Auger electron spectroscopy study of surface segregation in copper-aluminum alloys
Auger electron spectroscopy study of surface segregation in copper-aluminum alloys
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Auger electron spectroscopy study of surface segregation in copper-aluminum alloys
Examination of molybdenum disulfide with LEED and Auger emission spectroscopy
Measuring Auger spectra of simple gaseous molecules
Leed and Auger electron spectroscopy study of oxygen adsorption on tungsten /110/
Friction and wear apparatus incorporating Auger cylindrical mirror spectrometer
K-LL Auger spectra of nitrogen, oxygen, carbon monoxide, nitrogen oxide, water and carbon dioxide, using double focusing electrostatic electron spectrometer
Free surface equilibrium segregation in solid solutions of Cu-Al alloys single crystals by Auger electron spectroscopy and low energy electron diffraction
Metallic transfer between polycrystalline metals in sliding contact was examined. Hemispherical riders of iron, nickel, and cobalt were slid on tungsten, tantalum, niobium, and molybdenum disks in ultrahigh vacuum. Auger emission spectroscopy was used to monitor the elemental composition of the disk surfaces. Iron, nickel, and cobalt transferred to tungsten, whereas only cobalt transferred to tantalum, niobium, and molybdenum. The results of this investigation are discussed in terms of the cohesive energy and strain hardening characteristics of the specimen materials.
Equilibrium surface segregation of aluminum in a copper-10-atomic-percent-aluminum single crystal alloy oriented in the /111/ direction was demonstrated by using Auger electron spectroscopy. This crystal was in the solid solution range of composition. Equilibrium surface segregation was verified by observing that the aluminum surface concentration varied reversibly with temperature in the range 550 to 850 K. These results were curve fitted to an expression for equilibrium grain boundary segregation and gave a retrieval energy of 5780 J/mole (1380 cal/mole) and a maximum frozen-in surface coverage three times the bulk layer concentration. Analyses concerning the relative merits of sputtering calibration and the effects of evaporation are also included.
The adhesion and transfer of polytetrafluoroethylene (PTFE) to metals in ultrahigh vacuum has been studied using Auger emission spectroscopy. The transfer was effected both by compressive static contact and by sliding contact. The transfer observed after static contact was independent of the chemical constitution of the substrate. Electron induced desorption of the fluorine in the transferred PTFE showed that the fluorine had no chemical interaction with the metal substrate. The coefficient of friction on metals was independent of the chemical constitution of the substrate. However, sliding PTFE on soft metals such as aluminum, generated wear fragments that lodged in the PTFE and machined the substrate.
Expressions for band-to-band Auger recombination, including the effects of photoinduced carriers in intrinsic photoconductors, are presented. They show good agreement with the expressions published by van Vliet (1958) and Long (1967) for g-r noise in intrinsic photoconductors for the case of band-to-band radiative recombination.
High-resolution LMM Auger spectra of Cu and Zn obtained by X-ray excitation are shown to contain fine structures which have not been reported previously. An attempt has been made to classify these fine structures in terms of pure L-S coupling of the final vacancies of the atom. The agreement between the calculated and the observed energy separations of the fine-structure lines is good within the accuracy of the Hartree-Fock approximation.
Auger electron spectroscopy was used to examine surface segregation in the binary alloys copper-1 at. % indium, copper-2 at. % tin and iron-6.55 at. % silicon. The copper-tin and copper-indium alloys were single crystals oriented with the /111/ direction normal to the surface. An iron-6.5 at. % silicon alloy was studied (a single crystal oriented in the /100/ direction for study of a (100) surface). It was found that surface segregation occurred following sputtering in all cases. Only the iron-silicon single crystal alloy exhibited equilibrium segregation (i.e., reversibility of surface concentration with temperature) for which at present we have no explanation. McLean's analysis for equilibrium segregation at grain boundaries did not apply to the present results, despite the successful application to dilute copper-aluminum alloys. The relation of solute atomic size and solubility to surface segregation is discussed. Estimates of the depth of segregation in the copper-tin alloy indicate that it is of the order of a monolayer surface film.
Various gases were adsorbed to copper, aluminum, and chromium surfaces. The gases included oxygen, hydrogen sulfide, methyl mercaptan, and sulfur dioxide. Chemisorption was conducted on static surfaces and during dynamic friction experiments. An Auger cyclindrical mirror analyzer was used to monitor surface films. The sulfur containing gases adsorbed readily to all surfaces. Exposures of as little as 0.000001 (torr)(sec) (1 langmuir) were sufficient to reduce friction. Sliding contact did not affect chemisorption of copper or aluminum but did affect chemisorption to chromium surfaces. Oxygen removed sulfur films from all surfaces at room temperature (23 C). Gaseous exposures were from 0.000001 to 0.01 (torr)(sec) (1 to 10,000 langmuirs).
The studies reported were conducted to gain a fundamental understanding of adhesion and dynamic friction on an atomic or microscopic level. Fundamental aspects of low energy electron diffraction (LEED), Auger emission spectroscopy (AES), and field ion microscopy (FIM) are discussed. Typical results of studies conducted are considered, giving attention to LEED-AES experiments, pin and disk experiments, and field ion microscope investigations.
Auger electron spectroscopy was used to examine the initial stages of oxidation of a polycrystalline copper - 19.6 a/o-aluminum alloy. The growth of the 55-eV aluminum oxide peak and the decay of the 59-, 62-, and 937-eV copper peaks were examined as functions of temperature, exposure, and pressure. Pressures ranged from 1x10 to the minus 7th power to 0.0005 torr of O2. Temperatures ranged from room temperature to 700 C. A completely aluminum oxide surface layer was obtained in all cases. Complete disappearance of the underlying 937-eV copper peak was obtained by heating at 700 C in O2 at 0.0005 torr for 1 hr. Temperature studies indicated that thermally activated diffusion was important to the oxidation studies. The initial stages of oxidation followed a logarithmic growth curve.
The sliding of polyvinyl chloride on nickel, iron and S-Monel has been studied by Auger electron spectroscopy. Polymer was not transferred to the metals, rather shear appeared to take place at the interface. The metal was progressively chlorinated as the polymer made multiple passes on the surface. The thickness of this chlorine film was the order of one atomic layer. Electron-induced desorption studies indicate that the chlorine is chemisorbed to the metal. These results are interpreted as evidence for mechanically induced and/or thermal degradation of the polymer during sliding. Degradation products of HCl and Cl2 which chemisorb to the metal are evolved near the interface.
Auger electron spectroscopy measurements performed on Skylab 2 indicate a low rate of deposition of permanent, continuous film contamination on nickel and gold surfaces positioned on the antisolar side of the spacecraft. These measurements and supportive evidence indicate that for the particular locations and orientations of these samples permanent films of less than 3 nm (30 A) thickness were deposited during an exposure of 40 hours at a temperature of approximately -32 C.