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At least 721 records · Page 40

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NASA NTRSDate not supplied

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

The Portable Life Support System (PLSS) of the Exploration Extravehicular Mobility Unit (xEMU) requires sensors capable of measuring the major constituents of the gas stream. These major constituents include oxygen, carbon dioxide, and water vapor. The sensors must operate across a wide range of flow and pressure conditions and introduce very low pressure drop in the ventilation loop. The sensors must operate with low power and occupy a small volume. This paper reports the development of a compact, low power, multi-parameter astronaut life support sensor (M-PALSS). M-PALSS consists of an array of low-power chemical microsensors for oxygen, carbon dioxide, water vapor, and pressure. M-PALSS includes custom electronics to control the sensors and is packaged in a custom housing that meets the volume and shape requirements for service in the PLSS.

James Makel↗

NASA NTRSDate not supplied

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

James Makel↗

NASA NTRSDate not supplied

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

James Makel↗

NASA NTRS2011

Thermally Stabilized Transmit/Receive Modules

RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

thermal cycling stress↗

NASA NTRS2000

Modular Low-Heater-Power Cathode/Electron Gun Assembly for Microwave and Millimeter Wave Traveling Wave Tubes

A low-cost, low-mass, electrically efficient, modular cathode/electron gun assembly has been developed by FDE Inc. of Beaverton, Oregon, under a Small Business Innovation Research (SBIR) contract with the NASA Glenn Research Center at Lewis Field. This new assembly offers significant improvements in the design and manufacture of microwave and millimeter wave traveling-wave tubes (TWT's) used for radar and communications. It incorporates a novel, low-heater-power, reduced size and mass, high-performance barium dispenser type thermionic cathode and provides for easy integration of the cathode into a large variety of conventional TWT circuits. Among the applications are TWT's for Earth-orbiting communication satellites and for deep space communications, where future missions will require smaller spacecraft, higher data transfer rates (higher frequencies and radiofrequency output power), and greater electrical efficiency. A particularly important TWT application is in the microwave power module (a hybrid microwave/millimeter wave amplifier consisting of a low-noise solid-state driver, a small TWT, and an electronic power conditioner integrated into a single compact package), where electrical efficiency and thermal loading are critical factors and lower cost is needed for successful commercialization. The design and fabrication are based on practices used in producing cathode ray tubes (CRT's), which is one of the most competitive and efficient manufacturing operations in the world today. The approach used in the design and manufacture of thermionic cathodes and electron guns for CRT's has been optimized for fully automated production, standardization of parts, and minimization of costs. It is applicable to the production of similar components for microwave tubes, with the additional benefits of low mass and significantly lower cathode heater power (less than half that of dispenser cathodes presently used in TWT s). Modular cathode/electron gun assembly. The modular cathode/electron gun assembly consists of four subassemblies the cathode, the focus electrode, the header (including the electrical feedthroughs), and the gun envelope (including the anode) a diagram of which is shown. The modular construction offers a number of significant advantages, including flexibility of design, interchangeability of parts, and a drop-in final assembly procedure for quick and accurate alignment. The gun can accommodate cathodes ranging in size from 0.050 to 0.250-in. in diameter and is applicable to TWT's over a broad range of sizes and operating parameters, requiring the substitution of only a few parts: that is, the cathode, focus electrode, and anode. The die-pressed cathode pellets can be made with either flat or concave (Pierce gun design) emitting surfaces. The gun can be either gridded (pulse operation) or ungridded (continuous operation). Important factors contributing to low cost are the greater use of CRT materials and parts, the standardization of processes (welding and mechanical capture), and tooling amenable to automated production. Examples are the use of simple shapes, drawn or stamped metal parts, and parts joined by welding or mechanical capture. Feasibility was successfully demonstrated in the retrofit and testing of a commercial Kaband (22-GHz) TWT. The modular cathode/electron gun assembly was computer modeled to replicate the performance of the original electron gun and fabricated largely from existing CRT parts. Significant test results included demonstration of low heater power (1.5-W, 1010 C brightness temperature for a 0.085-in.-diameter cathode), mechanical ruggedness (100g shock and vibration tests in accordance with military specifications (MIL specs)), and a very fast warmup. The results of these tests indicate that the low-cost CRT manufacturing approach can be used without sacrificing performance and reliability.

Wintucky, Edwin G.↗

DOE OSTI2022

Skopi: a simulation package for diffractive imaging of noncrystalline biomolecules

X-ray free-electron lasers (XFELs) have the ability to produce ultra-bright femtosecond X-ray pulses for coherent diffraction imaging of biomolecules. While the development of methods and algorithms for macromolecular crystallography is now mature, XFEL experiments involving aerosolized or solvated biomolecular samples offer new challenges in terms of both experimental design and data processing. Skopi is a simulation package that can generate single-hit diffraction images for reconstruction algorithms, multi-hit diffraction images of aggregated particles for training machine learning classifiers using labeled data, diffraction images of randomly distributed particles for fluctuation X-ray scattering algorithms, and diffraction images of reference and target particles for holographic reconstruction algorithms. Skopi is a resource to aid feasibility studies and advance the development of algorithms for noncrystalline experiments at XFEL facilities.

59 BASIC BIOLOGICAL SCIENCES↗

DOE OSTI2021

DMFTwDFT: An open-source code combining Dynamical Mean Field Theory with various density functional theory packages

We report Dynamical Mean Field Theory (DMFT) is a successful method to compute the electronic structure of strongly correlated materials, especially when it is combined with density functional theory (DFT). Here, we present an open-source computational package (and a library) combining DMFT with various DFT codes interfaced through the Wannier90 package. The correlated subspace is expanded as a linear combination of Wannier functions introduced in the DMFT approach as local orbitals. In particular, we provide a library mode for computing the DMFT density matrix. This library can be linked and then internally called from any DFT package, assuming that a set of localized orbitals can be generated in the correlated subspace. The existence of this library allows developers of other DFT codes to interface with our package and achieve the charge-self-consistency within DFT+DMFT loops. To test and check our implementation, we computed the density of states and the band structure of well-known solid-state correlated materials, namely LaNiO, SrVO, and NiO. The obtained results are compared to those obtained from other DFT+DMFT implementations.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

NASA NTRS1989

Three-dimensional simulation of whistler mode excited by the Spacelab 2 electron beam

During the Spacelab 2 mission, while an electron beam was being ejected from the Shuttle, the Plasma Diagnostics Package (PDP) detected a clear funnel-shaped emission that is believed to be caused by whistler-mode emission from the electron beam. In order to understand the mechanism of this emission, simulations with a three-dimensional partially magnetostatic code have been performed. The simulation results show that whistler-mode and lower hybrid waves are excited by the electron beam, which is initially localized in the column in the three-dimensional simulation system, and that they propagate away from the beam. The wave spectra of the electric and magnetic fields diagnosed at some points show several peaks due to the waves excited by the electron beam. The frequency range of these spectra is in qualitative agreement with the PDP data. The intense narrowband electrostatic emission near the electron plasma frequency is observed by the simulations. The simulation results show that the beam instability is responsible for the generation mechanism of these emissions.

Nishikawa, K.-I.↗

NASA NTRS1989

Coherent Cerenkov radiation from the Spacelab 2 electron beam

The plasma environment of the Spacelab 2 mission was investigated through the deployment of the Plasma Diagnostics Package (PDP) by the Space Shuttle Orbiter and the Orbiter's ejection of a continuous 1-keV/50-mA electron beam along a field line. As the PDP flew by the beam, its plasma-wave instrument detected intense whistler-mode radiation originating from the beam. A detailed model has been developed of the coherent Cerenkov emission process, using a one-dimensional computer simulation of the beam to model the expected phase space structure of the electrons. The power calculated for the modeled 200-m beam segment can easily account for the measured whistler mode wave power.

Farrell, W. M.↗

NASA NTRS1995

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗

NASA NTRS2005

Electronic Router

Electronic Router (E-Router) is an application program for routing documents among the cognizant individuals in a government agency or other organization. E-Router supplants a prior 14 NASA Tech Briefs, May 2005 system in which paper documents were routed physically in packages by use of paper slips, packages could be lost, routing times were unacceptably long, tracking of packages was difficult, and there was a need for much photocopying. E-Router enables a user to create a digital package to be routed. Input accepted by E-Router includes the title of the package, the person(s) to whom the package is to be routed, attached files, and comments to reviewers. Electronic mail is used to notify reviewers of needed actions. The creator of the package can, at any time, see the status of the package in the routing structure. At the end of the routing process, E-Router keeps a record of the package and of approvals and/or concurrences of the reviewers. There are commercial programs that perform the general functions of E-Router, but they are more complicated. E-Router is Web-based, easy to use, and does not require the installation or use of client software.

Crusan, Jason↗

DOE OSTI2023

Automated Energy-Dispersive X-ray Spectroscopy Analysis for Multi-Modal Few-Shot Learning

Scanning transmission electron microscopy (STEM) is a powerful tool that allows for the atomic-scale analysis of a materials’ structure, chemistry, and defect domains (Akers et al. 2021). The current generation of microscopes generate vast amounts of data, surpassing the limits of effective manual analysis traditionally performed by domain experts (Spurgeon et al. 2021). While recent strides in machine learning have significantly enhanced the processing of large and intricate datasets acquired through electron microscopy, the prevalent use of proprietary software packages for initial data collection poses a challenge. In many cases, these software packages act as a ‘black box’, constraining user functionality and hindering the output of data in a format that is conducive to seamless integration into machine learning models. This work addresses these challenges by adapting HyperSpy, an open-source Python library, for the analysis and quantification of raw energy dispersive spectroscopy (EDS) data acquired through STEM. The modified HyperSpy code successfully facilitates user-defined segmentation of the data, enabling the integration of atomic %, weight %, and raw EDS spectra for each segmented region into an existing few-shot machine learning model. While initial results reveal discrepancies in quantified atomic and weight percentages when compared to proprietary software, ongoing efforts aim to rectify this issue by refining the fit of the HyperSpy model to the EDS spectra. Overall, this research underscores the potential of open-source tools like HyperSpy to enhance the accessibility of analytical tools, fostering a transparent and user-friendly environment for seamlessly incorporating electron microscopy data into machine learning models.

36 MATERIALS SCIENCE↗

NASA NTRS1972

Testing methods and techniques: Testing electrical and electronic devices: A compilation

The methods, techniques, and devices used in testing various electrical and electronic apparatus are presented. The items described range from semiconductor package leak detectors to automatic circuit analyzer and antenna simulators for system checkout. In many cases the approaches can result in considerable cost savings and improved quality control. The testing of various electronic components, assemblies, and systems; the testing of various electrical devices; and the testing of cables and connectors are explained.

Source record↗

NASA NTRS1985

Dynamic Thermophysical Measurements in Space

The objective is to develop techniques for the dynamic measurement of selected thermophysical properties (e.g., heat of fusion, heat capacity, electrical resistivity) of solids and liquids at temperatures above 2000 K in a near zero-gravity environment. The first phase involves establishing the stability (geometrical) limits of specimens when rapidly heated to temperatures beyond their melting point. A test equipment package was designed and constructed for this purpose, consisting of removable specimen cartridge cells, a battery-bank power supply, a high-speed framing camera, a single-wavelength pyrometer, and electronic switching and control equipment. The operation of the equipment package was tested in the laboratory in preparation for near zero-gravity experiments to be performed during a KC-135 flight in September, 1984.

Cezairliyan, A.↗

DOE OSTI2022

Construction of meta-GGA functionals through restoration of exact constraint adherence to regularized SCAN functionals

The strongly constrained and appropriately normed (SCAN) meta-GGA exchange–correlation functional is constructed as a chemical environment-determined interpolation between two separate energy densities: one describes single-orbital electron densities accurately and another describes slowly varying densities accurately. To conserve constraints known for the exact exchange–correlation functional, the derivatives of this interpolation vanish in the slowly varying limit. While theoretically convenient, this choice introduces numerical challenges that degrade the functional’s efficiency. We have recently reported a modification to the SCAN meta-GGA, termed restored-regularized-SCAN (r 2 SCAN) , that introduces two regularizations into SCAN, which improve its numerical performance at the expense of not recovering the fourth order term of the slowly varying density gradient expansion for exchange. Here, we show the derivation of a progression of density functional approximations [regularized SCAN (rSCAN), r++SCAN, r 2 SCAN, and r 4 SCAN] with increasing adherence to exact conditions while maintaining a smooth interpolation. The greater smoothness of r 2 SCAN seems to lead to better general accuracy than the additional exact constraint of SCAN or r 4 SCAN does.

, correlation energy↗

NASA NTRS1990

Low cost attitude sensors for spacecraft

A review is presented of two-low cost attitude sensors developed with existing technology, but with emphasis directed to reducing the unit costs without compromising reliability or quality. The solar aspect sensor was developed to determine the angle of the sun with respect to the optical axis of the Shuttle Solar Backscatter Ultraviolet (SSBUV) Experiment Package. Using sensor readings updated every five milliseconds, signal processing electronics determine the location of the center of the sun's image on the array. An earth horizon sensor was developed to measure the nadir angle with respect to the optical axis of the SSBUV Experiment Package to an accuracy of + or - 0.5 deg. Operation of each of the sensors is described along with flight results obtained when flown onboard Atlantis as part of the SSBUV Experiment Package.

Auer, S.↗

DOE OSTI2025

Organic Direct-Bonded-Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging

Silicon carbide (SiC) power devices are playing ever- growing roles in high-power-density power electronics converters by offering benefits such as high voltage rating, fast transients, and high thermal performance. Organic direct-bonded copper (ODBC)-based packaging, due to its ductility and ease of han- dling, allows the possibility of a more flexible layout design that may better tap the potential of SiC benefits. In this work, an ODBC-based prototyping routine is developed that accelerates the iterations of packaging layout design with low cost. The properties of ODBC and its handling are briefly introduced, and tools and fabrication steps are explained. Following this routine, a 1.2-kV SiC half-bridge power module is designed and fabricated with the focus on sub-nanohenry ultra-low loop inductance. Simulation and experimental validation are also conducted.

25 ENERGY STORAGE↗

NASA NTRS1999

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗