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Interconnected Hydrologic Extreme Drivers and Impacts Depicted By Remote Sensing Data Assimilation
In a changing climate, the likelihood of hydrologic extremes has been increasing as climate change can impact both means and extremes4 of hydrologic cycle processes, potentially resulting in an increased frequency of floods in some regions and decreases in others. In a warming world, the physical processes that affect hydrologic response, such as rain-on snow runoff events, are also changing, such that the seasonality of streamflow has been shifting. The geography of rain-on-snow runoff events is predicted to move from low to high elevations. In addition to floods, there is also potential for an increase in dry extremes in a warming world with increased drought frequency and occurrences in many parts of the world. The increased frequency of drought and heatwave events is expected to have consequences such as escalating crop failures in future projection scenarios1. Thus, the consensus of literature shows that climate change is increasing the magnitude and frequency of extreme hydrologic events, and the human influence in many of these events is substantial.
Development of an Adaptive Droop Control Method for Interconnected Lunar DC Microgrids Using Power Hardware-in-the-Loop
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Wireless Interconnect CubeSat using Bluetooth Low Energy (BLE)
The Bluetooth Low Energy (BLE) subsystem controls the communication between boards on the CubeSat. It will replace wired Universal Asynchronous Receiver-Transmitter (UART) connections between Command and Data Handling (C&DH) and each subsystem. It allows us to only use one UART channel and reduces the length of commands sent to the subsystems.
Examination of Space Vehicle Ethernet Interconnects
The NASA Engineering and Safety Center (NESC) was requested to examine the performance of Ethernet in space vehicle configurations at the physical layer and develop guidance for system designers to ensure correct Ethernet operation in these systems. The objective of the assessment was to develop guidance and requirements for Ethernet cable and connectors for spaceflight environments and make recommendations for Ethernet systems used in flight-critical space applications. This report contains the results of the NESC assessment.
Integrating the Interconnections Between Groundwater and Land Surface Processes Through the Coupled NASA Land Information System and ParFlow Environment
Understanding the interactions between the atmosphere, the land, and the subsurface is fundamental to hydrology and is critical for a better assessment of the impacts of climate change and human management on hydrological systems. However, many land surface models simplify the subsurface hydrology and thereby these interactions. In this study, we couple the land surface model Noah-MP included in the NASA Land Information System (LIS) with the integrated hydrologic model ParFlow (ParFlow-LIS) using the Earth System Modeling Framework (ESMF) and the National United Operational Prediction Capability (NUOPC). This coupling improves the simulation of water and energy cycle processes by adding the three-dimensional variably saturated and heterogeneous flow in the subsurface using sophisticated and nonlinear physics-based equations as well as the advances in satellite remote sensing-based data assimilation of the land surface, thereby benefiting the integrated hydrologic modeling and data assimilation community. We use the High Plains aquifer, located in the central United States, as a testbed to evaluate the coupled ParFlow-LIS system. The new ParFlow-LIS system accounts for the effects of topographically driven flows on the land surface, producing more fine-scale patterns of land surface states and fluxes than standalone LIS. In addition, ParFlow-LIS enables the consideration of the effect of subsurface water storage on evapotranspiration. This is particularly important in areas and times with dry soils, such as during drought conditions or in the presence of a cone of depression due to pumping.
Compositional performance certification of interconnected systems using ADMM
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Power module packaging with double sided planar interconnection and heat exchangers
A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.
Optical interconnect assembly
An optical assembly includes a substrate with a first row of apertures and a second row of apertures. A first optical die includes a first plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each transducer element is aligned with an aperture of the first row of optical apertures. A second optical die includes a second plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each of the second plurality of optical transducer elements is aligned with an aperture of the second row of optical apertures. A connector configured to mate with the optical assembly supports a plurality of optical fibers. A terminal end of each optical fiber protrudes from the connector and extends into one of the apertures when the connector is coupled with the optical assembly.
Software Defined Networking for HPC Interconnect and its Extension across Domains
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Low-cost optical fiber interconnects for networks and high-performance computing
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Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
The present invention relates to novel diacylglycerol acyltransferase genes and proteins, and methods of their use. In particular, the invention describes genes encoding proteins having diacylglycerol acetyltransferase activity, specifically for transferring an acetyl group to a diacylglycerol substrate to form acetyl-Triacylglycerols (ac-TAGS), for example, a 3-acetyl-1,2-diacyl-sn-glycerol. The present invention encompasses both native and recombinant wild-type forms of the transferase, as well as mutants and variant forms. The present invention also relates to methods of using novel diacylglycerol acyltransferase genes and proteins, including their expression in transgenic organisms at commercially viable levels, for increasing production of 3-acetyl-1,2-diacyl-sn-glycerols in plant oils and altering the composition of oils produced by microorganisms, such as yeast, by increasing ac-TAG production. Additionally, oils produced by methods of the present inventions comprising genes and proteins are contemplated for use as biodiesel fuel, in polymer production and as naturally produced food oils with reduced calories.
Method to Determine Maximum Allowable Sinterable Silver Interconnect Size
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Technical Evaluation of the 15% of Peak Load PV Interconnection Screen.
Abstract not provided.
Technical Evaluation of the 15% of Peak Load PV Interconnection Screen.
Abstract not provided.
Interconnect So*ware/Hardware Co-Design for Extreme-Scale Systems.
Abstract not provided.