Search NASA⌕ Search

SEARCH · Search NASA

Results for “Digital Fabrication”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

600 C Logic Gates Using Silicon Carbide JFET's

Complex electronics and sensors are increasingly being relied on to enhance the capabilities and efficiency of modernjet aircraft. Some of these electronics and sensors monitor and control vital engine components and aerosurfaces that operate at high temperatures above 300 C. However, since today's silicon-based electronics technology cannot function at such high temperatures, these electronics must reside in environmentally controlled areas. This necessitates either the use of long wire runs between sheltered electronics and hot-area sensors and controls, or the fuel cooling of electronics and sensors located in high-temperature areas. Both of these low-temperature-electronics approaches suffer from serious drawbacks in terms of increased weight, decreased fuel efficiency, and reduction of aircraft reliability. A family of high-temperature electronics and sensors that could function in hot areas would enable substantial aircraft performance gains. Especially since, in the future, some turbine-engine electronics may need to function at temperatures as high as 600 C. This paper reports the fabrication and demonstration of the first semiconductor digital logic gates ever to function at 600 C. Key obstacles blocking the realization of useful 600 C turbine engine integrated sensor and control electronics are outlined.

Neudeck, Philip G.↗
NASA NTRS2004

Superconducting Digital Multiplexers for Sensor Arrays

Arrays of cryogenic microbolometers and other cryogenic detectors are being developed for infrared imaging. If the signal from each sensor is amplified, multiplexed, and digitized using superconducting electronics, then this data can be efficiently read out to ambient temperature with a minimum of noise and thermal load. HYPRES is developing an integrated system based on SQUID amplifiers, a high-resolution analog-to-digital converter (ADC) based on RSFQ (rapid single flux quantum) logic, and a clocked RSFQ multiplexer. The ADC and SQUIDs have already been demonstrated for other projects, so this paper will focus on new results of a digital multiplexer. Several test circuits have been fabricated using Nb Josephson technology and are about to be tested at T = 4.2 K, with a more complete prototype in preparation.

Kadin, Alan M.↗
NASA NTRS2012

A Radiation Hardened by Design CMOS ASIC for Thermopile Readouts

A radiation hardened by design (RHBD) mixed-signal application specific integrated circuit (ASIC) has been designed for a thermopile readout for operation in the harsh Jovian orbital environment. The multi-channel digitizer (MCD) ASIC includes 18 low noise amplifier channels which have tunable gain/filtering coefficients, a 16-bit sigma-delta analog-digital converter (SDADC) and an on-chip controller. The 18 channels, SDADC and controller were designed to operate with immunity to single event latchup (SEL) and to at least 10 Mrad total ionizing dose (TID). The ASIC also contains a radiation tolerant 16-bit 20 MHz Nyquist ADC for general purpose instrumentation digitizer needs. The ASIC is currently undergoing fabrication in a commercial 180 nm CMOS process. Although this ASIC was designed specifically for the harsh radiation environment of the NASA led JEO mission it is suitable for integration into instrumentation payloads 011 the ESA JUICE mission where the radiation hardness requirements are slightly less stringent.

Quilligan, G.↗
DOE OSTI2022

2022 roadmap on 3D printing for energy

The energy transition is one of the main challenges of our society and therefore a major driver for the scientific community. To ensure a smart transition to a sustainable future energy scenario different technologies such as energy harvesting using solar cells or windmills and chemical storage in batteries, super-capacitors or hydrogen have to be developed and ultimately deployed. New fabrication approaches based on additive manufacturing and the digitalization of the industrial processes increase the potential to achieve highly efficient and smart technologies required to increase the competitiveness of clean energy technologies against fossil fuels. In this frame, the present roadmap highlights the tremendous potential of 3D printing as a new route to fully automate the manufacturing of energy devices designed as digital files. Additionally, this article gives numerous guidelines to maximize the performance and efficiency of the next generation of 3D printed devices for the energy transition while reducing the waste of critical raw materials. In particular, the paper is focused on the current status, present challenges and the expected and required advances of 3D printing for the fabrication of the most relevant energy technologies such as fuel cells and electrolysers, batteries, solar cells, super-capacitors, thermoelectric generators, chemical reactors and turbomachinery.

36 MATERIALS SCIENCE↗
NASA NTRS1983

Advanced digital modulation: Communication techniques and monolithic GaAs technology

Communications theory and practice are merged with state-of-the-art technology in IC fabrication, especially monolithic GaAs technology, to examine the general feasibility of a number of advanced technology digital transmission systems. Satellite-channel models with (1) superior throughput, perhaps 2 Gbps; (2) attractive weight and cost; and (3) high RF power and spectrum efficiency are discussed. Transmission techniques possessing reasonably simple architectures capable of monolithic fabrication at high speeds were surveyed. This included a review of amplitude/phase shift keying (APSK) techniques and the continuous-phase-modulation (CPM) methods, of which MSK represents the simplest case.

Wilson, S. G.↗
NASA NTRS2015

Application of Optical Measurement Techniques During Fabrication and Testing of Liquid Rocket Nozzles

This paper presents a series of optical measurement techniques that were developed for use during large-scale fabrication and testing of nozzle components. A thorough understanding of hardware throughout the fabrication cycle and hotfire testing is critical to meet component design intent. Regeneratively cooled nozzles and associated tooling require tight control of tolerances during the fabrication process to ensure optimal performance. Additionally, changes in geometry during testing can affect performance of the nozzle and mating components. Structured light scanning and digital image correlation techniques were used to collect data during the fabrication and test of nozzles, in addition to other engine components. This data was used to analyze deformations data during machining, heat treatment, assembly and testing operations. A series of feasibility experiments were conducted for these techniques that led to use on full scale nozzles during the J-2X upper stage engine program in addition to other engine development programs. This paper discusses the methods and results of these measurement techniques throughout the nozzle life cycle and application to other components.

Gradl, Paul R.↗
DOE OSTI2022

Radiation-Hardened GaN HEMT and Cell Design, Modeling, and Fabrication for Nuclear Instrumentation Applications

Recent advances in nuclear power generation technologies show great promise for efficient, safe generation of carbon-free power in the near future. Consequently, many new generation reactor designs are being pursued by government and industry groups, including both fission- and fusion-based technologies. Radiation- and temperature-tolerant sensor technology continues to advance, yet development of the electronics/instrumentation technologies suitable for these environments have fallen behind. Industry has adequately addressed harsh environment electronics needs for low earth orbit satellites, but the much more extreme conditions associated with electronics placed near or in a reactor core remain unaddressed. This project investigates the use of gallium nitride (GaN) circuit technology to address the unique needs for sensor interface electronics and communications in reactor environments. This report provides a summary of the first year’s project activities related to developing and optimizing devices and circuits for this GaN high electronic mobility transistor (HEMT) process. Activities reported include multiple analog and digital circuit designs simulated using custom Verilog-A models generated from measured GaN devices fabricated in the target process. Digital circuit designs included fundamental logic circuits such as an inverter, NAND, NOR, AND and OR gates, as well as a 5-stage ring oscillator. Each design was simulated using an open-source SPICE simulator, and an integrated circuit layout was produced of each design for use in future fabrication. Analog circuit designs focused on the fundamental building blocks to be used to construct sensor interface and communications circuits. These included current mirrors, matched differential pairs, and a Gilbert cell mixer design, each with an associated integrated circuit layout. Layout tools used for these designs included two open-source packages—KLayout and Magic—which were customized for specific use with the OSU GaN process layers. Design rules and preliminary device extraction capabilities were built for the Magic tool to enable device extraction and subsequent netlist generation for SPICE simulation. Finally, future research directions for year two are summarized. When the year-two directions are implemented, the project will be in position to advance the state of the art in electronics for near- or in-reactor sensor interfacing and communications.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
NASA NTRS1996

High-T(sub c) Superconductor-Normal-Superconductor Junctions with Polyimide-Passivated Ambient Temperature Edge Formation

The ability to controllably fabricate High-Temperature Superconductor (HTS) S-Normal-S (SNS) Josephson Juntions (JJ's) enhances the possibilities fro many applications, including digital circuits, SQUID's, and mixers. A wide variety of approaches to fabricating SNS-like junctions has been tried and analyzed in terms of proximity effect behavior.

HTS SNS Josephson Junction JJ polyimide films poly↗
NASA NTRS1991

HYMOSS signal processing for pushbroom spectral imaging

The objective of the Pushbroom Spectral Imaging Program was to develop on-focal plane electronics which compensate for detector array non-uniformities. The approach taken was to implement a simple two point calibration algorithm on focal plane which allows for offset and linear gain correction. The key on focal plane features which made this technique feasible was the use of a high quality transimpedance amplifier (TIA) and an analog-to-digital converter for each detector channel. Gain compensation is accomplished by varying the feedback capacitance of the integrate and dump TIA. Offset correction is performed by storing offsets in a special on focal plane offset register and digitally subtracting the offsets from the readout data during the multiplexing operation. A custom integrated circuit was designed, fabricated, and tested on this program which proved that nonuniformity compensated, analog-to-digital converting circuits may be used to read out infrared detectors. Irvine Sensors Corporation (ISC) successfully demonstrated the following innovative on-focal-plane functions that allow for correction of detector non-uniformities. Most of the circuit functions demonstrated on this program are finding their way onto future IC's because of their impact on reduced downstream processing, increased focal plane performance, simplified focal plane control, reduced number of dewar connections, as well as the noise immunity of a digital interface dewar. The potential commercial applications for this integrated circuit are primarily in imaging systems. These imaging systems may be used for: security monitoring systems, manufacturing process monitoring, robotics, and for spectral imaging when used in analytical instrumentation.

Ludwig, David E.↗
NASA NTRS1975

Radar range data signal enhancement tracker

The design, fabrication, and performance characteristics are described of two digital data signal enhancement filters which are capable of being inserted between the Space Shuttle Navigation Sensor outputs and the guidance computer. Commonality of interfaces has been stressed so that the filters may be evaluated through operation with simulated sensors or with actual prototype sensor hardware. The filters will provide both a smoothed range and range rate output. Different conceptual approaches are utilized for each filter. The first filter is based on a combination low pass nonrecursive filter and a cascaded simple average smoother for range and range rate, respectively. Filter number two is a tracking filter which is capable of following transient data of the type encountered during burn periods. A test simulator was also designed which generates typical shuttle navigation sensor data.

Source record↗
NASA NTRS2005

Use of Field Programmable Gate Array Technology in Future Space Avionics

Fulfilling NASA's new vision for space exploration requires the development of sustainable, flexible and fault tolerant spacecraft control systems. The traditional development paradigm consists of the purchase or fabrication of hardware boards with fixed processor and/or Digital Signal Processing (DSP) components interconnected via a standardized bus system. This is followed by the purchase and/or development of software. This paradigm has several disadvantages for the development of systems to support NASA's new vision. Building a system to be fault tolerant increases the complexity and decreases the performance of included software. Standard bus design and conventional implementation produces natural bottlenecks. Configuring hardware components in systems containing common processors and DSPs is difficult initially and expensive or impossible to change later. The existence of Hardware Description Languages (HDLs), the recent increase in performance, density and radiation tolerance of Field Programmable Gate Arrays (FPGAs), and Intellectual Property (IP) Cores provides the technology for reprogrammable Systems on a Chip (SOC). This technology supports a paradigm better suited for NASA's vision. Hardware and software production are melded for more effective development; they can both evolve together over time. Designers incorporating this technology into future avionics can benefit from its flexibility. Systems can be designed with improved fault isolation and tolerance using hardware instead of software. Also, these designs can be protected from obsolescence problems where maintenance is compromised via component and vendor availability.To investigate the flexibility of this technology, the core of the Central Processing Unit and Input/Output Processor of the Space Shuttle AP101S Computer were prototyped in Verilog HDL and synthesized into an Altera Stratix FPGA.

Ferguson, Roscoe C.↗
NASA NTRSDate not supplied

Voxel Based Three-Dimensional Topology Optimization of Heat Exchanger Fins

Increasing interest in novel aircraft propulsion systems and potential for unwanted heat generation, or capture and reuse of waste heat, may require increasingly lightweight and high performing heat exchangers. Advances in manufacturing technologies have shown potential to create complex designs, but design tools need more flexibility. This study utilizes genetic algorithm-driven topology optimization to develop high performance heat exchanger fins for critical applications such as aerospace. The solid domain is generated using voxel representation where a voxel value of 1 indicates the solid domain and a voxel value of 0 refers to the fluid domain. The use of voxel representation somewhat matches the digitization of a model that is required to fabricate using additive manufacturing, and also allows for a highly unconstrained geometry. To test the topology optimization approach, a three-dimensional(3D)baseline offset strip fin geometry in steady laminar flow(Reynolds number = 215)with conjugate heat transfer(simultaneous solution of solid and fluid temperature fields)is optimized. New designs are generated using the genetic algorithm (GA) and sent to evaluation by the CFD software OpenFOAM; then the GA sorts and selects the reproduction pool for the following generation. This process is repeated for 60 generations. The study also investigates the effect off in material on the performance of the GA and the resulting designs. The results show that the optimal designs have overall performance improvement of 18% relative to the baseline. Additionally, a fin constructed of a lower conductivity material (such as an Inconel super alloy that might be necessary for waste heat recovery applications)results in lower overall performance improvement (11%)and optimal designs with higher pressure drop relative to their baseline, and relative to optimal designs produced using higher conductivity materials.

3D Optimization↗
NASA NTRS2014

A 0.18 micrometer CMOS Thermopile Readout ASIC Immune to 50 MRAD Total Ionizing Dose (SI) and Single Event Latchup to 174MeV-cm(exp 2)/mg

Radiation hardened by design (RHBD) techniques allow commercial CMOS circuits to operate in high total ionizing dose and particle fluence environments. Our radiation hard multi-channel digitizer (MCD) ASIC (Figure 1) is a versatile analog system on a chip (SoC) fabricated in 180nm CMOS. It provides 18 chopper stabilized amplifier channels, a 16- bit sigma-delta analog-digital converter (SDADC) and an on-chip controller. The MCD was evaluated at Goddard Space Flight Center and Texas A&M University's radiation effects facilities and found to be immune to single event latchup (SEL) and total ionizing dose (TID) at 174 MeV-cm(exp 2)/mg and 50 Mrad (Si) respectively.

radiation hardened by design↗
DOE OSTI2020

Characterization of mechanical properties and deformation behavior of highly irradiated 316L stainless steel from target modules at the Spallation Neutron Source using digital image correlation analysis

Tensile specimens with irradiation doses ranging from approximately 0.7 to 7.6 displacements per atom (dpa) were fabricated from 316L samples removed from Spallation Neutron Source (SNS) target vessels after service. Tensile tests were performed in conjunction with digital image correlation (DIC) characterization, which permitted detailed analysis of the strain distribution and deformation behavior of the specimen gauge sections during testing. The results show, while considerable hardening (500–700 MPa increase in yield strength) occurred in the 316L SNS target material with increasing dose, appreciable ductility (19–23% total elongation) remained in the material after irradiation to 7.6 dpa in the mixed neutron/proton environment of the SNS target region. The DIC data showed the strain distribution and deformation behavior of all irradiated specimens were nonuniform during testing. Strain localization in the form of deformation bands or “hotspots” was observed during testing, and in some specimens, the bands propagated as deformation waves along the gauge section. The “traveling wave” deformation behavior affected the amount of elongation each specimen achieved, and the scatter in the elongation data was attributed to the large variation in deformation behavior observed among different specimens. Bands of localized strain, or deformation bands, oriented at specific angles were observed in two-dimensional plots of the strain distribution in the gauge sections of some specimens. Overall, this paper describes the experimental procedures, results, and deformation behavior of tensile specimens from SNS targets after service and illustrates the value of DIC characterization during tensile testing of irradiated materials.

36 MATERIALS SCIENCE↗
NASA NTRS1980

Placement technique for semicustom digital LSI circuits

Small lots of special-purpose integrated circuits are fabricated from standard transitor arrays. Folded linear order of cells minimzes interconnection length and puts cell in juxtaposition. Cell-placement technique is carried out via computer program.

Carroll, B.↗