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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Molded plastic preform facilitates the fabrication of small lots of welded cordwood circuits. The preforms retain the components during welding and electrical checkout and facilitate encapsulation of the welded module when used with a conventional potting shell.
Integrated push-pull power amplifier fabricated on a chip of silicon has interdigitated power transistors and is hermetically encapsulated in a beryllia flat package. It provides current output greater than the nominal 10 amperes from an input current drive of 1 ampere.
Polyurethane foam encapsulation techniques for maintaining constant atmosphere and providing mechanical protection against high voltage breakdown in spacecraft ion propulsion systems
Thin film plastic encapsulated CdS solar cells performance reduction after simulated micrometeoroid impact in shock tube
Multiplicity of external ribbon leads makes possible connections to a sealed or encapsulated microassembly. The leads are integral with the internal connections on a single part that can be fabricated economically by fine-detail electroplating.
Encapsulation technique for multiple chip silicon switching transistors with silver-Teflon contacts
Glass encapsulation for semiconductor elements deposited by reaction of silane with oxygen
Reactive encapsulation methods for thermal stabilization of zinc orthotitanate resin paints for spacecrafts materials
Irradiation of encapsulated fuel and fast neutron fluxes that simulate thermionic reactor conditions
Adhesives, coatings, coated fabrics, elastomers, encapsulants, films, hardware and structural materials, and tapes are tested in a series of physical, mechanical, and electrical tests. Material properties are measured before and after exposure to the three environments.
Modified sorption trap for use in high vacuum systems contains provisions for online regeneration of sorbent material. Trap is so constructed that it has a number of encapsulated resistance heaters and a valving and pumping device for removing gases from heated sorbing material. Excessive downtime is eliminated with this trap.
Developments in technology of encapsulating, potting, or embedding electronic modules
Compatibility tests for spacecraft construction materials by specimen encapsulation with liquid rocket propellants
Encapsulated heater forming hollow body for cathode used in ion thruster
Using ethylene oxide in preparation of sterilized solid rocket propellants and encapsulating materials
Design and operation of freeze, melt valve used in vacuum encapsulating cesium for thermionic diodes
Vacuum encapsulation of cesium for out-of-core thermionic diodes
Ethylene oxide sterilization and encapsulating process for sterile preservation of instruments and solid propellants