Opacification of PIR Foams to enhance Thermal Resistivity
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Wanasinghe Mudiyanselage Pahala Gedara, Shiwanka V↗
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Parametric optimization of PCM-enhanced underground thermal energy storage for buildings in moderate cold climates
This study presents a novel underground thermal energy storage (UTES) system designed for space heating in buildings located in moderate cold climates. The proposed UTES features a borehole with a depth of 25 ft. (7.62 m) and a diameter of 3 ft. (0.91 m), containing two helical pipe loops-one for discharge fluid and another for recharge fluid-and a thermally enhanced phase change material (PCM) layer that provides high energy storage capacity. The system requires daily thermal recharging using a low-grade heat source for a few hours and delivers continuous heating at a nearly constant discharge rate without significant performance degradation over a 24-h period. This study demonstrates that the optimized UTES, when recharged with hot fluid at an inlet temperature of 40 degrees C for 6 h daily, can provide a continuous heat discharge rate of approximately 2.9 kW for 24 h or 3.4 kW if operated under a shorter discharge period of 15 h (17:00-08:00). With a round-trip efficiency of 72-97%, the proposed UTES offers an efficient and reliable solution for short- and long-duration thermal energy storage technology, making it a promising technology for cold climates.
15 GEOTHERMAL ENERGY↗
Orbit transfer vehicle engine study, phase A extension. Volume 1: Executive summary
A 1980 state-of-the-art advanced expander engine was configured that delivers near-optimum payload-performance and exhibits the simplicity reliability, and life characteristics required of the OTV mission. Engine optimization studies indicate that the performance of the conventional expander cycle engine can be improved substantially through combustion chamber surface area enhancement, thermal enhancement, turbine regeneration, and power cycle efficiency enhancement procedures. The 20K lb. thrust staged combustion engine can be adapted to operate at extended periods in the 1 to 2K lb. thrust regime. The study results indicate that long-life, high performnce operation in the low thrust mode can be achieved with minimum modifications (kitting) of the engine. Although the main contribution to mission success and crew safety stems from propulsion system redundancy, significant reliability can be gained from engine component redundancy, specific engine design features ensuring safety and reliability, including an engine health monitoring system, and from a total program approach to safety and reliability, such as that presently applied to the space shuttle.
Source record↗
Evaluating Heat Extraction Performance of Closed-Loop Geothermal Systems with Thermally Conductive Enhancements in Conduction-Only Reservoirs: Preprint
We investigated the impact of disc-shaped and linear thermal enhancements on performance of closed-loop geothermal systems using steady-state and transient COMSOL numerical simulations. Thermal enhancements refer to thermally conductive material introduced in the rocks surrounding a wellbore to compensate for the relatively low rock thermal conductivity and increase heat extraction. Materials proposed include composite cements with thermally conductive additives such as metals or graphite to obtain overall cement thermal conductivities of 10 to 100x the rock thermal conductivity. Our simulation approach was modeling a subsegment (e.g., 100 m long) of a wellbore with idealized (e.g., perfect disc-shaped) thermal enhancements, and we report results as relative increase in heat extraction with respect to systems without thermal enhancements. We did not evaluate technical feasibility or cost of installing thermal enhancements. Simulations indicate that for 5-mm thick disc-shaped thermal enhancements with 5-m radius, repeated every 1 m along the wellbore and with thermal conductivity of 100x the rock thermal conductivity, the thermal output increases roughly 20% with respect to a closed-loop system without thermal enhancements. For fishbone structure thermal enhancements, we estimate a roughly 7% increase in thermal output for 5-m long radially outward pipes with half the radius of the main wellbore, repeated every 2.5 m, with thermal conductivity of 100x the rock thermal conductivity.
advanced geothermal systems↗
Thermal Performance of an Annealed Pyrolytic Graphite Solar Collector
A solar collector having the combined properties of high solar absorptance, low infrared emittance, and high thermal conductivity is needed for applications where solar energy is to be absorbed and transported for use in minisatellites. Such a solar collector may be used with a low temperature differential heat engine to provide power or with a thermal bus for thermal switching applications. One concept being considered for the solar collector is an Al2O3 cermet coating applied to a thermal conductivity enhanced polished aluminum substrate. The cermet coating provides high solar absorptance and the polished aluminum provides low infrared emittance. Annealed pyrolytic graphite embedded in the aluminum substrate provides enhanced thermal conductivity. The as-measured thermal performance of an annealed pyrolytic graphite thermal conductivity enhanced polished aluminum solar collector, coated with a cermet coating, will be presented.
Jaworske, Donald A.↗
Remarkable enhancement in thermal conductivity of stainless-steel leveraging metal composite via laser powder bed fusion: 316L-Cu composite
This work aimed to significantly enhance the thermal conductivity of the SS matrix by fabricating a metal composite SS-Cu system utilizing a laser powder bed fusion process. The impact of process parameters on the microstructure of SS-Cu samples is investigated. Here, the processing and post-processing factors that influence the effective thermal conductivity of the metal composite SS-Cu system are discussed. Then, the effective thermal conductivity and mechanical properties of the SS-Cu composite are measured at room temperature and operating temperature of 300 °C. The optimized laser powder bed fusion parameters led to low Marangoni convection, high cooling rate, greater macro-segregation, and higher thermal conductivity values albeit at the cost of ductility in SS-Cu metal composite likely due to the presence of the unmelted powder particles. As-printed SS-60 vol % Cu and annealed SS-60 vol % Cu had 2.5X and 6.6X thermal conductivity enhancement, respectively. During annealing, phase separation, partial melting of Cu, and formation of a continuous network of Cu surrounding SS play a key role in enhancing the thermal conductivity of the SS-Cu metal composite structure.
36 MATERIALS SCIENCE↗
Defects vibrations engineering for enhancing interfacial thermal transport in polymer composites
To push upper boundaries of thermal conductivity in polymer composites, understanding of thermal transport mechanisms is crucial. Despite extensive simulations, systematic experimental investigation on thermal transport in polymer composites is limited. To better understand thermal transport processes, we design polymer composites with perfect fillers (graphite) and defective fillers (graphite oxide), using polyvinyl alcohol (PVA) as a matrix model. Measured thermal conductivities of ~1.38 ± 0.22 W m -1 K -1 in PVA/defective filler composites is higher than those of ~0.86 ± 0.21 W m -1 K -1 in PVA/perfect filler composites, while measured thermal conductivities in defective fillers are lower than those of perfect fillers. We identify how thermal transport occurs across heterogeneous interfaces. Thermal transport measurements, neutron scattering, quantum mechanical modeling, and molecular dynamics simulations reveal that vibrational coupling between PVA and defective fillers at PVA/filler interfaces enhances thermal conductivity, suggesting that defects in polymer composites improve thermal transport by promoting this vibrational coupling.
42 ENGINEERING↗
Enhanced negative thermal expansion of boron-doped Fe 43 Mn 28 Ga 28.97 B 0.03 alloy
Enhanced negative thermal expansion (NTE) properties are achieved by introducing a little amount of boron in the Fe 43 Mn 28 Ga 28.97 B 0.03 alloy. As a result, this alloy shows a giant NTE coefficient of alpha(1) = -79.7 x 10 -6 K -1 in a wide temperature range from 277 K to 136 K. Compared to the NTE characteristics in Fe 43 Mn 28 Ga 29 , the NTE operation temperature window has expanded by 74% with the corresponding coefficient of thermal expansion increased by 57% within the NTE temperature window for the boron-doped Fe 43 Mn 28 Ga28.97B0.03. Additionally, in-situ synchrotron high-energy X-ray diffraction results suggest that by boron substitution, the large unit cell volume change across martensitic transformation and the wide phase transition temperature interval are responsible for the pronounced NTE behavior in Fe 43 Mn 28 Ga 28.97 B 0.03 . Moreover, for the Fe 43 Mn 28 Ga 28.97 B 0.03 NTE material, the compressive strength and strain are significantly improved compared with that of Fe 43 Mn 28 Ga 29 . The present study indicates that Fe 43 Mn 28 Ga 28.97 B 0.03 with enhanced NTE across martensitic transformation may be used for practical application as thermal-expansion compensators.
36 MATERIALS SCIENCE↗
Enhancement of Thermal Conductivity of Bentonite Buffer Materials with Copper Wires/Meshes for High-Level Radioactive Waste Disposal
In high-level radioactive waste disposal, a heat-generating waste canister is generally encased with a layer of bentonite-based buffer material acting as an engineered barrier to limit water percolation and radionuclide release. The low thermal conductivity of bentonite (~0.5 W/m∙K) combined with a high thermal loading waste package may result in a high surface temperature on the package that can potentially impact the structural integrity of the package itself as well as the surrounding buffer material. We show in this paper that the thermal conductivity of bentonite can be effectively enhanced by embedding copper wires/meshes across the buffer layer to form fully connected high heat conduction pathways. A simple calculation based on Rayleigh’s model shows that a required thermal conductivity of 5 W/m∙K for effective heat dissipation can be achieved simply by adding ~1 vol % of copper wires/meshes into bentonite. As a result, the peak surface temperature on a large waste package such as a dual-purpose canister can be reduced by up to 300°C, leading to a significant reduction in the surface storage time for waste cooling and therefore the overall cost for direct disposal of such waste packages. Because of the ensured full thermal percolation across the buffer layer, copper wires/meshes turn out to be much more effective than any other materials currently suggested (such as graphene or graphite) in enhancing the thermal conductivity of buffer material. Furthermore, the embedded copper wires/meshes can help reinforce the mechanical strength of the buffer material, thus preventing the material from a potential erosion by a possible intrusion of dilute groundwater.
36 MATERIALS SCIENCE↗
Insights into the Enhanced Oxidative Thermal Stability of Nanoparticle Organic Hybrid Materials Developed for Carbon Capture and Energy Storage
Due to the growing need for Direct Air Capture (DAC) and integrated carbon capture and conversion technologies, CO 2 capture materials that can withstand a wide range of environmental conditions, including fluctuating ambient temperatures and high concentrations of oxidizing agents (i.e., oxygen and moisture), are critically needed. Liquid-like Nanoparticle Organic Hybrid Materials (NOHMs) have been proposed as candidates for DAC and electrolyte additives enabling sustainable energy storage (i.e., integrated CO 2 capture and conversion and flow batteries). Liquid-like NOHMs functionalized with an ionic bond have been shown to display greatly enhanced oxidative thermal stability compared to the untethered polymer. However, these studies were limited in terms of reaction conditions and the detailed mechanisms of the oxidative thermal degradation were not reported. In this work, a kinetic thermal degradation analysis was performed on NOHM-I-HPE and the neat polymer, Jeffamine M2070 (HPE), in both non-oxidative and oxidative conditions. NOHM-I-HPE displayed similar thermal stability to the untethered polymer in a nitrogen environment, but interestingly, the thermal stability of the ionically tethered polymer was significantly enhanced in the presence of air. This observed enhancement of oxidative thermal stability is attributed to the orders of magnitude larger viscosity of the liquid-like NOHMs compared to untethered polymer and the bond stabilization of the ionically tethered polymer in the NOHMs canopy. Further, spectroscopic analyses of the liquid residue revealed that in the presence of oxygen, the degradation of HPE and NOHM-I-HPE occurs through the formation of trace amounts of carbonyls. This study illustrated that NOHMs can serve as functional materials for sustainable energy storage applications because of their excellent oxidative thermal stability.
25 ENERGY STORAGE↗
Pore-Confined Polymers Enhance the Thermal Conductivity of Polymer Nanocomposites
In this work, molecularly confined polymer fillers in nanopores were found to give superior mechanical properties of polymer nanocomposites. In this work, we study the thermal conductivity of such nanocomposites and unveil the effect of polymer confinement on thermal conductivity. Using the time-domain thermoreflectance method, we measure the cross-plane thermal conductivity of polymer nanocomposites that consist of polystyrene fillers confined within a nanoporous organosilicate matrix. Compared to unconfined bulk polystyrene fillers, we find that pore-confined polystyrene fillers enhance the thermal conductivity of the polymer nanocomposites. This enhancement is attributed to the better aligned and less entangled chains in the confined phase, where chain–chain phonon scatterings are reduced. Our work provides essential insights into the thermal conductivity of polymer nanocomposites for multifunctional thermal and mechanical applications.
36 MATERIALS SCIENCE↗
Role of the junction voltage on the overflow current in light-emitting diodes
Quantum-well (QW)-based light emitters, such as light-emitting diodes (LEDs) and lasers, of various semiconductor materials experience a reduction in their efficiency when operating at higher temperatures, a phenomenon referred to as “thermal droop.” Among the various claims on the origins of thermal droop, an increased overflow current with increasing temperatures is a common contender. Since overflow of carriers can only occur when the junction voltage 𝑉 Junction approaches the built-in voltage 𝑉 BI of any diodes, we develop a simple method relating the difference between 𝑉 Junction and 𝑉 BI to approximate the upper limit of overflow occurring in QW-based light-emitting diodes. The measured difference between 𝑉 Junction and 𝑉 BI of state-of-the-art commercial blue and green InGaN-based LEDs at temperatures up to ∼450 K suggests negligible overflow. To further experimentally verify the absence of overflow, we perform temperature-dependent electron emission spectroscopy on the same commercial blue and green LEDs and find no evidence of thermally enhanced overflow carriers up to ∼450 K. In agreement with our claims that 𝑉 Junction must approach 𝑉 BI for overflow to occur, two-dimensional temperature-dependent electrical simulations of violet, blue, and green LEDs including alloy disorder and V-defects demonstrate that overflow can be significant in violet LEDs, where the small band offset between the InGaN QW and GaN cladding layers due to the larger QW bandgap requires larger 𝑉 Junction to reach standard operating current densities, thereby approaching 𝑉 BI . By contrast, simulations indicate that overflow is negligible in blue and green LEDs, whose smaller QW bandgaps result in smaller quasi-Fermi levels difference to reach significant carrier injection, resulting in a 𝑉 Junction much smaller than 𝑉 BI up to large operating current densities. Considering that overflow is negligible in blue and longer-wavelength LEDs, and our observations of the large thermal droop occurring at low current densities, where Shockley-Read-Hall (SRH) recombination dominates, we conclude that thermally enhanced SRH processes are the most significant contributor to thermal droop. Finally, we also simulate the carrier densities in the different QWs of a multiple-QW LED and observe a reduction in the total carrier density at a given operating current density, which results in a decrease in the total Auger-Meitner current of the LED from just the thermally enhanced carrier redistribution among QWs without taking any possible additional temperature dependence of their recombination coefficients. Taking all this into account, minimizing thermal droop effects in LEDs can be achieved by a reduction in defect density, using wider band gap p-n junction-defining cladding layers, and operating at higher currents.
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
Enhancing The Thermal Resistivity of Rigid Polyisocyanurate Foam Insulation
The development of rigid polyurethane foam insulation has garnered considerable attention because of its promising applications in the buildings and construction industry. Its low thermal conductivity makes it an attractive choice for improving energy performance in buildings. Current Rigid Polyurethane foams have thermal resistivity (R-value/in.) 5.5 to 6.5 h.ft2F/BTU/in.· that could be further improved by diminishing the heat transfer through the foam matrix. Nevertheless, minimizing both conduction (through gas and solid) and radiation simultaneously in porous solids is a significant challenge due to the trade-off between these two mechanisms. This study focuses on improving the R-value of the insulation foams via several strategies: such as type and the amount of the surfactants, blowing agent content and precooling and premixing polyol mixture. These methods optimized thermal properties of the PIR foams, achieving R/in. as high as 8.3. This excellent R/in. is anticipated to be a critical factor in significantly advancing the thermal insulation performance of rigid polyurethane cellular foams, thereby enhancing their efficacy in energy-efficient building applications.
Wanasinghe Mudiyanselage Pahala Gedara, Shiwanka V↗
Thermal transfer enhancement by hydrodynamic plasmons in electron bilayers
Here, we develop a theory of heat transfer induced by thermal charge fluctuations in two-dimensional electron double layers. We consider pristine systems comprised of identical layers and focus on the regime of sufficiently high temperatures and interlayer distances 𝑑, where the relevant charge fluctuations may be described using the hydrodynamic approach. In this limit heat transfer is dominated by the plasmon resonances. For systems with Galilean-invariant electron dispersion the interlayer thermal conductance 𝜘 is proportional to the kinematic viscosity of the electron liquid and decreases as 1/𝑑 4 . In the absence of Galilean invariance 𝜘∝𝜎/𝑑 3 , where 𝜎 is the intrinsic conductivity of the liquid. This strong enhancement can be traced to a drastically different broadening of plasmon resonances in systems with and without Galilean invariance.
2-dimensional systems↗
High-Temperature Adhesives for Thermally Stable Aero-Assist Technologies
Aero-assist technologies are used to control the velocity of exploration vehicles (EVs) when entering Earth or other planetary atmospheres. Since entry of EVs in planetary atmospheres results in significant heating, thermally stable aero-assist technologies are required to avoid the high heating rates while maintaining low mass. Polymer adhesives are used in aero-assist structures because of the need for high flexibility and good bonding between layers of polymer films or fabrics. However, current polymer adhesives cannot withstand temperatures above 400 C. This innovation utilizes nanotechnology capabilities to address this need, leading to the development of high-temperature adhesives that exhibit high thermal conductivity in addition to increased thermal decomposition temperature. Enhanced thermal conductivity will help to dissipate heat quickly and effectively to avoid temperature rising to harmful levels. This, together with increased thermal decomposition temperature, will enable the adhesives to sustain transient high-temperature conditions.
Eberts, Kenneth↗
Thermal emittance enhancement of graphite-copper composites for high temperature space based radiators
Graphite-copper composites are candidate materials for space based radiators. The thermal emittance of this material, however, is a factor of two lower than the desired emittance for these systems of greater than or equal to 0.85. Arc texturing was investigated as a surface modification technique for enhancing the emittance of the composite. Since the outer surface of the composite is copper, and samples of the composite could not be readily obtained for testing, copper was used for optimization testing. Samples were exposed to various frequencies and currents of arcs during texturing. Emittances near the desired goal were achieved at frequencies less than 500 Hz. Arc current did not appear to play a major role under 15 amps. Particulate carbon was observed on the surface, and was easily removed by vibration and handling. In order to determine morphology adherence, ultrasonic cleaning was used to remove the loosely adherent material. This reduced the emittance significantly. Emittance was found to increase with increasing frequency for the cleaned samples up to 500 Hz. The highest emittance achieved on these samples over the temperature range of interest was 0.5 to 0.6, which is approximately a factor of 25 increase over the untextured copper emittance.
Rutledge, Sharon K.↗
Thermal emittance enhancement of graphite-copper composites for high temperature space based radiators
Graphite-copper composites are candidate materials for space based radiators. The thermal emittance of this material, however, is a factor of two lower than the desired emittance for these systems of greater than or equal to 0.85. Arc texturing was investigated as a surface modification technique for enhancing the emittance of the composite. Since the outer surface of the composite is copper, and samples of the composite could not be readily obtained for testing, copper was used for optimization testing. Samples were exposed to various frequencies and currents of arcs during texturing. Emittances near the desired goal were achieved at frequencies less than 500 Hz. Arc current did not appear to play a major role under 15 amps. Particulate carbon was observed on the surface, and was easily removed by vibration and handling. In order to determine morphology adherence, ultrasonic cleaning was used to remove the loosely adherent material. This reduced the emittance significantly. Emittance was found to increase with increasing frequency for the cleaned samples up to 500 Hz. The highest emittance achieved on these samples over the temperature range of interest was 0.5 to 0.6, which is approximately a factor of 25 increase over the untextured copper emittance.
Rutledge, Sharon K.↗
Selective Electrochemical End‐Group Removal Enhances Polymer Thermal Stability
Here we introduce an electrochemical strategy for the selective and quantitative removal of thiocarbonylthio end groups from polymers prepared by reversible addition–fragmentation chain transfer (RAFT) or photoiniferter polymerization. Our results indicate that applying a cathodic potential in an undivided cell promotes reductive cleavage of the thiocarbonylthio moiety, generating terminal polymer radicals that are efficiently capped with hydrogen atoms in the presence of benign donors. This transformation proceeds cleanly across diverse polymer backbones and end-group chemistries, including trithiocarbonates and dithiobenzoates, without chain coupling or degradation. Moreover, the applied potential can be tuned to enable chemoselective end-group removal in mixed-polymer systems, a level of control inaccessible by thermal, photochemical, or nucleophilic strategies. Beyond delivering colorless and optically transparent materials, electrochemical end-group removal significantly enhances polymer stability. Poly(methyl methacrylate) subjected to electrochemical end-group removal exhibited a T 95 of 342 °C, exceeding the stabilities of analogous polymers with end groups removed by aminolysis (T 95 = 260 °C) or radical-based methods (T 95 = 299 °C). These findings demonstrate redox-directed post-polymerization modification as a tool for designing robust, transparent, and thermally stable macromolecules and establish electrochemistry as a platform strategy in polymer synthesis and processing.
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗