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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Microstructural Comparisons of Ultra-Thin Cu Films Deposited by Ion-Beam and dc-Magnetron Sputtering
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Structure and Electrocatalysis of Sputtered RuPt Thin-film Electrodes
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Low Pressure Crossed Field Vacuum Sputtering of Thin Films for Multipactor Suppression Using a Simple Diode Array
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Reactive Sputtering-Thinning of Large Diamonds While Preserving Excellent Crystalline Perfection
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Design and Construction of a Small Electromagnetron for Sputtering Use (Superceded by SLAC-Reprint-1985-002)
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X-Ray Photoelectron Spectroscopy Study of the Difference between Reactively Evaporated and Direct Sputter-Deposited TiN Films and Their Oxidation Properties
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Phase Separation in Sputtered Amorphous Metal-Germanium Alloys
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Diode Sputter Ion Pump Speed for Hydrogen and Nitrogen as a Function of Axial and Transverse Magnetic Fields up to 1.2 Tesla
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MANUFACTURING AND PACKAGING OF RELIABLE BIALKALI PHOTOCATHODES VIA SPUTTERING
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Stress control of RF sputter deposition of piezoelectric Sc0.125Al0.875N.
Abstract not provided.
The Effect of Argon Ion Sputtering on Uranium Hydride Initiation Time
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Low sputtering, cross-field, gas switch and method of operation
A gas switch includes a gas-tight housing containing an ionizable gas, an anode disposed within the gas-tight housing, and a cathode disposed within the gas-tight housing, where the cathode includes a conduction surface. The gas switch also includes a control grid positioned between the anode and the cathode, where the control grid is arranged to receive a bias voltage to establish a conducting plasma between the anode and the cathode. In addition, the gas switch includes a plurality of magnets selectively arranged to generate a magnetic field proximate the conduction surface that reduces the kinetic energy of charged particles striking the conduction surface and raises the conduction current density at the cathode surface to technically useful levels.
High-Temperature Annealing of Sputtered ScAlN Films for Lattice-Matched AlGaN Epitaxy.
Abstract not provided.
Unstable propagating reactions in sputter-deposited nanolaminates.
Abstract not provided.
MANUFACTURING AND PACKAGING OF RELIABLE BIALKALI PHOTOCATHODES VIA SPUTTERING
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Tungsten–carbon surface evolution and erosion modeling for a small angle slot divertor in DIII-D
Abstract We modeled tungsten–carbon mixed surface evolution, sputtering erosion, and transport for the tungsten coated region of a small angle slot (SAS) divertor design for the DIII-D tokamak. This divertor concept aims to achieve a closed slot dissipative plasma to minimize heat load and surface erosion, and to study high- Z material performance. Our advanced simulations use coupled ITMC-DYN material mixing/response and 3D full kinetic REDEP/WBC erosion/redeposition code packages, with divertor plasma solution from the SOLPS-ITER package with 4 MW power input. The SAS design geometry and resulting in-slot plasma parameters cause significant differences in predicted sputter/transport from a conventional divertor. For 2% C/D incident plasma ratio, an equilibrium mixed C/W surface is attained at ∼30 s of discharge, from wall sputtered carbon transported to the 10 cm long tungsten divertor region. Tungsten remains exposed to the plasma, but the evolved surface composition varies with different C/D ratios. Tungsten is primarily sputtered from the mixed surface by impinging carbon ions in the +1 to +4 charge states, with some self-sputtering. Redeposition of sputtered tungsten to the divertor is significant, ∼80% along the higher plasma temperature attached plasma SAS entrance region, but this is less than the typically near-unity values for a conventional divertor. Plasma-incident carbon is highly backscattered (∼50%) from the mixed surface, with little redeposition (<10%); this helps maintain tungsten in the surface sputter zone. Carbon is mainly sputtered from the mixed surface by D + ions, also with low redeposition (∼10%–30%). Finally, the modeling shows non-zero but low sputtered tungsten current from the divertor to the core plasma direction. These results appear favorable for effective testing of a tungsten-containing SAS divertor in DIII-D, and extrapolation of mixed-material evolution/response findings to the analogous low- Z /high- Z , Be/W, ITER plasma facing system.
A linked-scale coupled model of mass erosion and redistribution in plasma-exposed micro-foam surfaces
Surface evolution due to exposure to harsh environments is of importance in many scientific and technological applications. In plasma-exposed materials, the surface receives charged particles from the plasma, leading to a series of processes that drive the system far from equilibrium and may lead to the severe deterioration of the surface properties. Although surface morphological changes are driven by atomic collisions taking place over picoseconds and nanometers, these processes result in mass loss and redistribution of matter over much larger length and time scales. This necessitates a multi-scale approach capable of capturing the range of processes linking primary atomic collision events with engineering-level surface geometry changes. In this paper, we develop a computational model to simulate the morphological evolution and effective erosion rate of micro-architected tungsten foams during low-energy plasma ion bombardment. Furthermore, the model acts on several length scales, with the energy and angular dependence of the sputtering yield of flat tungsten surfaces determined using the SRIM code based on the binary collision approximation. This information is introduced into a low-fluence, short-term Monte Carlo raytracing model, and further into a high-fluence, long-term particle transport model. In the latter, material particles representing billions of atoms are described in a digitized 3-D representation of the foam structure from X-ray tomography data, and are sputtered off and redeposited using the atomistic information. We show that the redeposition of sputtered atoms leads to partial self-healing in the bottom layers with a sharp reduction in the sputtering coefficient of low density foams, roughly 25% of the solid W value. This is in qualitative agreement with recent experiments on low porosity W structures. At high fluence, the foam structure degrades considerably as there are fewer ligaments available to recapture sputtered atoms and, consequently, the sputtering rate increases again.