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At least 91 records · Page 5

Encapsulation materials for photovoltaic arrays

As a part of the Low Cost Solar Array Project an encapsulation task has been established to identify, develop, and evaluate new low-cost, long-life encapsulation systems capable of meeting the project cost and performance goals. Low-cost material system candidates have been identified and are being characterized in laboratory and field tests with detailed evaluation of their environmental stability when subjected to temperature cycling, humidity, ultraviolet radiation, dirt, and various other environmental hazards.

Coulbert, C.

Encapsulation of PV cells using silicone materials

The use of silicone materials as thin conformal coatings for the protection of photovoltaic cells is investigated. Five silicone materials ranging from soft elastomers to high modulus resins were evaluated after exposure to UV radiation, outdoor weathering, thermal cycling at high humidity and temperature cycling from -40 C to 90 C. The effects of these tests were monitored by periodically measuring the output of two-cell circuit strings encapsulated with the various materials, and one exceptional silicone coating for which no significant changes in cell output were noted after 300 days was chosen as the best of the candidates. Because only a thin coating of the substance is needed, material costs 60% lower than those of previous encapsulants are now possible.

Dennis, W. E.

Development of design, qualification, screening, and application requirements for plastic encapsulated solid-state devices for space applications

Test data were collected on 1035 plastic encapsulated devices and 75 hermetically scaled control group devices that were purchased from each of five different manufacturers in the categories of (1) low power Schottsky TTL (bipolar) digital circuits; (2) CMOS digital circuits; (3) operational amplifier linear circuits; and (4) NPN transistors. These parts were subjected to three different initial screening conditions, then to extended life testing, to determine any possible advantages or trends for any particular screen. Several tests were carried out in the areas of flammability testing, humidity testing, high pressure steam (auroclave) testing, and high temperature storage testing. Test results are presented. Procurement and application considerations for use of plastic encapsulated semiconductors are presented and a statistical analysis program written to study the log normal distributions resulting from life testing is concluded.

Source record

Investigation of test methods, material properties, and processes for solar cell encapsulants

Encapsulant materials and processes for the production of cost-effective, long-life solar cell modules were investigated. The following areas were explored: (1) soil resistant surface treatment; (2) corrosion protecting coatings from mild steel substrates; (3) primers for bonding module interfaces; and (4) RS/4 accelerated aging of candidate encapsulation compounds

Willis, P. B.

Photothermal characterization of encapsulant materials for photovoltaic modules

A photothermal test matrix and a low cost testing apparatus for encapsulant materials of photovoltaic modules were defined. Photothermal studies were conducted to screen and rank existing as well as future encapsulant candidate materials and/or material formulations in terms of their long term physiochemical stability under accelerated photothermal aging conditions. Photothermal characterization of six candidate pottant materials and six candidate outer cover materials were carried out. Principal products of photothermal degradation are identified. Certain critical properties are also monitored as a function of photothermal aging.

Liang, R. H.

Photovoltaic encapsulation materials

Candidate materials for the construction of cost-effective solar cell flat array modules are reviewed. Fabrication goals include electricity production at $.70/W with a lifetime of 20 yr. Research is currently directed toward low cost encapsulants and substrates for the cells, and outer covers which resist weathering. Ethylene/vinyl acetate copolymer (EVA) at $.09/sq ft has displayed the most promising results as the encapsulant laminate when subjected to peroxide cross-linking to prevent melting. EVA accepts the addition of antioxidants, quenchers, absorbers, and stabilizers. Wood is favored as the rigid substrate due to cost, while top covers in substrate modules comprise candidate acrylic and polyvinyl fluoride films and a copolymer. Finally, fiberglass mat is placed between the substrate and the EVA pottant as a mechanical support and for electrical insulation.

Baum, B.

An analytical approach to photovoltaic encapsulation system design

This paper describes a set of analytical methods which have been developed to enable quantitative analysis of encapsulation system designs for terrestrial photovoltaic modules. Design factors determined most important include: encapsulant thickness and modules, emissivity of module surface, ribs on substrate modulus, and AR.

Garcia, A., III

Screening Plastic-Encapsulated Solid-State Devices

Suitability of plastic-encapsulated solid-state electronic devices for use in spacecraft discussed. Conclusion of preliminary study was plasticencapsulated parts sufficiently reliable to be considered for use in lowcost equipment used at moderate temperature and low humidity. Useful to engineers as guides to testing or use of plastic encapsulated semiconductors in severe terrestrial environments.

Buldhaupt, L.

Investigation of Test Methods, Material Properties and Processes for Solar Cell Encapsulants

The evaluation of potentially useful low cost encapsulation materials is discussed. The goal is to identify, evaluate, test and recommend encapsulant materials and processes for the production of cost effective, long life solar cell modules. Technical investigations concerned the development of advanced cure chemistries for lamination type pottants; the continued evaluation of soil resistant surface treatment, and the results of an accelerated aging test program for the comparison of material stabilities. New compounds were evaluated for efficiency in curing both ethylene/vinyl acetate and ethylene/methyl acrylate pottants intended for vacuum bag lamination of solar cells. Two component aliphatic urethane casting syrups were evaluated for suitability as solar module pottants on the basis of optical, physical and fabrication characteristics.

Willis, P.

Photovoltaic module bypass diode encapsulation

The design and processing techniques necessary to incorporate bypass diodes within the module encapsulant are presented. The Semicon PN junction diode cells were selected. Diode junction to heat spreader thermal resistance measurements, performed on a variety of mounted diode chip types and sizes, have yielded values which are consistently below 1 deg C per watt, but show some instability when thermally cycled over the temperature range from -40 to 150 deg C. Three representative experimental modules, each incorporating integral bypass diode/heat spreader assemblies of various sizes, were designed. Thermal testing of these modules enabled the formulation of a recommended heat spreader plate sizing relationship. The production cost of three encapsulated bypass diode/heat spreader assemblies were compared with similarly rated externally mounted packaged diodes. It is concluded that, when proper designed and installed, these bypass diode devices will improve the overall reliability of a terrestrial array over a 20 year design lifetime.

Shepard, N. J., Jr.

Liquid encapsulated Czochralski growth of low dislocation GaAs

The availability of high-quality, large-diameter GaAs substrates is key to the successful development and production of high-speed GaAs devices and high-efficiency GaAs solar cells. The liquid encapsulated Czochralski (LEC) technique has provided a means for producing large-diameter GaAs. Progress in improving the LEC growth process which has resulted in 3-inch GaAs crystals with exceptionally low dislocation densities and reduced propensity for twinning is reported. Undoped, semi-insulating GaAs ingots were grown in a Melbourn high-pressure LEC system. The effects of seed perfection, seed necking, cone angle, melt stoichiometry, ambient pressure, thickness of the B2O3 encapsulating layer, and diameter control on the dislocation density were investigated. The material was characterized by preferential etching and X-ray topography. It is shown that 3-inch diameter substrates can be produced with dislocation densities as low as 6000 per sq cm through proper selection and control of growth parameters. Also, the incidence of twinning can be reduced significantly by growing from slightly As-rich melts.

Kirkpatrick, C. G.

Application of image processing technology to problems in manuscript encapsulation

The long term effects of encapsulation individual sheets of the Codex Hammer were investigated. The manuscript was simulated with similar sheets of paper which were photographed under repeatable raking light conditions to enhance their surface texture, encapsulated in plexiglas, cycled in an environmental test chamber, and rephotographed at selected intervals. The film images were digitized, contrast enhanced, geometrically registered, and apodized. An FFT analysis of a control sheet and two experimental sheets indicates no micro-burnishing, but reveals that the ""mesoscale'' deformations with sizes 8mm are degrading monotonically, which is of no concern. Difference image analysis indicates that the sheets were increasingly stressed with time and that the plexiglas did not provide a sufficient environmental barrier under the simulation conditions. The relationship of these results to the Codex itself is to be determined.

Glackin, D. L.

Investigation of test methods, material properties and processes for solar cell encapsulants

Low cost encapsulation materials for the Flat Plate Solar Array Program (FSA) are investigated. The goal of the program is to identify, test, evaluate and recommend encapsulation materials and processes for the fabrication of cost effective and long life solar modules. Accelerated aging techniques for module component lifetime studies, investigation of candidate outer cover films and continued evaluation of soil repellant coatings are also included.

Willis, P. B.

Photovoltaic module encapsulation design and materials section, volume 2

Tests for chemical structure, material properties, water absorption, aging and curing agent of Ethylene Vinyl Acetate (EVA) and UV absorption studies are carried out. A computer model was developed for thermal optical modeling, to investigate dependence between module operating temperature and solar insolation, and heat dissapation behavior. Structural analyses were performed in order to determine the stress distribution under wind and heat conditions. Curves are shown for thermal loading conditions. An electrical isolation was carried out to investigate electrical stress aging of non-metallic encapsulation materials and limiting material flaws, and to develop a computer model of electrical fields and stresses in encapsulation materials. In addition, a mathematical model was developed and tests were conducted to predict hygroscopic and thermal expansion and contraction on a plastic coated wooden substrate. Thermal cycle and humidity freezing cycle tests, partial discharge tests, and hail impact tests were also carried out. Finally, the effects of soiling on the surface of photovoltaic modules were investigated. Two antisoiling coatings, a fluorinated silane and perflourodecanoic acid were considered.

Cuddihy, E. F.

Design, analysis and test verification of advanced encapsulation systems

The analytical methodology for advanced encapsulation designs for the development of photovoltaic modules is presented. Analytical models are developed to test optical, thermal, electrical and structural properties of the various encapsulation systems. Model data is compared to relevant test data to improve model accuracy and develop general principles for the design of photovoltaic modules.

Garcia, A., III

Investigation of test methods, material properties and processes for solar cell encapsulants

The goal of the program is to identify, test, evaluate and recommend encapsulation materials and processes for the fabrication of cost-effective and long life solar modules. Of the $18 (1948 $) per square meter allocated for the encapsulation components approximately 50% of the cost ($9/sq m) may be taken by the load bearing component. Due to the proportionally high cost of this element, lower costing materials were investigated. Wood based products were found to be the lowest costing structural materials for module construction, however, they require protection from rainwater and humidity in order to acquire dimensional stability. The cost of a wood product based substrate must, therefore, include raw material costs plus the cost of additional processing to impart hygroscopic inertness. This protection is provided by a two step, or split process in which a flexible laminate containing the cell string is prepared, first in a vacuum process and then adhesively attached with a back cover film to the hardboard in a subsequent step.

Willis, P. B.

Encapsulation materials research

Encapsulation materials for solar cells were investigated. The different phases consisted of: (1) identification and development of low cost module encapsulation materials; (2) materials reliability examination; and (3) process sensitivity and process development. It is found that outdoor photothermal aging devices (OPT) are the best accelerated aging methods, simulate worst case field conditions, evaluate formulation and module performance and have a possibility for life assessment. Outdoor metallic copper exposure should be avoided, self priming formulations have good storage stability, stabilizers enhance performance, and soil resistance treatment is still effective.

Willis, P. B.