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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2004

Application of Thermo-Mechanical Measurements of Plastic Packages for Reliability Evaluation of PEMS

Thermo-mechanical analysis (TMA) is typically employed for measurements of the glass transition temperature (Tg) and coefficients of thermal expansion (CTE) in molding compounds used in plastic encapsulated microcircuits (PEMs). Application of TMA measurements directly to PEMs allows anomalies to be revealed in deformation of packages with temperature, and thus indicates possible reliability concerns related to thermo-mechanical integrity and stability of the devices. In this work, temperature dependencies of package deformation were measured in several types of PEMs that failed environmental stress testing including temperature cycling, highly accelerated stress testing (HAST) in humid environments, and bum-in (BI) testing. Comparison of thermo-mechanical characteristics of packages and molding compounds in the failed parts allowed for explanation of the observed failures. The results indicate that TMA of plastic packages might be used for quality evaluation of PEMs intended for high-reliability applications.

Sharma, Ashok K.↗
NASA NTRS2006

Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS

As microelectronics is scaled into the deep sub-micron regime, space and aerospace users of advanced technology CMOS are reassessing how scaling effects impact long-term product reliability. The effects of electromigration (EM), time-dependent-dielectric-breakdown (TDDB) and hot carrier degradation (HCI and NBTI) wearout mechanisms on scaled technologies and product reliability are investigated, accelerated stress testing across several technology nodes is performed, and FA is conducted to confirm the failure mechanism(s).

CMOS integrated circuits↗
NASA NTRS1976

Cardiovascular function during sustained +G/z/ stress

The development of aerospace systems capable of very high levels of positive vertical accelerators stress has created a need for a better understanding of the cardiovascular responses to acceleration. Using a canine model, the heart and cardiovascular system were instrumented to continuously measure coronary blood flow, cardiac output, left ventricular and aortic root pressure, and oxygen saturation in the aorta, coronary sinus, and right ventricle. The animals were exposed to acceleration profiles up to +6 G, 120 s at peak G; a seatback angle of 45 deg was simulated in some experiments. Radiopaque contrast medium was injected to visualize the left ventricular chamber, coronary vasculature, aorta, and branches of the aorta. The results suggest mechanisms responsible for arrhythmias which may occur, and subendocardial hemorrhage which has been reported in other animals.

Erickson, H. H.↗
NASA NTRS1972

Splanchnic blood flow and plus or minus Gx acceleration.

Experimental data show that there is a neurogenic response to acceleration stress in the front to back direction and that this response is intensified during higher accelerative forces. The afferent limb of this response is unknown but possibilities are suggested. The integrated response at high acceleration levels might serve to conserve oxygen during the stress time. The effector limb is the constriction of less critical vascular beds to preserve blood flow to the heart and brain. The concomitant increase in vagal activity causes a slowing down of the heart.

Stone, H. L.↗
NASA NTRS1980

Contact integrity testing of stress-tested silicon terrestrial solar cells

A test procedure was developed and applied to terrestrial silicon solar cells in order to determine the effect of accelerated environmental and time-temperature aging on metal contact integrity. Quantities of cells of four different manufacturers were given the contact integrity test after being subjected to accelerated stress tests that included forward bias-temperature, thermal cycle and thermal shock, power cycle, and bias-temperature humidity tests at two temperature-humidity levels. Significant effects due to certain stress tests were found for some cell types. It is concluded that cells fabricated using plated nickel/solder metallization showed significantly more serious contact integrity degradation than silver-metallized cells.

Prince, J. L.↗
NASA NTRS2010

Scaled CMOS Technology Reliability Users Guide

The desire to assess the reliability of emerging scaled microelectronics technologies through faster reliability trials and more accurate acceleration models is the precursor for further research and experimentation in this relevant field. The effect of semiconductor scaling on microelectronics product reliability is an important aspect to the high reliability application user. From the perspective of a customer or user, who in many cases must deal with very limited, if any, manufacturer's reliability data to assess the product for a highly-reliable application, product-level testing is critical in the characterization and reliability assessment of advanced nanometer semiconductor scaling effects on microelectronics reliability. A methodology on how to accomplish this and techniques for deriving the expected product-level reliability on commercial memory products are provided.Competing mechanism theory and the multiple failure mechanism model are applied to the experimental results of scaled SDRAM products. Accelerated stress testing at multiple conditions is applied at the product level of several scaled memory products to assess the performance degradation and product reliability. Acceleration models are derived for each case. For several scaled SDRAM products, retention time degradation is studied and two distinct soft error populations are observed with each technology generation: early breakdown, characterized by randomly distributed weak bits with Weibull slope (beta)=1, and a main population breakdown with an increasing failure rate. Retention time soft error rates are calculated and a multiple failure mechanism acceleration model with parameters is derived for each technology. Defect densities are calculated and reflect a decreasing trend in the percentage of random defective bits for each successive product generation. A normalized soft error failure rate of the memory data retention time in FIT/Gb and FIT/cm2 for several scaled SDRAM generations is presented revealing a power relationship. General models describing the soft error rates across scaled product generations are presented. The analysis methodology may be applied to other scaled microelectronic products and their key parameters.

Microelectronics Reliability↗
NASA NTRS1972

Advance techniques for monitoring human tolerance to +Gz accelerations.

Standard techniques for monitoring the acceleration-stressed human subject have been augmented by measuring (1) temporal, brachial and/or radial arterial blood flow, and (2) indirect systolic and diastolic blood pressure at 60-sec intervals. Results show that the response of blood pressure to positive accelerations is complex and dependent on an interplay of hydrostatic forces, diminishing venous return, redistribution of blood, and other poorly defined compensatory reflexes.

Pelligra, R.↗
NASA NTRS1984

Assessing photovoltaic module life from long-term environmental tests

An assessment is made of results obtained by an experimental program having as its aim the identification of critical temperature-humidity bias degradation mechanisms in solar cell modules intended to have an operating lifetime of the order of 20-30 years. These mechanisms are studied in the context of conditions encountered over the course of long term operation in various sites in the U.S. Accelerated tests for the assessment of product lifetime entail the development of a correlation between test and application conditions; this has been accomplished through an analytical procedure for the correlation of time-varying field exposures to constant-stress accelerated environments.

Otth, D. H.↗
NASA NTRS2006

Accelerated Life Structural Benchmark Testing for a Stirling Convertor Heater Head

For proposed long-duration NASA Space Science missions, the Department of Energy, Lockheed Martin, Infinia Corporation, and NASA Glenn Research Center are developing a high-efficiency, 110 W Stirling Radioisotope Generator (SRG110). A structurally significant limit state for the SRG110 heater head component is creep deformation induced at high material temperature and low stress level. Conventional investigations of creep behavior adequately rely on experimental results from uniaxial creep specimens, and a wealth of creep data is available for the Inconel 718 material of construction. However, the specified atypical thin heater head material is fine-grained with a heat treatment that limits precipitate growth, and little creep property data for this microstructure is available in the literature. In addition, the geometry and loading conditions apply a multiaxial stress state on the component, far from the conditions of uniaxial testing. For these reasons, an extensive experimental investigation is ongoing to aid in accurately assessing the durability of the SRG110 heater head. This investigation supplements uniaxial creep testing with pneumatic testing of heater head-like pressure vessels at design temperature with stress levels ranging from approximately the design stress to several times that. This paper presents experimental results, post-test microstructural analyses, and conclusions for four higher-stress, accelerated life tests. Analysts are using these results to calibrate deterministic and probabilistic analytical creep models of the SRG110 heater head.

Krause, David L.↗
NASA NTRS1980

Stress corrosion cracking evaluation of martensitic precipitation hardening stainless steels

The resistance of the martensitic precipitation hardening stainless steels PH13-8Mo, 15-5PH, and 17-4PH to stress corrosion cracking was investigated. Round tensile and c-ring type specimens taken from several heats of the three alloys were stressed up to 100 percent of their yield strengths and exposed to alternate immersion in salt water, to salt spray, and to a seacoast environment. The results indicate that 15-5PH is highly resistant to stress corrosion cracking in conditions H1000 and H1050 and is moderately resistant in condition H900. The stress corrosion cracking resistance of PH13-8Mo and 17-4PH stainless steels in conditions H1000 and H1050 was sensitive to mill heats and ranged from low to high among the several heats included in the tests. Based on a comparison with data from seacoast environmental tests, it is apparent that alternate immersion in 3.5 percent salt water is not a suitable medium for accelerated stress corrosion testing of these pH stainless steels.

Humphries, T. S.↗
NASA NTRS2010

Composite Overwrapped Pressure Vessels (COPV): Developing Flight Rationale for the Space Shuttle Program

Introducing composite vessels into the Space Shuttle Program represented a significant technical achievement. Each Orbiter vehicle contains 24 (nominally) Kevlar tanks for storage of pressurized helium (for propulsion) and nitrogen (for life support). The use of composite cylinders saved 752 pounds per Orbiter vehicle compared with all-metal tanks. The weight savings is significant considering each Shuttle flight can deliver 54,000 pounds of payload to the International Space Station. In the wake of the Columbia accident and the ensuing Return to Flight activities, the Space Shuttle Program, in 2005, re-examined COPV hardware certification. Incorporating COPV data that had been generated over the last 30 years and recognizing differences between initial Shuttle Program requirements and current operation, a new failure mode was identified, as composite stress rupture was deemed credible. The Orbiter Project undertook a comprehensive investigation to quantify and mitigate this risk. First, the engineering team considered and later deemed as unfeasible the option to replace existing all flight tanks. Second, operational improvements to flight procedures were instituted to reduce the flight risk and the danger to personnel. Third, an Orbiter reliability model was developed to quantify flight risk. Laser profilometry inspection of several flight COPVs identified deep (up to 20 mil) depressions on the tank interior. A comprehensive analysis was performed and it confirmed that these observed depressions were far less than the criterion which was established as necessary to lead to liner buckling. Existing fleet vessels were exonerated from this failure mechanism. Because full validation of the Orbiter Reliability Model was not possible given limited hardware resources, an Accelerated Stress Rupture Test of a flown flight vessel was performed to provide increased confidence. A Bayesian statistical approach was developed to evaluate possible test results with respect to the model credibility and thus flight rationale for continued operation of the Space Shuttle with existing flight hardware. A non-destructive evaluation (NDE) technique utilizing Raman Spectroscopy was developed to directly measure the overwrap residual stress state. Preliminary results provide optimistic results that patterns of fluctuation in fiber elastic strains over the outside vessel surface could be directly correlated with increased fiber stress ratios and thus reduced reliability.

Kezirian, Michael T.↗
NASA NTRS2002

Evaluation of Data Retention and Imprint Characteristics of FRAMs Under Environmental Stresses for NASA Applications

A major reliability issue for all advanced nonvolatile memory (NVM) technology devices including FRAMs is the data retention characteristics over extended period of time, under environmental stresses and exposure to total ionizing dose (TID) radiation effects. For this testing, 256 Kb FRAMs in 28-pin plastic DIPS, rated for industrial grade temperature range of -40 C to +85 C, were procured. These are two-transistor, two-capacitor (2T-2C) design FRAMs. In addition to data retention characteristics, the parts were also evaluated for imprint failures, which are defined as the failure of cells to change from a "preferred" state, where it has been for a significant period of time to an opposite state (e.g., from 1 to 0, or 0 to 1). These 256 K FRAMs were subjected to scanning acoustic microscopy (C-SAM); 1,000 temperature cycles from -65 C to +150 C; high temperature aging at 150 C, 175 C, and 200 C for 1,000 hours; highly accelerated stress test (HAST) for 500 hours; 1,000 hours of operational life test at 125 C; and total ionizing dose radiation testing. As a preconditioning, 10 K read/write cycles were performed on all devices. Interim electrical measurements were performed throughout this characterization, including special imprint testing and final electrical testing. Some failures were observed during high temperature aging test at 200 C, during HAST testing, and during 1,000 hours of operational life at 125 C. The parts passed 10 Krad exposure, but began showing power supply current increases during the dose increment from 10 Krad to 30 Krad, and at 40 Krad severe data retention and parametric failures were observed. Failures from various environmental group testing are currently being analyzed.

Sharma, Asbok K.↗