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The Photonics group top level processes regarding development and qualification of space flight hardware for optoelectronic components and optical systems along with our contributions and successes with LIDAR systems, space flight reliability heritage, and our testing capabilities are conveyed with this power point presentation.
Replacement of MnO2 with conductive polymers as cathode materials in chip tantalum capacitors allows for a substantial reduction of the equivalent series resistance (ESR), improvement of frequency characteristics, and elimination of the possibility of ignition during failures. One of the drawbacks of chip polymer tantalum capacitors (CPTCs) is a relatively poor long-term stability at high temperatures. In this work, variations of capacitance, dissipation factor, and ESR in different types of capacitors including automotive grade parts from three manufacturers have been monitored during storage at temperatures from 100 ºC to 175 ºC for up to 18,000 hours. Results show that ESR is the most and capacitance the least sensitive to degradation parameter. Times to parametric failures have been simulated using a Weibull-Arrhenius model that allowed for assessments of activation energies of the degradation and prediction of times to failure at the use temperature. Degradation of CPTCs was explained by thermo-oxidative processes in conductive polymers that result in exponential increasing of the resistivity with time of ageing. This process starts after a certain incubation period that depends on packaging materials and design and corresponds to the time that is necessary to form delamination between the encapsulating molding compound and lead frame. The effectiveness of the existing qualification procedures to assure stable operation of CPTCs is discussed.
Replacement of MnO2 with conductive polymers as cathode materials in chip tantalum capacitors allows for a substantial reduction of the equivalent series resistance (ESR), improvement of frequency characteristics, and elimination of the possibility of ignition during failures. One of the drawbacks of chip polymer tantalum capacitors (CPTCs) is a relatively poor long-term stability at high temperatures. In this work, variations of capacitance, dissipation factor, and ESR in different types of capacitors including automotive grade parts from three manufacturers have been monitored during storage at temperatures from 100 ºC to 175 ºC for up to 18,000 hours. Results show that ESR is the most and capacitance the least sensitive to degradation parameter. Times to parametric failures have been simulated using a Weibull-Arrhenius model that allowed for assessments of activation energies of the degradation and prediction of times to failure at the use temperature. Degradation of CPTCs was explained by thermo-oxidative processes in conductive polymers that result in exponential increasing of the resistivity with time of ageing. This process starts after a certain incubation period that depends on packaging materials and design and corresponds to the time that is necessary to form delamination between the encapsulating molding compound and lead frame. The effectiveness of the existing qualification procedures to assure stable operation of CPTCs is discussed.
The Photonics group top level processes regarding development and qualification of space flight hardware for optoelectronic components and optical systems along with our contributions and successes with LIDAR systems, space flight reliability heritage, and our testing capabilities are conveyed with this power point presentation.
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The Spallation Neutron Source (SNS) Drift Tube Linac (DTL) employs iris couplers to efficiently deliver RF power into the accelerating structure. To support the development, tuning, and high‑power conditioning of these couplers prior to installation in the actual DTLs, a dedicated test cavity and an iris‑to‑coaxial transition structure have been designed. This work presents the electromagnetic design, simulation, and optimization of the test setup, enabling precise characterization of the iris coupler’s performance. The transition structure allows for tuning of the iris opening dimensions without requiring a waveguide taper or full‑size waveguide transitions, while maintaining impedance matching between the coaxial feed and the iris geometry to minimize reflection and power loss. During low‑power tests, the iris opening di-mensions can be evaluated using the iris‑to‑coax transi-tion attached to the test cavity. For high‑power condi-tioning, full‑size waveguides with ceramic vacuum win-dows are connected to the test cavity to replicate opera-tional conditions. Key design parameters were optimized using computer-aided simulation, and sensitivity studies were conducted to assess the impact of mechanical toler-ances on RF performance. The resulting test platform provides a reliable and efficient means for tuning and validating iris couplers, contributing to improved opera-tional stability in the SNS DTL.
This paper affirms that the quantification of life-critical software reliability is infeasible using statistical methods, whether these methods are applied to standard software or fault-tolerant software. The classical methods of estimating reliability are shown to lead to exorbitant amounts of testing when applied to life-critical software. Reliability growth models are examined and also shown to be incapable of overcoming the need for excessive amounts of testing. The key assumption of software fault tolerance - separately programmed versions fail independently - is shown to be problematic. This assumption cannot be justified by experimentation in the ultrareliability region, and subjective arguments in its favor are not sufficiently strong to justify it as an axiom. Also, the implications of the recent multiversion software experiments support this affirmation.
This paper affirms that the quantification of life-critical software reliability is infeasible using statistical methods whether applied to standard software or fault-tolerant software. The classical methods of estimating reliability are shown to lead to exhorbitant amounts of testing when applied to life-critical software. Reliability growth models are examined and also shown to be incapable of overcoming the need for excessive amounts of testing. The key assumption of software fault tolerance separately programmed versions fail independently is shown to be problematic. This assumption cannot be justified by experimentation in the ultrareliability region and subjective arguments in its favor are not sufficiently strong to justify it as an axiom. Also, the implications of the recent multiversion software experiments support this affirmation.
Results concerning the research on photomultiplier tubes required for the HEAO program are reported. The general specifications are discussed for providing a series of tests for helping the operational reliability of its application, and for permitting comparison of performance of similar types, from various manufacturers.
The development was initiated of the Probabilistic Design Analysis (PDA) Process for rocket engines. This will enable engineers a quantitative assessment of calculated reliability during the design process. The PDA will help choose better designs, make them more robust, and help decide on critical tests to help demonstrate key reliability issues to aid in improving the confidence of the engine capabilities. Rockedyne's involvement with the Composite Loads Spectra (CLS) and Probabilistic Structural Analysis Methodology (PSAM) contracts started this effort and are key elements in the on-going developments. Internal development efforts and hardware applications complement and extend the CLS and PSAM efforts. The completion of the CLS option work and the follow-on PSAM developments will also be integral parts of this methodology. A brief summary of these efforts is presented.
The objective of the task reported herein was to define, evaluate, and optimize variable geometry concepts suitable for use with a Rich-Quench-Lean (RQL) combustor. The specific intent was to identify approaches that would satisfy High Speed Civil Transport (HSCT) cycle operational requirements with regard to fuel-air ratio turndown capability, ignition, and stability margin without compromising the stringent emissions, performance, and reliability goals that this combustor would have to achieve. Four potential configurations were identified and three of these were refined and tested in a high-pressure modular RQL combustor rig. The tools used in the evolution of these concepts included models built with rapid fabrication techniques that were tested for airflow characteristics to confirm sizing and airflow management capability, spray patternation, and atomization characterization tests of these models and studies that were supported by Computational Fluid Dynamics analyses. Combustion tests were performed with each of the concepts at supersonic cruise conditions and at other critical conditions in the flight envelope, including the transition points of the variable geometry system, to identify performance, emissions, and operability impacts. Based upon the cold flow characterization, emissions results, acoustic behavior observed during the tests and consideration of mechanical, reliability, and implementation issues, the tri-swirler configuration was selected as the best variable geometry concept for incorporation in the RQL combustor evolution efforts for the HSCT.
The next generation of planetary exploration vehicles will rely heavily on robust aero-assist technologies, especially those that include aerocapture. This paper provides an overview of an ongoing development program, led by NASA Langley Research Center (LaRC) and aimed at introducing high-temperature structures, adhesives, and advanced thermal protection system (TPS) materials into the aeroshell design process. The purpose of this work is to demonstrate TPS materials that can withstand the higher heating rates of NASA's next generation planetary missions, and to validate high-temperature structures and adhesives that can reduce required TPS thickness and total aeroshell mass, thus allowing for larger science payloads. The effort described consists of parallel work in several advanced aeroshell technology areas. The areas of work include high-temperature adhesives, high-temperature composite materials, advanced ablator (TPS) materials, sub-scale demonstration test articles, and aeroshell modeling and analysis. The status of screening test results for a broad selection of available higher-temperature adhesives is presented. It appears that at least one (and perhaps a few) adhesives have working temperatures ranging from 315-400 C (600-750 F), and are suitable for TPS-to-structure bondline temperatures that are significantly above the traditional allowable of 250 C (482 F). The status of mechanical testing of advanced high-temperature composite materials is also summarized. To date, these tests indicate the potential for good material performance at temperatures of at least 600 F. Application of these materials and adhesives to aeroshell systems that incorporate advanced TPS materials may reduce aeroshell TPS mass by 15% - 30%. A brief outline is given of work scheduled for completion in 2006 that will include fabrication and testing of large panels and subscale aeroshell test articles at the Solar-Tower Test Facility located at Kirtland AFB and operated by Sandia National Laboratories. These tests are designed to validate aeroshell manufacturability using advanced material systems, and to demonstrate the maintenance of bondline integrity at realistically high temperatures and heating rates. Finally, a status is given of ongoing aeroshell modeling and analysis efforts which will be used to correlate with experimental testing, and to provide a reliable means of extrapolating to performance under actual flight conditions. The modeling and analysis effort includes a parallel series of experimental tests to determine TSP thermal expansion and other mechanical properties which are required for input to the analysis models.
In this project we have proposed to investigate a number of experimental and theoretical issues associated with the practical use of multi-version software in providing dependable software through fault-avoidance and fault-elimination, as well as run-time tolerance of software faults. In the period reported here we have working on the following: We have continued collection of data on the relationships between software faults and reliability, and the coverage provided by the testing process as measured by different metrics (including data flow metrics). We continued work on software reliability estimation methods based on non-random sampling, and the relationship between software reliability and code coverage provided through testing. We have continued studying back-to-back testing as an efficient mechanism for removal of uncorrelated faults, and common-cause faults of variable span. We have also been studying back-to-back testing as a tool for improvement of the software change process, including regression testing. We continued investigating existing, and worked on formulation of new fault-tolerance models. In particular, we have partly finished evaluation of Consensus Voting in the presence of correlated failures, and are in the process of finishing evaluation of Consensus Recovery Block (CRB) under failure correlation. We find both approaches far superior to commonly employed fixed agreement number voting (usually majority voting). We have also finished a cost analysis of the CRB approach.
Some basic methods used in reliability analysis are problematic because they produce incorrect and overoptimistic predictions. Initially gratifying forecasts are often invalidated by testing and operational experience. The problematic methods in reliability analysis include estimating the system failure rate as the sum of component failure rates, assuming that reliability growth continues indefinitely during testing, overestimating the benefits of redundancy, and using the fault tolerance count instead of a detailed reliability analysis. Reliability analysis can produce more optimism than accuracy. This bug may now be a feature. The optimistic bias inevitable in project planning should be corrected by realistic reliability analysis that reflects relevant experience. That the repeated poor performance of reliability analysis is found to be surprising suggests willful blindness. Rigorous methods and impartial critical review are necessary to improve reliability analysis.
Some basic methods used in reliability analysis are problematic because they produce incorrect and overoptimistic predictions. Initially gratifying forecasts are often invalidated by testing and operational experience. The problematic methods in reliability analysis include estimating the system failure rate as the sum of component failure rates, assuming that reliability growth continues indefinitely during testing, overestimating the benefits of redundancy, and using the fault tolerance count instead of a detailed reliability analysis. Reliability analysis can produce more optimism than accuracy. This bug may now be a feature. The optimistic bias inevitable in project planning should be corrected by realistic reliability analysis that reflects relevant experience. That the repeated poor performance of reliability analysis is found to be surprising suggests willful blindness. Rigorous methods and impartial critical review are necessary to improve reliability analysis.
Proceedings of a seminar on microprocessors and associated large scale integrated (LSI) circuits are presented. The potential for commonality of device requirements, candidate processes and mechanisms for qualifying candidate LSI technologies for high reliability applications, and specifications for testing and testability were among the topics discussed. Various programs and tentative plans of the participating organizations in the development of high reliability LSI circuits are given.
JPL, in a partnership with an industrial consortium, is currently engaged in the investigation of reliability and quality issues if ball grid array (BGA) packages as they may be applied to space flight electronics. Performing tests to determine the solder joint reliability of assemblies using BGAs under temperature cycling has proved to be a real challenge for test engineers.
Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.