whose regular tip is replaced with a 1-Degree-of-Freedom (1-DOF) MEMS nanopositioner. This results in a hybrid STM system where XY-plane motions are provided by the piezotube of the original system and Z-axis motion by the MEMS with a higher bandwidth. Sharp tips made of Pt or W are added to the MEMS devices with postfabrication techniques. With this hybrid system, STM-based lithography is demonstrated on an H-passivated Si (100)-2×1 sample under UHV condition. Results prove the capability of the hybrid STM system for atomic-scale lithography. This capability, paired with the small footprint of the MEMS device, makes this approach a candidate for building a high-throughput parallel STM lithography platform by incorporating an array of 1-DOF MEMS devices that perform lithography in parallel.

Alipour, Afshin (ORCID:0000000263252067)↗
DOE OSTI2021

Atomic precision imaging with an on-chip scanning tunneling microscope integrated into a commercial ultrahigh vacuum STM system

In this article, we replace the Z axis of the piezotube of a conventional Ultrahigh-Vacuum (UHV) Scanning Tunneling Microscope (STM) with a one-degree-of-freedom Microelectromechanical-System (MEMS) nanopositioner. As a result, a hybrid system is realized in which motions in the XY plane are carried out by the piezotube, while the MEMS device performs the Z-axis positioning with a smaller footprint and higher sensitivity. With the proposed system and a feedback loop, STM imaging is conducted on an H-passivated Si (100)-2×1 sample in a UHV condition, demonstrating that this on-chip STM is conducive to atomic precision scanning tunneling microscopy.

Engineering↗
NASA NTRS2010

Wavefront Correction for Large, Flexible Antenna Reflector

A wavefront-correction system has been proposed as part of an outer-space radio communication system that would include a large, somewhat flexible main reflector antenna, a smaller subreflector antenna, and a small array feed at the focal plane of these two reflector antennas. Part of the wavefront-correction system would reside in the subreflector, which would be a planar patch-element reflectarray antenna in which the phase shifts of the patch antenna elements would be controlled via microelectromechanical systems (MEMS) radio -frequency (RF) switches. The system would include the following sensing-and-computing subsystems: a) An optical photogrammetric subsystem built around two cameras would estimate geometric distortions of the main reflector; b) A second subsystem would estimate wavefront distortions from amplitudes and phases of signals received by the array feed elements; and c) A third subsystem, built around small probes on the subreflector plane, would estimate wavefront distortions from differences among phases of signals received by the probes. The distortion estimates from the three subsystems would be processed to generate control signals to be fed to the MEMS RF switches to correct for the distortions, thereby enabling collimation and aiming of the received or transmitted radio beam to the required precision.

Imbriale, William A.↗
NASA NTRS2009

Light-Driven Polymeric Bimorph Actuators

Light-driven polymeric bimorph actuators are being developed as alternatives to prior electrically and optically driven actuators in advanced, highly miniaturized devices and systems exemplified by microelectromechanical systems (MEMS), micro-electro-optical-mechanical systems (MEOMS), and sensor and actuator arrays in smart structures. These light-driven polymeric bimorph actuators are intended to satisfy a need for actuators that (1) in comparison with the prior actuators, are simpler and less power-hungry; (2) can be driven by low-power visible or mid-infrared light delivered through conventional optic fibers; and (3) are suitable for integration with optical sensors and multiple actuators of the same or different type. The immediate predecessors of the present light-driven polymeric bimorph actuators are bimorph actuators that exploit a photorestrictive effect in lead lanthanum zirconate titanate (PLZT) ceramics. The disadvantages of the PLZT-based actuators are that (1) it is difficult to shape the PLZT ceramics, which are hard and brittle; (2) for actuation, it is necessary to use ultraviolet light (wavelengths < 380 nm), which must be generated by use of high-power, high-pressure arc lamps or lasers; (3) it is difficult to deliver sufficient ultraviolet light through conventional optical fibers because of significant losses in the fibers; (4) the response times of the PLZT actuators are of the order of several seconds unacceptably long for typical applications; and (5) the maximum mechanical displacements of the PLZT-based actuators are limited to those characterized by low strains beyond which PLZT ceramics disintegrate because of their brittleness. The basic element of a light-driven bimorph actuator of the present developmental type is a cantilever beam comprising two layers, at least one of which is a polymer that exhibits a photomechanical effect (see figure). The dominant mechanism of the photomechanical effect is a photothermal one: absorption of light energy causes heating, which, in turn, causes thermal expansion.

Adamovsky, Gregory↗
DOE OSTI2020

Fabrication of Freestanding Metallic Ni-Mo-W Microcantilever Beams With High Dimensional Stability

Recent studies have elucidated a promising balance of physical and mechanical properties of sputter deposited nickel-molybdenum-tungsten (Ni-Mo-W) films that have a unique nanotwinned microstructure and promising potential for use in high temperature microelectromechanical systems (MEMS). Here, the current study was undertaken to establish the feasibility of making nanotwinned Ni-Mo-W microcantilevers with standard micro- fabrication processing, to assess their dimensional stability, and to demonstrate the possibility of using nanotwinned Ni-Mo-W in metal MEMS devices. Deposition of Ni-Mo-W films in commercial sputtering chambers revealed a wide processing window for the formation of the requisite nanotwinned microstructure. Conventional photolithography and etchants were employed to shape blanket Ni-Mo-W films into freestanding microcantilever beams. Monitoring microcantilever deflections via interferometry provided a direct measure of residual stresses and overall dimensional stability. Heat treatments of 200° C and 400° C were used to mimic wafer bonding temperatures. At 400°C, microcantilevers exhibited modest stress relaxation, yielding beam deflection profiles on the nanometer scale and portending dimensional stability and control for future metal MEMS devices.

36 MATERIALS SCIENCE↗
NASA NTRS1995

MEMS Technology for Space Applications

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

vandenBerg, A.↗
NASA NTRS2000

MEMS Reliability Assurance Activities at JPL

An overview of Microelectromechanical Systems (MEMS) reliability assurance and qualification activities at JPL is presented along with the a discussion of characterization of MEMS structures implemented on single crystal silicon, polycrystalline silicon, CMOS, and LIGA processes. Additionally, common failure modes and mechanisms affecting MEMS structures, including radiation effects, are discussed. Common reliability and qualification practices contained in the MEMS Reliability Assurance Guideline are also presented.

Kayali, S.↗
NASA NTRS2002

High Temperature MEMS for Turbine Engine Applications

The presentation will discuss Microelectromechanical Systems (MEMS) research and development activities and technologies being conducted at NASA Glenn Research Center to address the needs of harsh environment applications. The focus will be on silicon carbide based h4EMS for high temperature, high power and high radiation environment as well as high temperature sensor technologies which are made possible by MEMS processing techniques. These technologies can enable new measurements and capabilities for future turbine engines. All the presentation materials are publicly available and have been presented/published before.

Hunter, Gary W.↗
NASA NTRS1995

Microelectromechanical Systems

Micro-electromechanical systems (MEMS) is an enabling technology that merges computation and communication with sensing and actuation to change the way people and machines interact with the physical world. MEMS is a manufacturing technology that will impact widespread applications including: miniature inertial measurement measurement units for competent munitions and personal navigation; distributed unattended sensors; mass data storage devices; miniature analytical instruments; embedded pressure sensors; non-invasive biomedical sensors; fiber-optics components and networks; distributed aerodynamic control; and on-demand structural strength. The long term goal of ARPA's MEMS program is to merge information processing with sensing and actuation to realize new systems and strategies for both perceiving and controlling systems, processes, and the environment. The MEMS program has three major thrusts: advanced devices and processes, system design, and infrastructure.

Gabriel, Kaigham J.↗
NASA NTRS1996

Measuring the Thickness and Elastic Properties of Electroactive Thin-Film Polymers Using Platewave Dispersion Data

Electroactive thin-film polymers are candidate sensors and actuators materials. They are also finding significant potential in muscle mechanisms and microelectromechanical systems (MEMS). In these applications, polymer thin films of thickness varying between 20 and 300 micrometers are utilized. The authors are currently studying the potential use of platewave dispersion curve measurements as an effective gauging tool for electroactive thin-film polymers.

sensors actuators film thickness measurements piez↗
DOE OSTI2021

Using non-invasive MEMS pressure sensors for measuring building envelope air leakage

Micro-electromechanical systems (MEMS)-based sensors have seen significant improvements in accuracy and cost over the past several years, and due to the need for altitude sensing in unmanned aerial vehicles and wearable technologies, absolute pressure sensors have shown the most dramatic improvements. This paper investigates applications of MEMS sensors in commercial buildings, including pairing two absolute pressure sensors to determine differential pressures between different locations in and around buildings. Differential pressure measurements are commonly made in commercial buildings for a number of applications, including static pressure measurements for variable-speed supply fan control, air balancing in hospitals, and for envelope and duct air leakage testing. This paper focuses specifically on envelope air-leakage testing applications of these sensors. The use of continuous pressure measurements in addition to one-time non-intrusive outdoor airflow measurements of rooftop packaged units is investigated. A comparison with standardized leakage testing indicated that continuous measurements with MEMS pressure-sensors were able to estimate envelope leakage to within 3–16% of the standardized test result. In addition, the magnitude and stability of differential pressure differences that can be resolved with absolute pressure sensors are also investigated in the laboratory and the field. Results show that the sensors can be effectively used for pressures seen in low rise buildings with rooftop units.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
NASA NTRS2008

Low Power, Wide Dynamic Range Carbon Nanotube Vacuum Gauges

This slide presentation presents carbon nanotube vacuum pressure sensor gauges that operate at low power and exhibit a wide-dynamic range based on microelectromechanical systems (MEMS) technology. The fabrication facility, and the formation process are shown. Pressure sensitivity was found to increase rapidly as the bias power was increased. In addition, by etching part of the thermal SiO2 beneath the tubes and minimizing heat conduction through the substrate, pressure sensitivity was extended toward lower pressures. Results are compared to a conventional thin film meander resistor, which was fabricated and whose pressure response was also measured for comparative purposes.

JEOL E-beam aligner↗