The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond
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This presentation provides an overview of the NEPP Program.
Recent Findings from Audits, New Technology Data Reviews a) Disabled Chip Burn-ins A recent audit for a QML device discovered that the chip was disabled during the static burn-in, thus it was not drawing any current. Recommendation: For new SMDs add a statement within the burn-in paragraphs stating that the parts shall be kept in their enabled state during the burn-in. b) Class Q 160-hr/125oC Burn-in This is being interpreted as a static burn-in (even for CMOS technology). Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. c) At Frequency (Dynamic) Burn-ins Test equipment limitation is being cited for not doing burn-ins at the application frequency. Recommendation: The burn-in task group to discuss and provide guidance. When the SMD says that the part can be used at 200 MHz, then doing burn-in at 6 MHz (cited as burn-in equipment limitation frequency) is not going to be meaningful! d) Two Static Burn-ins Some manufacturers are doing electrical testing between the two static burn-ins, whereas others do electricals after completing both static burn-ins. Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. e) Thermal Imaging For a device with hot spots, the thermal resistance, junction-to-case, would be much higher than the guidelines given in MIL-STD-1835. One of the suppliers used thermal imaging to find hot spots on the die. Recommendation: Assign a task group to evaluate the effectiveness of thermal imaging at the product development stage.
This presentation provides an overview of the NEPP Program. The NEPP Mission is to provide guidance to NASA for the selection and application of microelectronics technologies; Improve understanding of the risks related to the use of these technologies in the space environment; Ensure that appropriate research is performed to meet NASA mission assurance needs. NEPP's Goals are to provide customers with appropriate and cost-effective risk knowledge to aid in: Selection and application of microelectronics technologies; Improved understanding of risks related to the use of these technologies in the space environment; Appropriate evaluations to meet NASA mission assurance needs; Guidelines for test and application of parts technologies in space; Assurance infrastructure and support for technologies in use by NASA space systems.
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This presentation provides an overview of the NEPP Program. The NEPP Mission is to provide guidance to NASA for the selection and application of microelectronics technologies; Improve understanding of the risks related to the use of these technologies in the space environment; Ensure that appropriate research is performed to meet NASA mission assurance needs. NEPP's Goals are to provide customers with appropriate and cost-effective risk knowledge to aid in: Selection and application of microelectronics technologies; Improved understanding of risks related to the use of these technologies in the space environment; Appropriate evaluations to meet NASA mission assurance needs; Guidelines for test and application of parts technologies in space; Assurance infrastructure and support for technologies in use by NASA space systems.
This presentation provides an overview of the NEPP Program as well as the current roadmap for NEPP tasks.
This presentation provides an overview of the NEPP Program as well as the current roadmap for NEPP tasks.
Qualitative and quantitative accelerated testing methods for electronic equipment
Determining temperature extremes in electronic components of spacecraft on interplanetary orbiter and flyby missions
Over the last two to three decades, the balance of influence within the electronics industry has shifted decisively towards the consumer electronics and information technology products, away from the defense or aerospace markets. This shift towards the commercial markets has changed certain ground rules in the electronics industry. Reliance of the aerospace industry, in particular, on components from supply chains dedicated to other products, or cross-vertical product integration, creates a supply web and introduces significant risks that are not necessarily present for volume-driven electronic products. Many of the unique risks in the aerospace industry emanate from the key characteristics of this industry. Although selection and usage of commercial electronics in NASA flight hardware is possible at a comparable (and in many cases lower) level of risk to that of employing parts that are screened to military or NASA specifications, for a large majority of flight projects it is difficult to distinguish the difference in on-orbit performance or reliability for parts screened at any level, or commercial parts that have no additional screening performed by the government. This paper identifies several bases for establishing context and developing unique or alternative approaches for successful parts selection and application within NASA and across the commercial space community.
Literature survey for low level radiation effects on electronic components
Identification of designs, materials, and processes used in manufacturing of electronic equipment
Extreme temperature determinations which affect spacecraft electronic equipment on flyby missions
The operating and calibration procedures, design details, and maintenance information for the control console and the associated electronics are presented. Detailed circuit connector information is included which describes the destination of each wire leaving each pin of each circuit board. The schematic diagrams of the circuit boards in the system and of the interconnection between boards and consoles are presented.
Total ionizing dose and displacement damage testing was performed to characterize and determine the suitability of candidate electronics for NASA space utilization. Devices tested include optoelectronics, digital, analog, linear bipolar devices, and hybrid devices.
Total ionizing dose and displacement damage testing was performed to characterize and determine the suitability of candidate electronics for NASA space utilization. Devices tested include optoelectronics, digital, analog, linear bipolar devices, and hybrid devices. Displacement Damage, Optoelectronics, Proton Damage, Single Event Effects, and Total Ionizing Dose.
We present the results of single event effects (SEE) testing and analysis investigating the effects of radiation on electronics. This paper is a summary of test results.