A study of the reliability of electronic components in a nuclear-radiation environment Eleventh quarterly report, Jul. 1 - Sep. 30, 1965
Life tests on capacitors, diodes, controlled rectifiers, and transistors in nuclear radiation environment
DIODE↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Improvements in electronic component testing
Improved nondestructive test methods using infrared radiation and radioisotope tracers for seal defects and integrated circuit quality control
NONDESTRUCTIVE TESTING↗
The flammability of electronic components in spacecraft environments Final report, 15 Mar. - 15 Oct. 1968
Mathematical model for combustion at zero gravity in spacecraft environments
Atallah, S.↗
Fuse-holder concept expedites electronic component changes
Mounting circuit components in fuse holders facilitates component changing and extends component life with an estimated fifty percent saving of breadboard test time. Glass sleeves of the fuse holders allow easy component identification.
Winslow, D. J.↗
Constant current load matches impedances of electronic components
Constant current load with negative resistance characteristics actively compensates for impedance variations in circuit components. Through a current-voltage balancing operation the internal impedance of the diodes is maintained at a constant value. This constant current load circuit can be used in simple telemetry systems.
Alexander, R. M.↗
Radiographic inspection specifications for electronic components
Quality assurance provisions cover personnel training, radiographic equipment, radiographic test procedures, and inspection and examination of radiographs. Supplementary information includes accept and reject criteria for radiographic inspection of resistors, capacitors, transistors, hybrid microcircuits, diodes, small coils and transformers.
Source record↗
Shock and vibration isolation mount for small electronic components
Mount includes metallic cup and support ring placed in mold fixture. Viscoelastic material is injected between these parts by means of large hypodermic needle. Circular projections on cup and ring extend into material and are kept in place without dependence on quality of adhesion between material and metal.
Dillon, R. F.↗
Radiation studies of optical and electronic components used in astronomical satellite studies
Explore the source record for details and available documents.
Becher, J.↗
Simple photometer circuits using modular electronic components
Operational and peak holding amplifiers are discussed as useful circuits for bioluminescence assays. Circuit diagrams are provided. While analog methods can give a good integration on short time scales, digital methods were found best for long term integration in bioluminescence assays. Power supplies, a general photometer circuit with ratio capability, and variations in the basic photometer design are also considered.
Wampler, J. E.↗
Safe venting for electronic components
Vented enclosure is made from lightweight metal. Printed-circuit boards are attached to bottom and end bulkheads and to top cover. Airflow cools components indirectly through walls of inner compartment. Flammability and smoke tests demonstrate safety of enclosure.
Currin, R., Jr.↗
Analysis of the electron component of EAS at observational level 700 g x cm(-2) with a scale breaking interaction model and gammaisation hypothesis
Scale breaking model and gammaisation processes for high energies give a correct description of the longitudinal development of extensive air showers (E.A.S.). From the analysis of phenomenological characteristics of E.A.S. at Tien-Shan experiment, it follows that for energies near 10 to the 6 GeV the secondary particle multiplicity increases with energy faster than is predicted by the accepted scale breaking model.
Procureur, J.↗
The effects of space environments on electronic components
One of the challenges in space qualification is to define the operational environment of a part such that it is tested to the limits of a mission without requiring expensive overdesign. To aid this, this document defines, discusses and recommends environmental design and verification requirements for using microelectronic components and assemblies in space environments.
space environments↗
Multi-layered diamond-like carbon coating for electronic components
A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.
Selter, Thomas Matthew↗