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At least 91 records · Page 5

A Study of Lessons and Experiences of NASA Centers in the Use of Commercial Off the Shelf (COTS) Electronics

The NASA Engineering and Safety Center (NESC) sponsored a Technical Assessment relating to the utilization of commercial-off-the-shelf (COTS) electrical, electronic, and electromechanical (EEE) parts in spaceflight systems at NASA Centers. The assessment had two primary goals. The first was to capture each NASA Centers’ current practices, best practices, lessons learned and Center-proposed recommendations on the use of COTS EEE parts and assemblies in critical ground support equipment (GSE). The second was to provide recommendations on the use of COTS, including a set of current best practices based on the Centers’ current and best practices and the NESC team’s discussions. One key achievement made by the assessment team was the characterization of the term Industry Leading Parts Manufacturers (ILPMs) as parts manufacturer with high volume automatic production facilities and which can provide documented proof of the technology, process and product qualification, and its implementation of the best practices for “zero defects” for parts quality, reliability and workmanship. The assessment concluded with numerous findings, takeaways and recommendations that will be discussed during this presentation.

commercial↗

Flexible Electrostatic Technologies for Capture and Handling, Phase 1

Fundamental to many of NASA's in-space transportation missions is the capture and handling of various objects and vehicles in various orbits for servicing, debris disposal, sample retrieval, and assembly without the benefit of sufficient grapple fixtures and docking ports. To perform similar material handling tasks on Earth, pincher grippers, suction grippers, or magnetic chucks are used, but are unable to reliably grip aluminum and composite spacecraft, insulation, radiators, solar arrays, or extra-terrestrial objects in the vacuum of outer space without dedicated handles in the right places. The electronic Flexible Electrostatic Technologies for space Capture and Handling (FETCH) will enable reliable and compliant gripping (soft dock) of practically any object in various orbits or surfaces without dedicated mechanical features, very low impact capture, and built-in proximity sensing without any conventional actuators. Originally developed to handle semiconductor and glass wafers during vacuum chamber processing without contamination, the normal rigid wafer handling chucks are replaced with thin metal foil segments laminated in flexible insulation driven by commercial off-the-shelf solid state, high-voltage power supplies. Preliminary testing in NASA Marshall Space Flight Center's (MSFC's) Flat Floor Robotics Lab demonstrated compliant alignment and gripping with a full-sized, 150-lb microsat mockup and translation before a clean release with a flip of a switch. The flexible electrostatic gripper pads can be adapted to various space applications with different sizes, shapes, and foil electrode layouts even with openings through the gripper pads for addition of guidance sensors or injection of permanent adhesives. With gripping forces estimated between 0.5 and 2.5 lb/in2 or 70-300 lb/ft2 of surface contact, the FETCH can turn on and off rapidly and repeatedly to enable sample handling, soft docking, in-space assembly, precision relocation, and surface translation for accurate anchoring.

Bryan, Thomas↗

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗

Millimeter-Wave Localizers for Aircraft-to-Aircraft Approach Navigation

Aerial refueling technology for both manned and unmanned aircraft is critical for operations where extended aircraft flight time is required. Existing refueling assets are typically manned aircraft, which couple to a second aircraft through the use of a refueling boom. Alignment and mating of the two aircraft continues to rely on human control with use of high-resolution cameras. With the recent advances in unmanned aircraft, it would be highly advantageous to remove/reduce human control from the refueling process, simplifying the amount of remote mission management and enabling new operational scenarios. Existing aerial refueling uses a camera, making it non-autonomous and prone to human error. Existing commercial localizer technology has proven robust and reliable, but not suited for aircraft-to-aircraft approaches like in aerial refueling scenarios since the resolution is too coarse (approximately one meter). A localizer approach system for aircraft-to-aircraft docking can be constructed using the same modulation with a millimeterwave carrier to provide high resolution. One technology used to remotely align commercial aircraft on approach to a runway are ILS (instrument landing systems). ILS have been in service within the U.S. for almost 50 years. In a commercial ILS, two partially overlapping beams of UHF (109 to 126 MHz) are broadcast from an antenna array so that their overlapping region defines the centerline of the runway. This is called a localizer system and is responsible for horizontal alignment of the approach. One beam is modulated with a 150-Hz tone, while the other with a 90-Hz tone. Through comparison of the modulation depths of both tones, an autopilot system aligns the approaching aircraft with the runway centerline. A similar system called a glide-slope (GS) exists in the 320-to-330MHz band for vertical alignment of the approach. While this technology has been proven reliable for millions of commercial flights annually, its UHF nature limits its ability to operate beyond the 1-to-2-meter precisions associated with commercial runway width. A prototype ILS-type system operates at millimeter-wave frequencies to provide automatic and robust approach control for aerial refueling. The system allows for the coupling process to remain completely autonomous, as a boom operator is no longer required. Operating beyond 100 GHz provides enough resolution and a narrow enough beamwidth that an approach corridor of centimeter scales can be maintained. Two modules were used to accomplish this task. The first module is a localizer/glide-slope module that can be fitted on a refueling aircraft. This module provides the navigation beams for aligning the approaching aircraft. The second module is navigational receiver fitted onto the approaching aircraft to be re fueled that can detect the approach beams. Since unmanned aircraft have a limited payload size and limited electrical power, the receiver portion was implemented in CMOS (complementary metal oxide semiconductor) technology based on a super-regenerative receiver (SRR) architecture. The SRR achieves mW-level power consumption and chip sizes less than l mm2. While super-regenerative techniques have small bandwidths that limit use in communication systems, their advantages of high sensitivity, low complexity, and low power make them ideal in this situation where modulating tones of less than 1 kHz are used.

Tang, Adrian J.↗

Wide-bandgap Semiconductors in Space: Appreciating the Benefits but Understanding the Risks

Dr. Jean-Marie Lauenstein, NASA Goddard Space Flight Center, will present the radiation challenges of adopting wide-bandgap semiconductors for space applications. Wide-bandgap devices are attractive for space applications due to improved performance such as faster switching speeds, lower power losses, and their ability to operate at higher temperature as compared with their silicon counterparts. Their tolerance to total ionizing dose levels (> 100 krad(Si)) further enhances the desirability of these technologies. This short course will focus on silicon carbide and gallium nitride power rectifying, switching, and RF devices as these technologies are now readily available commercially. The radiation hardness assurance issues presented by the heavy-ion radiation environment will be discussed.

Lauenstein, Jean-Marie↗

Microfabricated Chemical Gas Sensors and Sensor Arrays for Aerospace Applications

Aerospace applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. In particular, factors such as minimal sensor size, weight, and power consumption are particularly important. Development areas which have potential aerospace applications include launch vehicle leak detection, engine health monitoring, and fire detection. Sensor development for these applications is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors; 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity; 3) The development of high temperature semiconductors, especially silicon carbide. This presentation discusses the needs of space applications as well as the point-contact sensor technology and sensor arrays being developed to address these needs. Sensors to measure hydrogen, hydrocarbons, nitrogen oxides (NO,), carbon monoxide, oxygen, and carbon dioxide are being developed as well as arrays for leak, fire, and emissions detection. Demonstrations of the technology will also be discussed. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.

Hunter, Gary W.↗

Progress Towards Prolonged Deployment of SiC JFET-R ICs Into Previously Inaccessible Hostile Environments

This invited presentation describes demonstration of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. SiC junction field effect transistor-resistor (JFET-R) ICs with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient [1], 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber [2], and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes [3]. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C T-span) without significant change in signal (input /output) or power supply voltages [4]. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards this end, the processing that forms the SiC JFETs and resistors (without interconnect) for the NASA Glenn “Generation 12” design prototype JFET-R ICs was conducted at GE Research. Once the COVID-delayed IC interconnect and bond pad fabrication processing on these wafers is completed at NASA Glenn, the resulting chips will be packaged and oven-tested [5]. It is expected that further technology transfer to complete commercial production will lower investment and risk barriers to useful application deployment. For NASA, an initial high-value deployment is opening the Venus surface to extended missions for robotic scientific exploration.

Silicon Carbide↗

Development of Microfabricated Chemical Gas Sensors and Sensor Arrays for Aerospace Applications

Aerospace applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. In particular, factors such as minimal sensor size, weight, and power consumption are particularly important. Development areas which have potential aerospace applications include launch vehicle leak detection, engine health monitoring, fire detection, and environmental monitoring. Sensor development for these applications is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors. 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity. 3) The development of high temperature semiconductors, especially silicon carbide. However, due to issues of selectivity and cross-sensitivity, individual sensors are limited in the amount of information that they can provide in environments that contain multiple chemical species. Thus, sensor arrays are being developed to address detection needs in such multi-species environments. This paper discusses the needs of space applications as well as the point-contact sensor technology and sensor arrays being developed to address these needs. Sensors to measure hydrogen, hydrocarbons, hydrazine, nitrogen oxides (NO,), carbon monoxide, oxygen, and carbon dioxide are being developed as well as arrays for leak, fire, and emissions detection. Demonstrations of the technology will also be discussed. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.

Hunter, G. W.↗

Development and Application of Microfabricated Chemical Gas Sensors For Aerospace Applications

Aerospace applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. In particular, factors such as minimal sensor size, weight, and power consumption are particularly important. Development areas which have potential aerospace applications include launch vehicle leak detection, engine health monitoring and control, and fire detection. Sensor development for these applications is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors. 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity. 3) The development of high temperature semiconductors, especially silicon carbide. Sensor development for each application involves its own challenges in the fields of materials science and fabrication technology. This paper discusses the needs of space applications and the point-contact sensor technology being developed to address these needs. Sensors to measure hydrogen, hydrocarbons, nitrogen oxides (Nox, carbon monoxide, oxygen, and carbon dioxide are being developed. A description is given of each sensor type and its present stage of development. Demonstration and application these sensor technologies will be described. The demonstrations range from use of a microsystem based hydrogen sensor on the Shuttle to engine demonstration of a nanocrystalline based sensor for NO, detection. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.

Hunter, G. W.↗

Cryogenic Cooling for Myriad Applications-A STAR Is Born

Cryogenics, the science of generating extremely low temperatures, has wide applicability throughout NASA. The Agency employs cryogenics for rocket propulsion, high-pressure gas supply, breathable air in space, life support equipment, electricity, water, food preservation and packaging, medicine, imaging devices, and electronics. Cryogenic liquid oxygen and liquid hydrogen systems are also replacing solid rocket motor propulsion systems in most of the proposed launch systems, a reversion to old-style liquid propellants. In the late 1980s, NASA wanted a compact linear alternator/motor with reduced size and mass, as well as high efficiency, that had unlimited service life for use in a thermally driven power generator for space power applications. Prior development work with free-piston Stirling converters (a Stirling engine integrated with a linear actuator that produces electrical power output) had shown the promise of that technology for high-power space applications. A dual use for terrestrial applications exists for compact Stirling converters for onsite combined heat and power units. The Stirling cycle is also usable in reverse as a refrigeration cycle suitable for cryogenic cooling, so this Stirling converter work promised double benefits as well as dual uses. The uses for cryogenic coolers within NASA abound; commercial applications are similarly wide-ranging, from cooling liquid oxygen and nitrogen, to cryobiology and bio-storage, cryosurgery, instrument and detector cooling, semiconductor manufacturing, and support service for cooled superconducting power systems.

Source record↗

NASA's approach to the commercial use of space

NASA planning activities in the area of commercial development of space resources are reviewed. Examples of specific types of commercial space ventures are given, according to three different categories: new commercial high-technology ventures; new commercial application of existing space technology, and commercial ventures resulting from the transfer of existing space programs to the private sector. Basic objectives for reducing technical, financial and institutional risks for commercial space operations are considered. Attention is given to the cooperative working environment encouraged by Joint Endeavor Agreements (JEAs) and Technical Exchange Agreements (TEAs) between industrial organizations in the development of space systems. Benefits of the commercial development of space resources include the production of purer pharmaceuticals for the treatment of cancers, kidney diseases, and diabetes; and the development of ultra-pure semiconductor crystals for use in next generation electronic equipment.

Gillam, I. T., IV↗

Control Software

Real-Time Innovations, Inc. (RTI) collaborated with Ames Research Center, the Jet Propulsion Laboratory and Stanford University to leverage NASA research to produce ControlShell software. RTI is the first "graduate" of Ames Research Center's Technology Commercialization Center. The ControlShell system was used extensively on a cooperative project to enhance the capabilities of a Russian-built Marsokhod rover being evaluated for eventual flight to Mars. RTI's ControlShell is complex, real-time command and control software, capable of processing information and controlling mechanical devices. One ControlShell tool is StethoScope. As a real-time data collection and display tool, StethoScope allows a user to see how a program is running without changing its execution. RTI has successfully applied its software savvy in other arenas, such as telecommunications, networking, video editing, semiconductor manufacturing, automobile systems, and medical imaging.

Source record↗

Crystal growth of device quality GaAs in space

GaAs device technology has recently reached a new phase of rapid advancement, made possible by the improvement of the quality of GaAs bulk crystals. At the same time, the transition to the next generation of GaAs integrated circuits and optoelectronic systems for commercial and government applications hinges on new quantum steps in three interrelated areas: crystal growth, device processing and device-related properties and phenomena. Special emphasis is placed on the establishment of quantitative relationships among crystal growth parameters-material properties-electronic properties and device applications. The overall program combines studies of crystal growth on novel approaches to engineering of semiconductor material (i.e., GaAs and related compounds); investigation and correlation of materials properties and electronic characteristics on a macro- and microscale; and investigation of electronic properties and phenomena controlling device applications and device performance.

Gatos, H. C.↗

Power Hibernation for Low-Cost Solar Powered Lunar Missions

Because the surface of the Moon drops to cryogenic temperatures, no solar-powered lunar spacecraft have reliably operated beyond a single lunar day. Passive thermal control cannot keep a spacecraft sufficiently warm for the 354-hour lunar night, and active thermal control requires a dramatic increase in battery mass at the expense of payload mass. Extreme conditions seen on the lunar surface suggest a radioisotope solution is ideal, but mass, cost, and schedule are inconsistent with low-cost frequent flight intent of the commercial lunar payload services (CLPS) program. To solve the issue of lunar night survivability without radioisotope sources of power and heat, a lunar power hibernation approach is being developed at the Glenn Research Center, which exploits the ability of common 18650 Lithium-ion cells to passively survive cryogenic freeze-thaw cycles and recover without apparent performance degradation. A key aspect of this hibernation approach is the use of cryogenically operable electronics that safely manage the restoration of the battery thermal environment at lunar dawn. A spacecraft utilizing this strategy will operate into the lunar night on batteries until the state of charge or spacecraft temperature reaches a predetermined threshold. At this point, systems are shut down and the battery is isolated from the main bus to prevent charge or discharge during the freezing and thawing transitions. The system remains passive until lunar dawn, where temperatures can reach as low as 50 K. All electronics must be tolerant to these conditions. When the solar arrays are finally illuminated at lunar dawn, the main bus power electronics will initiate a “cold start” and begin regulating array power. The main bus electronics must be designed to operate at cryogenic temperatures. Array power is used to warm the battery and passive electronics back to operational temperatures. Once batteries are returned to normal temperatures, diagnostics and precharging is performed, as needed, and the battery is reconnected. The overall spacecraft system reboots and returns to nominal operations until lunar night returns. To assure that we can develop batteries suited for many hibernation freeze/thaw cycles, STMD Space Technology Research Grant Program (STRG) has selected two principal investigators that will thoroughly characterize of the Li-ion cell through the freeze-thaw process, investigate degradation mechanisms, and identify potential diagnostic techniques. STMD STRG is also funding an investigation of Gallium-Nitride semiconductors for cryogenic power applications. This work includes physics-informed modeling that considers cryogenic conductivity, carrier mobility, and quantum effects that govern semiconductor performance at cryogenic temperatures. These models can enable engineers to develop accurate cryogenic simulation models that assist in the design of power controls stable over the entire lunar surface temperature range. Meanwhile, Glenn is performing cryogenic testing of batteries and electronics, establishing design guidelines for power applications in extreme cold lunar environment, and potentially developing a hibernation technology demonstrator. The hibernation approach will enable low-cost lunar robotic missions to extend their operating lifetime to many months while minimizing development costs and impact on payload capacity. The need for cryogenically operable electronics is restricted to only main bus power and battery controls, as the majority of systems simply need to passively tolerate cryogenic temperatures. This allows developers to continue to exploit the cost savings of legacy and COTS hardware with minimum modification. For these reasons, lunar power hibernation is a viable near-term solution for lunar night survivability for solar powered commercial landers.

Space power↗

Assessment of Cryogenic Analog Electronics for Lunar Environment

Assessment of Analog Electronics for Lunar Power Hibernation Non-nuclear robotic spacecraft on the Moon may not reliably operate past the first lunar day due to the subsequent long lunar night with an extreme low temperature range of 50K-100K. To address this concern, the NASA Glenn Research Center is developing a lunar power hibernation protocol that could enable spacecraft to passively survive the lunar night without any additional heating source and then reactivate at lunar dawn. Low cost lunar robotic missions could extend their mission lifetime from a single lunar cycle to potentially many months, thus greatly extending science data gathering and return on investment for commercial missions. This approach centers on evidence that lithium-ion battery cells can recover to full operation after being subjected to cryogenic temperatures. Exploiting this battery capability requires that all spacecraft electronics, including power system and avionics, passively tolerate the extreme cold without degradation. Key elements in the power system will also need to be capable of actively operating in the extreme cold to perform the functions required to restore the system to full operation after solar power returns at lunar dawn. This presentation provides an assessment of extreme-cold tolerance and operational capability of analog electronics where choices in semiconductor material, device type, and circuit fabrication technology has a dramatic impact on circuit behavior and reliability at low temperatures.

Lunar↗

High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility

The fabrication techniques and detail procedures for creating P-channel Metal-Oxide-Semiconductor (P-MOS) integrated circuits at George C. Marshall Space Flight Center (MSFC) are described. Examples of P-MOS integrated circuits fabricated at MSFC together with functional descriptions of each are given. Typical electrical characteristics of high and low threshold P-MOS discrete devices under given conditions are provided. A general description of MSFC design, mask making, packaging, and testing procedures is included. The capabilities described in this report are being utilized in: (1) research and development of new technology, (2) education of individuals in the various disciplines and technologies of the field of microelectronics, and (3) fabrication of many types of specially designed integrated circuits which are not commercially feasible in small quantities for in-house research and development programs.

Bouldin, D. L.↗

A Novel Silicon Micromachined Integrated MCM Thermal Management System

"Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.

Kazmierczak, M. J.↗

Optical Frequency Optimization of a High Intensity Laser Power Beaming System Utilizing VMJ Photovoltaic Cells

An effective form of wireless power transmission (WPT) has been developed to enable extended mission durations, increased coverage and added capabilities for both space and terrestrial applications that may benefit from optically delivered electrical energy. The high intensity laser power beaming (HILPB) system enables long range optical 'refueling" of electric platforms such as micro unmanned aerial vehicles (MUAV), airships, robotic exploration missions and spacecraft platforms. To further advance the HILPB technology, the focus of this investigation is to determine the optimal laser wavelength to be used with the HILPB receiver, which utilizes vertical multi-junction (VMJ) photovoltaic cells. Frequency optimization of the laser system is necessary in order to maximize the conversion efficiency at continuous high intensities, and thus increase the delivered power density of the HILPB system. Initial spectral characterizations of the device performed at the NASA Glenn Research Center (GRC) indicate the approximate range of peak optical-to-electrical conversion efficiencies, but these data sets represent transient conditions under lower levels of illumination. Extending these results to high levels of steady state illumination, with attention given to the compatibility of available commercial off-the-shelf semiconductor laser sources and atmospheric transmission constraints is the primary focus of this paper. Experimental hardware results utilizing high power continuous wave (CW) semiconductor lasers at four different operational frequencies near the indicated band gap of the photovoltaic VMJ cells are presented and discussed. In addition, the highest receiver power density achieved to date is demonstrated using a single photovoltaic VMJ cell, which provided an exceptionally high electrical output of 13.6 W/sq cm at an optical-to-electrical conversion efficiency of 24 percent. These results are very promising and scalable, as a potential 1.0 sq m HILPB receiver of similar construction would be able to generate 136 kW of electrical power under similar conditions.

Raible, Daniel E.↗