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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5

Polyimides Made From 3,5-Diaminobenzotrifluoride

Polyimides synthesized from 3,5-diaminobenzotrifluoride (DABTF). One monomer of major importance in preparing these high-temperature polymers is 1,3-phenylenediamine (mPDA). Fluorinated polyimides exhibit characteristics potentially attractive for aerospace and electronic applications. Includes optical transparency, solubility in common polar solvents, enhanced thermo-oxidative stability, low dielectric constants, and high glass-transition temperatures. Polyimides also used to form free-standing films, coatings, and moldings.

St. Clair, Terry L.↗

NASA/CARES dual-use ceramic technology spinoff applications

NASA has developed software that enables American industry to establish the reliability and life of ceramic structures in a wide variety of 21st Century applications. Designing ceramic components to survive at higher temperatures than the capability of most metals and in severe loading environments involves the disciplines of statistics and fracture mechanics. Successful application of advanced ceramics material properties and the use of a probabilistic brittle material design methodology. The NASA program, known as CARES (Ceramics Analysis and Reliability Evaluation of Structures), is a comprehensive general purpose design tool that predicts the probability of failure of a ceramic component as a function of its time in service. The latest version of this software, CARESALIFE, is coupled to several commercially available finite element analysis programs (ANSYS, MSC/NASTRAN, ABAQUS, COSMOS/N4, MARC), resulting in an advanced integrated design tool which is adapted to the computing environment of the user. The NASA-developed CARES software has been successfully used by industrial, government, and academic organizations to design and optimize ceramic components for many demanding applications. Industrial sectors impacted by this program include aerospace, automotive, electronic, medical, and energy applications. Dual-use applications include engine components, graphite and ceramic high temperature valves, TV picture tubes, ceramic bearings, electronic chips, glass building panels, infrared windows, radiant heater tubes, heat exchangers, and artificial hips, knee caps, and teeth.

Powers, Lynn M.↗

Space Station Environmental Control and Life Support Systems: An Update on Waste Water Reclamation

Since the mid-1980's, work has been ongoing In the development of the various environmental control and life support systems (ECLSS) for the space station. Part of this effort has been focused on the development of a new subsystem to reclaim waste water that had not been previously required for shuttle missions. Because of the extended manned missions proposed, reclamation of waste water becomes imperative to avoid the weight penalties associated with resupplying a crew's entire water needs for consumption and daily hygiene. Hamilton Standard, under contract to Boeing Aerospace and Electronics, has been designing the water reclamation system for space station use. Since June of 1991, Hamilton Standard has developed a combined water processor capable of reclaiming potable quality water from waste hygiene water, used laundry water, processed urine, Shuttle fuel cell water, humidity condensate and other minor waste water sources. The system was assembled and then tested with over 27,700 pounds of 'real' waste water. During the 1700 hours of system operation required to process this waste water, potable quality water meeting NASA and Boeing specifications was produced. This paper gives a schematic overview of the system, describes the test conditions and test results and outlines the next steps for system development.

Ferner, Kathleen M.↗

Surface Evaluation by X-Ray Photoelectron Spectroscopy of High Performance Polyimide Foams After Exposure to Oxygen Plasma

Aromatic polyimides have been attractive in the aerospace and electronics industries for applications such as cryogenic insulation, flame retardant panels and structural subcomponents. Newer to the arena of polyimides is the synthesis of polyimide foams and their applications. In the present work, three different, closely related, polyimide foams developed by NASA Langley Research Center (LaRC) are studied by X-ray Photoelectron Spectroscopy (XPS) after exposure to radio frequency generated Oxygen Plasma. Although polyimide films exposure to atomic oxygen and plasma have been studied previously and reported, the data relate to films and not foams. Foams have much more surface area and thus present new information to be explored. Understanding degradation mechanisms and properties versus structure, foam versus solid is of interest and fundamental to the application and protection of foams exposed to atomic oxygen in Low Earth Orbit (LEO).

Melendez, Orlando↗

Radio Frequency Interference (RFI) Products on the Aquarius Website

Aquarius has produced maps of salinity by measuring Earth’s natural emissions at L-band. However, measurements made by its instruments are affected by the presence of Radio Frequency Interference (RFI). For this reason, RFI detection algorithms had been implemented, both for the radiometer and the scatterometer, in order to reduce the impact of RFI on science data. In an effort to improve understanding of L-band RFI, the Aquarius mission has generated a new series of products. This contribution presents how these products were produced as well as the information that they contain. These products will be available starting at the end of January 2018 on the Aquarius website.

Radio Frequency Interference↗

Safe Tracking Control of an Uncertain Euler-Lagrange System with Full-State Constraints using Barrier Functions

This paper presents a novel, safe tracking control design method that learns the parameters of an uncertain Euler-Lagrange (EL) system online using adaptive learning laws. A barrier function (BF) is first used to transform the full-state constrained EL-dynamics into an equivalent unconstrained dynamics. An adaptive tracking controller is then developed along with the parameter update law in the transformed state space such that the states remain bounded for all time within a prescribed bound. A stability analysis is developed that considers the EL-dynamics’ uncertainty, yielding a semi-globally uniformly ultimately bounded (SGUUB) tracking error and the parameter estimation error. The controller design is validated in simulations using a two-link planar manipulator. The results show the proposed method’s ability to track the reference trajectory while remaining inside each of the predefined state bounds.

Robots↗

Actively controlled shaft seals for aerospace applications

An electronically controlled mechanical seal for use as the purge gas seal in a liquid oxygen turbo pump has been fabricated and tested under transient operating conditions. The thickness of the lubricating film is controlled by adjusting the coning of the carbon face. This is accomplished by applying a voltage to a piezoelectric actuator to which the carbon face is bonded. The seal has been operated with a closed-loop control system that utilizes either the leakage rate or the seal face temperature as the feedback. Both speed and pressure transients have been imposed on the seal. The transient tests have demonstrated that the seal is capable of maintaining low leakage rates while limiting the face temperatures.

Salant, Richard F.↗

Thermally Stable Ohmic Contacts on Silicon Carbide Developed for High- Temperature Sensors and Electronics

The NASA aerospace program, in particular, requires breakthrough instrumentation inside the combustion chambers of engines for the purpose of, among other things, improving computational fluid dynamics code validation and active engine behavioral control (combustion, flow, stall, and noise). This environment can be as high as 600 degrees Celsius, which is beyond the capability of silicon and gallium arsenide devices. Silicon-carbide- (SiC-) based devices appear to be the most technologically mature among wide-bandgap semiconductors with the proven capability to function at temperatures above 500 degrees Celsius. However, the contact metalization of SiC degrades severely beyond this temperature because of factors such as the interdiffusion between layers, oxidation of the contact, and compositional and microstructural changes at the metal/semiconductor interface. These mechanisms have been proven to be device killers. Very costly and weight-adding packaging schemes that include vacuum sealing are sometimes adopted as a solution.

Okojie, Robert S.↗

Electronic Components for use in Extreme Temperature Aerospace Applications

Electrical power management and control systems designed for use in planetary exploration missions and deep space probes require electronics that are capable of efficient and reliable operation under extreme temperature conditions. Space-based infra-red satellites, all-electric ships, jet engines, electromagnetic launchers, magnetic levitation transport systems, and power facilities are also typical examples where the electronics are expected to be exposed to harsh temperatures and to operate under severe thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and, therefore, new parts must be developed or the conventional devices need to be modified. For example, spacecraft operating in the cold environment of deep space carry a large number of radioisotope heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. At the other end, built-in radiators and coolers render the operation of electronics possible under hot conditions. These thermal measures lead to design complexity, affect development costs, and increase size and weight. Electronics capable of operation at extreme temperatures, thus, will not only tolerate the hostile operational environment, but also make the overall system efficient, more reliable, and less expensive. The Extreme Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electronics suitable for applications in the aerospace environment and deep space exploration missions. Research is being conducted on devices, including COTS parts, for potential use under extreme temperatures. These components include semiconductor switching devices, passive devices, DC/DC converters, operational amplifiers, and oscillators. An overview of the program will be presented along with some experimental findings.

Patterson, Richard L.↗

Apparel for Cleaner Clean Rooms

In the 1960s NASA pioneered contamination control technology, providing a base from which aerospace contractors could develop control measures. NASA conducted special courses for clean room technicians and supervisors, and published a series of handbooks with input from various NASA field centers. These handbooks extended aerospace experience to the medical, pharmaceutical, electronics, and other industries where extreme cleanliness is important. American Hospital Supply Company (AHSC) felt that high technology products with increasingly stringent operating requirements in aerospace, electronics, pharmaceuticals and medical equipment manufacturing demanded improvement in contamination control techniques. After studying the NASA handbooks and visiting NASA facilities, the wealth of information gathered resulted in Micro-clean non-woven garments and testing equipment and procedures for evaluating effectiveness.

Source record↗

NASA-DoD Lead-Free Electronics Project. DRAFT Joint Test Report

The use of conventional tin-lead (SnPb) in circuit board manufacturing is under ever-increasing political scrutiny due to increasing regulations concerning lead. The "Restriction of Hazardous Substances" (RoHS) directive enacted by the European Union (EU) and a pact between the United States National Electronics Manufacturing Initiative (NEMI), Europe's Soldertec at Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association (JEITA) are just two examples where worldwide legislative actions and partnerships/agreements are affecting the electronics industry. As a result, many global commercial-grade electronic component suppliers are initiating efforts to transition to lead-free (Pb-free) in order to retain their worldwide market. Pb-free components are likely to find their way into the inventory of aerospace or military assembly processes under current government acquisition reform initiatives. Inventories "contaminated" by Pb-free will result in increased risks associated with the manufacturing, product reliability, and subsequent repair of aerospace and military electronic systems. Although electronics for military and aerospace applications are not included in the RoHS legislation, engineers are beginning to find that the commercial industry's move towards RoHS compliance has affected their supply chain and changed their parts. Most parts suppliers plan to phase out their non-compliant, leaded production and many have already done so. As a result, the ability to find leaded components is getting harder and harder. Some buyers are now attempting to acquire the remaining SnPb inventory, if it's not already obsolete. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides more and more parts with Pb-free finishes-some labeled no differently than their Pb counterparts-while at the same time providing the traditional Pb parts. The longer the transition period, the greater the likelihood of Pb-free parts inadvertently being mixed with Pb parts and ending up on what are supposed to be Pb systems. As a result, OEMs, depots, and support contractors need to take action now to either abate the influx of Pb-free parts, or accept it and deal with the likely interim consequences of reduced reliability due to a wide variety of matters, such as Pb contamination, high temperature incompatibility, and tin whiskering. Allowance of Pb-free components produces one of the greatest risks to the reliability of a weapon system. This is due to new and poorly understood failure mechanisms, as well as unknown long-term reliability. If the decision is made to consciously allow Pb-free solder and component finishes into SnPb electronics, additional effort (and cost) will be required to make the significant number of changes to drawings and task order procedures. This project is a follow-on effort to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Pb-free Solder Project which was the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community.

Kessel, Kurt↗

Nuclear Materials Packaging, Transportation, and Systems Analysis Group Software Quality Assurance Plan: ANSYS Mechanical Finite Element Analysis Software Version 2023R1

ANSYS Inc. develops and markets engineering simulation software and services used in the aerospace, automotive, manufacturing, electronics, biomedical, energy, defense, and many other industries. ANSYS is dedicated to engineering simulation and is the world’s leading software provider. ANSYS was founded in 1970 and is headquartered in Canonsburg, Pennsylvania. ANSYS provides an engineering analysis tool combining structural, thermal, computational fluid dynamics, acoustic, and electromagnetic simulation capabilities. ANSYS has two main programs, which use the same solvers: (1) Mechanical APDL (ANSYS Design Parametric Language), a Fortran-based coding platform, and (2) ANSYS Workbench, which uses a graphical user interface to aid in finite element analysis implementation. This plan covers both APDL and Workbench. The ANSYS computer program is a large-scale, multipurpose finite element program that can be used to solve several classes of engineering analyses. The analysis capabilities of ANSYS include the ability to solve static and dynamic structural analyses, steady-state and transient heat transfer problems, mode-frequency and buckling eigenvalue problems, static or time-varying magnetic analyses, and various types of field and coupled-field applications. The program contains many special features that allow nonlinearities or secondary effects such as plasticity, large strain, hyperelasticity, creep, swelling, large deflections, contact, stress stiffening, temperature dependency, material anisotropy, and radiation to be included in the solution. As ANSYS has been developed, other special capabilities such as substructuring, submodeling, random vibration, kinetostatics, kinetodynamics, free convection fluid analysis, acoustics, magnetics, piezoelectrics, coupled-field analysis, and design optimization have been added to the program. These capabilities contribute further to making ANSYS a multipurpose analysis tool for varied engineering disciplines. The ANSYS program has been in commercial use for over 50 years and has been used extensively in the aerospace, automotive, construction, electronic, energy services, manufacturing, nuclear, plastics, oil, and steel industries. Additionally, many consulting firms and hundreds of universities have used ANSYS for analysis, research, and educational purposes. ANSYS is recognized worldwide as one of the most widely used and capable programs of its type. Ansys design analysis software is the first created within a quality system with ISO 9001 certification, the internationally accepted quality standard. Product development, testing, maintenance and support processes also meet the United States Nuclear Regulatory Commission's quality requirements, as they have for nearly four decades. The Quality Assurance Service Agreement is suitable for the customers working in the nuclear industry who need to meet specific federal regulations including 10CRF50 Appendix B and provisions of 10CFR21. ANSYS has retained its original International Organization for Standardization (ISO) 9001 accreditation certificate since1995-05-04, It’s current certificate is valid until 2027-05-29.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

The NASA Electronic Parts and Packaging (NEPP) Program - Presentation to Korean Aerospace Research Institute

This presentation will provide basic information about NASA's Electronic Parts and Packaging Program (NEPP), for sharing with representatives of the South Korean Aerospace Research Institute (KARI) as part of a larger presentation by Headquarters Office of Safety and Mission Assurance. The NEPP information includes mission and goals, history of the program, basic focus areas, strategies, deliverables and some examples of current tasks.

Technology Challenges↗

Development of Collaborative Research Initiatives to Advance the Aerospace Sciences-via the Communications, Electronics, Information Systems Focus Group

The primary goal of the Adaptive Vision Laboratory Research project was to develop advanced computer vision systems for automatic target recognition. The approach used in this effort combined several machine learning paradigms including evolutionary learning algorithms, neural networks, and adaptive clustering techniques to develop the E-MOR.PH system. This system is capable of generating pattern recognition systems to solve a wide variety of complex recognition tasks. A series of simulation experiments were conducted using E-MORPH to solve problems in OCR, military target recognition, industrial inspection, and medical image analysis. The bulk of the funds provided through this grant were used to purchase computer hardware and software to support these computationally intensive simulations. The payoff from this effort is the reduced need for human involvement in the design and implementation of recognition systems. We have shown that the techniques used in E-MORPH are generic and readily transition to other problem domains. Specifically, E-MORPH is multi-phase evolutionary leaming system that evolves cooperative sets of features detectors and combines their response using an adaptive classifier to form a complete pattern recognition system. The system can operate on binary or grayscale images. In our most recent experiments, we used multi-resolution images that are formed by applying a Gabor wavelet transform to a set of grayscale input images. To begin the leaming process, candidate chips are extracted from the multi-resolution images to form a training set and a test set. A population of detector sets is randomly initialized to start the evolutionary process. Using a combination of evolutionary programming and genetic algorithms, the feature detectors are enhanced to solve a recognition problem. The design of E-MORPH and recognition results for a complex problem in medical image analysis are described at the end of this report. The specific task involves the identification of vertebrae in x-ray images of human spinal columns. This problem is extremely challenging because the individual vertebra exhibit variation in shape, scale, orientation, and contrast. E-MORPH generated several accurate recognition systems to solve this task. This dual use of this ATR technology clearly demonstrates the flexibility and power of our approach.

Knasel, T. Michael↗

Pb-free microelectronics assembly in aerospace applications

In this paper we provide a snapshot of the commericial industry trends and how they may impact electronics in the aerospace environment. Impacts will be felt in the areas of: reliability, assembly methods, cost drivers, supply chain selection and alternate materials selection.

Schoenung, Julie M.↗

Development of a Temperature Sensor for Jet Engine and Space Missions Environments

Electronic systems in aerospace and in space exploration missions are expected to encounter extreme temperatures and wide thermal swings. To address the needs for extreme temperature electronics, research efforts exist at the NASA Glenn Research Center (GRC) to develop and evaluate electronics for extreme temperature operations, and to establish their reliability under extreme temperature operation and thermal cycling; conditions that are typical of both the aerospace and space environments. These efforts are supported by the NASA Fundamental Aeronautics/Subsonic Fixed Wing Program and by the NASA Electronic Parts and Packaging (NEPP) Program. This work reports on the results obtained on the development of a temperature sensor geared for use in harsh environments.

Patterson, Richard L.↗