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At least 91 records · Page 5

Low Power Camera-on-a-Chip Using CMOS Active Pixel Sensor Technology

A second generation image sensor technology has been developed at the NASA Jet Propulsion Laboratory as a result of the continuing need to miniaturize space science imaging instruments. Implemented using standard CMOS, the active pixel sensor (APS) technology permits the integration of the detector array with on-chip timing, control and signal chain electronics, including analog-to-digital conversion.

Space Microelectronics Image Sensors APS Digital I↗

Low Power Camera-on-a-Chip Using CMOS Active Pixel Sensor Technology

A second generation image sensor technology has been developed at the NASA Jet Propulsion Laboratory as a result of the continuing need to miniaturize space science imaging instruments. Implemented using standard CMOS, the active pixel sensor (APS) technology permits the integration of the detector array with on-chip timing, control and signal chain electronics, including analog-to-digital conversion.

Space Microelectronics Image Sensors APS Digital I↗

Radiation Testing and Evaluation Issues for Modern Integrated Circuits

Abstract. Changes in modern integrated circuit (IC) technologies have modified the way we approach and conduct radiation tolerance and testing of electronics. These changes include scaling of geometries, new materials, new packaging technologies, and overall speed and device complexity challenges. In this short course section, we will identify and discuss these issues as they impact radiation testing, modeling, and effects mitigation of modern integrated circuits. The focus will be on CMOS-based technologies, however, other high performance technologies will be discussed where appropriate. The effects of concern will be: Single-Event Effects (SEE) and steady state total ionizing dose (TID) IC response. However, due to the growing use of opto-electronics in space systems issues concerning displacement damage testing will also be considered. This short course section is not intended to provide detailed "how-to-test" information, but simply provide a snapshot of current challenges and some of the approaches being considered.

LaBel, Kenneth A.↗

Radiation-Hard SpaceWire/Gigabit Ethernet-Compatible Transponder

A radiation-hard transponder was developed utilizing submicron/nanotechnology from IBM. The device consumes low power and has a low fabrication cost. This device utilizes a Plug-and-Play concept, and can be integrated into intra-satellite networks, supporting SpaceWire and Gigabit Ethernet I/O. A space-qualified, 100-pin package also was developed, allowing space-qualified (class K) transponders to be delivered within a six-month time frame. The novel, optical, radiation-tolerant transponder was implemented as a standalone board, containing the transponder ASIC (application specific integrated circuit) and optical module, with an FPGA (field-programmable gate array) friendly parallel interface. It features improved radiation tolerance; high-data-rate, low-power consumption; and advanced functionality. The transponder utilizes a patented current mode logic library of radiation-hardened-by-architecture cells. The transponder was developed, fabricated, and radhard tested up to 1 MRad. It was fabricated using 90-nm CMOS (complementary metal oxide semiconductor) 9 SF process from IBM, and incorporates full BIT circuitry, allowing a loop back test. The low-speed parallel LVCMOS (lowvoltage complementary metal oxide semiconductor) bus is compatible with Actel FPGA. The output LVDS (low-voltage differential signaling) interface operates up to 1.5 Gb/s. Built-in CDR (clock-data recovery) circuitry provides robust synchronization and incorporates two alarm signals such as synch loss and signal loss. The ultra-linear peak detector scheme allows on-line control of the amplitude of the input signal. Power consumption is less than 300 mW. The developed transponder with a 1.25 Gb/s serial data rate incorporates a 10-to-1 serializer with an internal clock multiplication unit and a 10-1 deserializer with internal clock and data recovery block, which can operate with 8B10B encoded signals. Three loop-back test modes are provided to facilitate the built-in-test functionality. The design is based on a proprietary library of differential current switching logic cells implemented in the standard 90-nm CMOS 9SF technology from IBM. The proprietary low-power LVDS physical interface is fully compatible with the SpaceWire standard, and can be directly connected to the SFP MSA (small form factor pluggable Multiple Source Agreement) optical transponder. The low-speed parallel interfaces are fully compatible with the standard 1.8 V CMOS input/output devices. The utilized proprietary annular CMOS layout structures provide TID tolerance above 1.2 MRad. The complete chip consumes less than 150 mW of power from a single 1.8-V positive supply source.

Katzman, Vladimir↗

Battling Brittle Bones

The accuDEXA(R) Bone Mineral Density Assessment System, manufactured by Schick Technologies, Inc., utilizes "camera on a chip" sensor technology invented and developed by NASA's Jet Propulsion Laboratory. Schick's accuDEXA system offers several advantages over traditional osteoporosis tests, which assess bone density loss in the hip and spine, and require specialized personnel to conduct. With accuDEXA, physicians can test the entire body's bone density at a peripheral site, such as the finger, without applying gels or having patients remove garments. Results are achieved in 30 seconds and printed out in less than a minute, compared to the estimated exam time of 15 minutes for hip and spine density analyses. Schick has also applied the CMOS APS technology to a new software product that performs dental radiography using up to 90 percent less radiation exposure than conventional X-rays. Called Computed Dental Radiography(R), the new digital imaging product utilizes an electronic sensor in place of X-ray film to generate sharp and clear images that appear on a computer screen within 3 seconds, and can be enlarged and enhanced to identify problems.

Source record↗

Micromechanical Broadband Infrared Sensors based on Piezoelectric Bending Resonators

There is a high demand for high-performance and low-cost uncooled infrared (IR) detectors. In order to meet this need we are investigating the use of MEMS piezoelectric resonator technology using aluminum nitride (AlN) thin films. Recent research has shown that piezoelectric resonators have the potential to be used as a core element for highly sensitive, low-noise, and low-power uncooled IR detectors. A novel design of an AlN IR sensor based on piezoelectric bending resonator is described and analyzed in this paper. The detector is constructed by using thermally mismatched materials which stress the resonator and shift the resonance frequency. The IR thermal input is sensed by monitoring the frequency shift induced by the in-plan thermal stress. These designs have the potential for very high sensitivity and are compatible with commercially viable CMOS fabrication technology.

Rais-Zadeh, Mina↗

A new VLSI complex integer multiplier which uses a quadratic-polynomial residue system with Fermat numbers

A quadratic-polynomial Fermat residue number system (QFNS) has been used to compute complex integer multiplications. The advantage of such a QFNS is that a complex integer multiplication requires only two integer multiplications. In this article, a new type Fermat number multiplier is developed which eliminates the initialization condition of the previous method. It is shown that the new complex multiplier can be implemented on a single VLSI chip. Such a chip is designed and fabricated in CMOS-pw technology.

Truong, T. K.↗

A new VLSI complex integer multiplier which uses a quadratic-polynomial residue system with Fermat numbers

A quadratic-polynomial Fermat residue number system (QFNS) has been used to compute complex integer multiplications. The advantage of such a QFNS is that a complex integer multiplication requires only two integer multiplications. In this article, a new type Fermat number multiplier is developed which eliminates the initialization condition of the previous method. It is shown that the new complex multiplier can be implemented on a single VLSI chip. Such a chip is designed and fabricated in CMOS-Pw technology.

Shyu, H. C.↗

Sequence information signal processor for local and global string comparisons

A sequence information signal processing integrated circuit chip designed to perform high speed calculation of a dynamic programming algorithm based upon the algorithm defined by Waterman and Smith. The signal processing chip of the present invention is designed to be a building block of a linear systolic array, the performance of which can be increased by connecting additional sequence information signal processing chips to the array. The chip provides a high speed, low cost linear array processor that can locate highly similar global sequences or segments thereof such as contiguous subsequences from two different DNA or protein sequences. The chip is implemented in a preferred embodiment using CMOS VLSI technology to provide the equivalent of about 400,000 transistors or 100,000 gates. Each chip provides 16 processing elements, and is designed to provide 16 bit, two's compliment operation for maximum score precision of between -32,768 and +32,767. It is designed to provide a comparison between sequences as long as 4,194,304 elements without external software and between sequences of unlimited numbers of elements with the aid of external software. Each sequence can be assigned different deletion and insertion weight functions. Each processor is provided with a similarity measure device which is independently variable. Thus, each processor can contribute to maximum value score calculation using a different similarity measure.

Peterson, John C.↗

Analysis of Single-Event Latchup Cross Section in 65 nm SRAMs

Single event latchup (SEL) in a 65 nm CMOS SRAM technology is observed and sensitivity is shown to be a strong function of lateral beam orientation, angle of incidence, and temperature. The significance of these results are discussed and the foundation for a predictive model of SEL is laid out for use with the MRED tool.

Hutson, J. M.↗

Low energy CMOS for space applications

The current focus of NASA's space flight programs reflects a new thrust towards smaller, less costly, and more frequent space missions, when compared to missions such as Galileo, Magellan, or Cassini. Recently, the concept of a microspacecraft was proposed. In this concept, a small, compact spacecraft that weighs tens of kilograms performs focused scientific objectives such as imaging. Similarly, a Mars Lander micro-rover project is under study that will allow miniature robots weighing less than seven kilograms to explore the Martian surface. To bring the microspacecraft and microrover ideas to fruition, one will have to leverage compact 3D multi-chip module-based multiprocessors (MCM) technologies. Low energy CMOS will become increasingly important because of the thermodynamic considerations in cooling compact 3D MCM implementations and also from considerations of the power budget for space applications. In this paper, we show how the operating voltage is related to the threshold voltage of the CMOS transistors for accomplishing a task in VLSI with minimal energy. We also derive expressions for the noise margins at the optimal operating point. We then look at a low voltage CMOS (LVCMOS) technology developed at Stanford University which improves the power consumption over conventional CMOS by a couple of orders of magnitude and consider the suitability of the technology for space applications by characterizing its SEU immunity.

Panwar, Ramesh↗

Optimal and Local Connectivity Between Neuron and Synapse Array in the Quantum Dot/Silicon Brain

This innovation is used to connect between synapse and neuron arrays using nanowire in quantum dot and metal in CMOS (complementary metal oxide semiconductor) technology to enable the density of a brain-like connection in hardware. The hardware implementation combines three technologies: 1. Quantum dot and nanowire-based compact synaptic cell (50x50 sq nm) with inherently low parasitic capacitance (hence, low dynamic power approx.l0(exp -11) watts/synapse), 2. Neuron and learning circuits implemented in 50-nm CMOS technology, to be integrated with quantum dot and nanowire synapse, and 3. 3D stacking approach to achieve the overall numbers of high density O(10(exp 12)) synapses and O(10(exp 8)) neurons in the overall system. In a 1-sq cm of quantum dot layer sitting on a 50-nm CMOS layer, innovators were able to pack a 10(exp 6)-neuron and 10(exp 10)-synapse array; however, the constraint for the connection scheme is that each neuron will receive a non-identical 10(exp 4)-synapse set, including itself, via its efficacy of the connection. This is not a fully connected system where the 100x100 synapse array only has a 100-input data bus and 100-output data bus. Due to the data bus sharing, it poses a great challenge to have a complete connected system, and its constraint within the quantum dot and silicon wafer layer. For an effective connection scheme, there are three conditions to be met: 1. Local connection. 2. The nanowire should be connected locally, not globally from which it helps to maximize the data flow by sharing the same wire space location. 3. Each synapse can have an alternate summation line if needed (this option is doable based on the simple mask creation). The 10(exp 3)x10(exp 3)-neuron array was partitioned into a 10-block, 10(exp 2)x10(exp 3)-neuron array. This building block can be completely mapped within itself (10,000 synapses to a neuron).

Duong, Tuan A.↗

Buried Oxide Densification for Low Power, Low Voltage CMOS Applications

Special technology and circuit architecture are of growing interest for implementation of circuits which operate at low supply voltages and consume low power levels without sacrificing performance[1]. Use of thin buried oxide SOI substrates is a primary approach to simultaneously achieve these goals. A significant aspect regarding SIMOX SOI for low voltage, low power applications is the reliability and performance of the thin buried oxide. In addition, when subjected to high total dose irradiation, the silicon islands within the BOX layer of SIMOX can store charges and significantly effect the back channel threshold voltages of devices. Thus, elimination of the islands within the buried oxide (BOX) layer is preferred in order to prevent leakage through these conductive islands and charge build-up within the buried oxide layer. A differential (2-step) ramp rate as applied to full and 100 nm BOX SIMOX was previously reported to play a significant role in the stoichiometry and island formation within the buried layer[2]. This paper focus is on the properties of a thin (120nm) buried oxide as a function of the anneal ramp rate and the temperature of anneal. In this research, we have found an improvement in the buried oxide stoichiometry with the use of a slower, singular ramp rate for specified thin buried oxides, with slower ramp rates and higher temperatures of anneal suggested for reducing the presence of Si islands within the BOX layer.

Allen, L. P.↗

Electron lithography STAR design guidelines. Part 2: The design of a STAR for space applications

The STAR design system developed by NASA enables any user with a logic diagram to design a semicustom digital MOS integrated circuit. The system is comprised of a library of standard logic cells and computr programs to place, route, and display designs implemented with cells from the library. Also described is the development of a radiation-hard array designed for the STAR system. The design is based on the CMOS silicon gate technology developed by SANDIA National Laboratories. The design rules used are given as well as the model parameters developed for the basic array element. Library cells of the CMOS metal gate and CMOS silicon gate technologies were simulated using SPICE, and the results are shown and compared.

Trotter, J. D.↗

CMOS Image Sensors: Electronic Camera On A Chip

Recent advancements in CMOS image sensor technology are reviewed, including both passive pixel sensors and active pixel sensors. On- chip analog to digital converters and on-chip timing and control circuits permit realization of an electronic camera-on-a-chip. Highly miniaturized imaging systems based on CMOS image sensor technology are emerging as a competitor to charge-coupled devices for low cost uses.

Space Microelectronics Image Sensors APS Digital I↗

Design, development, fabrication and delivery of register and multiplexer units

Several approaches for implementing the register and multiplexer unit into two CMOS monolithic chip types were evaluated. The CMOS standard cell array technique was selected and implemented. Using this design automation technology, two LSI CMOS arrays were designed, fabricated, packaged, and tested for proper static, functional, and dynamic operation. One of the chip types, multiplexer register type 1, is fabricated on a 0.143 x 0.123 inch chip. It uses nine standard cell types for a total of 54 standard cells. This involves more than 350 transistors and has the functional equivalent of 111 gates. The second chip, multiplexer register type 2, is housed on a 0.12 x 0.12 inch die. It uses 13 standard cell types, for a total of 42 standard cells. It contains more than 300 transistors, the functional equivalent of 112 gates. All of the hermetically sealed units were initially screened for proper functional operation. The static leakage and the dynamic leakage were measured. Dynamic measurements were made and recorded. At 10 V, 14 megabit shifting rates were measured on multiplexer register type 1. At 5 V these units shifted data at a 6.6 MHz rate. The units were designed to operate over the 3 to 15 V operating range and over a temperature range of -55 to 125 C.

Feller, A.↗

Nonlinear Microwave Interactions with Voltage-Gated Graphene Devices

In this dissertation, methods of fabrication and testing micro- and nano-scaled thermoelectric microwave power detectors based on graphene are explored. Initial detectors show sensitivities of 0.87 mV/mW and each chapter herein describes the iterations and improvements made to the devices. In the end, detectors have shown sensitivities of up to 60.25 mV/mW when accounting for the reflection coefficient of the device, over a 690% increase in sensitivity. Commercially-available detectors that feature zero DC power consumption and operate over similar frequency ranges typically over a power detection sensitivity of 500 mV/mW. However, state-of-the-art thermoelectric detectors based on CMOS and MEMS technologies over power detection sensitivities that are typically lower than 0.4 mV/mW. Unoptimized graphene based detectors have been shown to outperform CMOS and MEMS detectors. An outlook is provided on further optimizations that can be made to the devices.

Michael Robert Gasper↗

High-performance low-power CMOS memories using silicon-on-sapphire technology.

MOS/silicon-on-sapphire (SOS) technology is shown to permit the realization of large-scale integrated arrays that combine the best features of monolithic bipolar and MOS technologies. The perfect isolation and reduced capacitance of SOS technology make possible static MOS circuits with nearly an order-of-magnitude improvement in speed and dynamic power dissipation over their monolithic counterparts. CMOS/SOS memory arrays have been fabricated with speeds comparable to TTL bipolar memory arrays even when operated at TTL compatible levels. Quiescent power dissipation of two described arrays is typically less than 1 microwatt/bit. The SOS/MOS technology is compatible with both aluminum and self-aligned silicon-gate processing.

Boleky, E. J.↗