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At least 91 records · Page 5

Corrugated Quantum Well Infrared Photodetector Focal Plane Array Test Results

The corrugated quantum-well infrared photodetector (C-QWIP) uses total internal reflection to couple normal incident light into the optically active quantum wells. The coupling efficiency has been shown to be relatively independent of the pixel size and wavelength thus making the C-QWIP a candidate for detectors over the entire infrared spectrum. The broadband coupling efficiency of the C-QWIP makes it an ideal candidate for multiwavelength detectors. We fabricated and tested C-QWIP focal plane arrays (FPAs) with cutoff wavelengths of 11.2 and 16.2 micrometers. Each FPA has 256 x 256 pixels that are bump-bonded to a direct injection readout circuit. Both FPAs provided infrared imagery with good aesthetic attributes. For the 11.2-micrometers FPA, background-limited performance (BLIP) was observed at 60 K with f/3 optics. For the 16.2-micrometers FPA, BLIP was observed at 38 K. Besides the reduction of dark current in C-QWIP structures, the measured internal quantum efficiency (eta) remains to be high. The values for responsivity and quantum efficiency obtained from the FPA results agree well with those measured for single devices.

Goldberg, A.↗

Mapping Electrical Crosstalk in Pixelated Sensor Arrays

Electronic coupling effects such as Inter-Pixel Capacitance (IPC) affect the quantitative interpretation of image data from CMOS, hybrid visible and infrared imagers alike. Existing methods of characterizing IPC do not provide a map of the spatial variation of IPC over all pixels. We demonstrate a deterministic method that provides a direct quantitative map of the crosstalk across an imager. The approach requires only the ability to reset single pixels to an arbitrary voltage, different from the rest of the imager. No illumination source is required. Mapping IPC independently for each pixel is also made practical by the greater S/N ratio achievable for an electrical stimulus than for an optical stimulus, which is subject to both Poisson statistics and diffusion effects of photo-generated charge. The data we present illustrates a more complex picture of IPC in Teledyne HgCdTe and HyViSi focal plane arrays than is presently understood, including the presence of a newly discovered, long range IPC in the HyViSi FPA that extends tens of pixels in distance, likely stemming from extended field effects in the fully depleted substrate. The sensitivity of the measurement approach has been shown to be good enough to distinguish spatial structure in IPC of the order of 0.1%.

focal plane array↗

Fast, High-Precision Readout Circuit for Detector Arrays

The GEO-CAPE mission described in NASA's Earth Science and Applications Decadal Survey requires high spatial, temporal, and spectral resolution measurements to monitor and characterize the rapidly changing chemistry of the troposphere over North and South Americas. High-frame-rate focal plane arrays (FPAs) with many pixels are needed to enable such measurements. A high-throughput digital detector readout integrated circuit (ROIC) that meets the GEO-CAPE FPA needs has been developed, fabricated, and tested. The ROIC is based on an innovative charge integrating, fast, high-precision analog-to-digital circuit that is built into each pixel. The 128×128-pixel ROIC digitizes all 16,384 pixels simultaneously at frame rates up to 16 kHz to provide a completely digital output on a single integrated circuit at an unprecedented rate of 262 million pixels per second. The approach eliminates the need for off focal plane electronics, greatly reducing volume, mass, and power compared to conventional FPA implementations. A focal plane based on this ROIC will require less than 2 W of power on a 1×1-cm integrated circuit. The ROIC is fabricated of silicon using CMOS technology. It is designed to be indium bump bonded to a variety of detector materials including silicon PIN diodes, indium antimonide (InSb), indium gallium arsenide (In- GaAs), and mercury cadmium telluride (HgCdTe) detector arrays to provide coverage over a broad spectral range in the infrared, visible, and ultraviolet spectral ranges.

Rider, David M.↗

Large format long-wavelength infrared narrow-band, multi-band, and broad-band QWIP focal plane arrays

A 640x512 pixel, long-wavelength cutoff, narrow-band quantum well infrared photodetector focal pllay array, a four-band QWIP FPA in 4-16 um spectral region, and a broad-band QWIP FPA having 15.4 mum cutoff have been demonstrated. In this paper we discuss the detector designs, dark currents, quantum efficiencies, responsivities, detectivities, noise equivalent differential temperatures, the effect of FPA nonuniformity on performance, and the operabilities of these QWIP FPAs.

Mumolo, J. M.↗

High density Schottky barrier IRCCD sensors for SWIR applications at intermediate temperature

Monolithic 32 x 64 and 64 x 1:128 palladium silicide (Pd2Si) interline transfer infrared charge coupled devices (IRCCDs) sensitive in the 1 to 3.5 micron spectral band were developed. This silicon imager exhibits a low response nonuniformity of typically 0.2 to 1.6% rms, and was operated in the temperature range between 40 to 140 K. Spectral response measurements of test Pd2Si p-type Si devices yield quantum efficiencies of 7.9% at 1.25 microns, 5.6% at 1.65 microns 2.2% at 2.22 microns. Improvement in quantum efficiency is expected by optimizing the different structural parameters of the Pd2Si detectors. The spectral response of the Pd2Si detectors fit a modified Fowler emission model. The measured photo-electric barrier height for the Pd2Si detectors is 0.34 eV and the measured quantum efficiency coefficient, C1, is 19%/eV. The dark current level of Pd2Si Schottky barrier focal plane arrays (FPAs) is sufficiently low to enable operation at intermediate temperatures at TV frame rates. Typical dark current level measured at 120 K on the FPA is 2 nA/sq cm. The operating temperature of the Pd2Si FPA is compatible with passive cooler performance. In addition, high density Pd2Si Schottky barrier FPAs are manufactured with high yield and therefore represent an economical approach to short wavelength IR imaging. A Pd2Si Schottky barrier image sensor for push-broom multispectral imaging in the 1.25, 1.65, and 2.22 micron bands is being studied. The sensor will have two line arrays (dual band capability) of 512 detectors each, with 30 micron center-to-center detector spacing. The device will be suitable for chip-to-chip abutment, thus providing the capability to produce large, multiple chip focal planes with contiguous, in-line sensors.

Elabd, H.↗

8-9 and 14-15 Micron Two-Color 640x486 GaAs/AlGaAs Quantum Well Infrared Photodetector (QWIP) Focal Plane Array Camera

An optimized long-wavelength two-color Quantum Well Infrared Photodetector (QWIP) device structure has been designed. This device structure was grown on a three inch semi-insulating GaAs substrate by molecular beam epitaxy (MBE). This wafer was processed into several 640x486 format monolithically integrated 8-9 and 14-15 micron two color (or dual wavelength) QWIP focal plane arrays (FPAs). These FPAs were then hybridized to 640x486 silicon CMOS readout multiplexers. A thinned (i.e., substrate removed) FPA hybrid was integrated into a liquid helium cooled dewar to perform electrical and optical characterization and to demonstrate simultaneous two-color imagery. The 8-9 micron detectors in the FPA have shown background limited performance (BLIP) at 70 K operating temperature, at 300 K background with f/2 cold stop. The 14-15 micron detectors of the FPA have reached BLIP at 40 K operating temperature at the same background conditions. In this presentation we discuss the performance of this long-wavelength dualband QWIP FPA in quantum efficiency, detectivity, noise equivalent temperature difference (NEAT), uniformity, and operability.

Gunapala, S. D.↗

Carrier Plus: A sensor payload for Living With a Star Space Environment Testbed (LWS/SET)

The Defense Threat Reduction Agency (DTR4) and National Aeronautics and Space Administration (NASA) Goddard Space Flight Center are collaborating to develop the Carrier Plus sensor experiment platform as a capability of the Space Environments Testbed (SET). The Space Environment Testbed (SET) provides flight opportunities for technology experiments as part of NASA's Living With a Star (LWS) program. The Carrier Plus will provide new capability to characterize sensor technologies such as state-of-the-art visible focal plane arrays (FPAs) in a natural space radiation environment. The technical objectives include on-orbit validation of recently developed FPA technologies and performance prediction methodologies, as well as characterization of the FPA radiation response to total ionizing dose damage, displacement damage and transients. It is expected that the sensor experiment will carry 4-6 FPAs and associated radiation correlative environment monitors (CEMs) for a 2006-2007 launch. Sensor technology candidates may include n- and p-charge coupled devices (CCDs), active pixel sensors (APS), and hybrid CMOS arrays. The presentation will describe the Carrier Plus goals and objectives, as well as provide details about the architecture and design. More information on the LWS program can be found at http://lws.gsfc.nasa.gov/. Business announcements for LWS/SET and program briefings are posted at http://lws-set.gsfc.nasa.gov

Marshall, Cheryl J.↗

Integrating indium antimonide linear arrays at 65K and below

A schematic is presented of a simplified electronic architecture of experimental 128 element infrared imager. Tables are given of sample diode responsivity, 512 element focal plane performance summary, and 128 element FPA mechanical and electrical characteristics. Typical 43 x 43 micron detector IV characteristics at 84 K are given, along with typical 43 x 43 micron Indium Antimonide CV characteristic at 83 K.

Bailey, Gary C.↗

640 x 512 Pixels Long-Wavelength Infrared (LWIR) Quantum-Dot Infrared Photodetector (QDIP) Imaging Focal Plane Array

Epitaxially grown self-assembled. InAs-InGaAs-GaAs quantum dots (QDs) are exploited for the development of large-format long-wavelength infrared focal plane arrays (FPAs). The dot-in-a-well (DWELL) structures were experimentally shown to absorb both 45 degrees and normal incident light, therefore, a reflection grating structure was used to enhance the quantum efficiency. The devices exhibit peak responsivity out to 8.1 micrometers, with peak detectivity reaching approximately 1 X 10(exp 10) Jones at 77 K. The devices were fabricated into the first long-wavelength 640 x 512 pixel QD infrared photodetector imaging FPA, which has produced excellent infrared imagery with noise equivalent temperature difference of 40 mK at 60-K operating temperature.

quantum dots (QDs)↗

Development of Thermal Infrared Sensor to Supplement Operational Land Imager

The thermal infrared sensor (TIRS) is a quantum well infrared photodetector (QWIP)-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 m. The focal plane will contain three 640 ~512 QWIP arrays mounted onto a silicon substrate. The readout integrated circuit (ROIC) addresses each pixel on the QWIP arrays and reads out the pixel value (signal). The ROIC is controlled by the focal plane electronics (FPE) by means of clock signals and bias voltage value. The means of how the FPE is designed to control and interact with the TIRS focal plane assembly (FPA) is the basis for this work. The technology developed under the FPE is for the TIRS focal plane assembly (FPA). The FPE must interact with the FPA to command and control the FPA, extract analog signals from the FPA, and then convert the analog signals to digital format and send them via a serial link (USB) to a computer. The FPE accomplishes the described functions by converting electrical power from generic power supplies to the required bias power that is needed by the FPA. The FPE also generates digital clocking signals and shifts the typical transistor-to-transistor logic (TTL) to }5 V required by the FPA. The FPE also uses an application- specific integrated circuit (ASIC) named System Image, Digitizing, Enhancing, Controlling, And Retrieving (SIDECAR) from Teledyne Corp. to generate the clocking patterns commanded by the user. The uniqueness of the FPE for TIRS lies in that the TIRS FPA has three QWIP detector arrays, and all three detector arrays must be in synchronization while in operation. This is to avoid data skewing while observing Earth flying in space. The observing scenario may be customized by uploading new control software to the SIDECAR.

Shu, Peter↗

Development of High-Performance Detector Technology for UV and IR Applications

Sensing and imaging for ultraviolet (UV) and infrared (IR) bands has many applications for NASA, defense, and commercial systems. Recent work has involved developing UV avalanche photodiode (UVAPD) arrays with high gain for high resolution imaging. Various GaN/AlGaN p-i-n UV-APDs have been fabricated from epitaxial structures grown by metalorganic chemical vapor deposition (MOCVD) on GaN substrates with avalanche gains greater than 5×105, and high responsivities. Similarly, the IR spectral band is useful for measuring ocean temperatures, atmospheric aerosols, forest fires, etc. We are also developing room temperature operating graphene-enhanced PbSe midwave infrared (MWIR) detectors and focal plane arrays (FPAs). These compact and low-cost MWIR sensors can benefit various NASA remote sensing applications. Here we present recent results from these high performance UV- and IR-band detector and FPA technologies.

Sood, Ashok K.↗

Miniaturized Electronic System for the Planetary Integrated Camera Spectrometer

This paper discusses the design and implementation of a miniaturized electronic system for the Planetary Integrated Camera-Spectrometer (PICS). The PICS electronics demonstrates the application of Field Programmable Gate Arrays (FPGAs) and of analog hybrid technology to space flight multispectral systems. A discussion of the electronic system design illustrates how a multisensor instrument consisting of an UV CCD, two visible CCDs, and a near-IR focal plane assembly can be processed through a common set of electronics. Following the system design discussion, the actual electronic design will be presented. Each miniaturized module will be discussed as to functionality and performance. The test setup for bench checkout of a cooled CCD and an IR FPA, including results with breadboard electronics and with the hybrids are also described.

CCD↗

Fast Imaging Detector Readout Circuits with In-Pixel ADCs for Fourier Transform Imaging Spectrometers

Focal plane arrays (FPAs) with high frame rates and many pixels benefit several upcoming Earth science missions including GEO-CAPE, GACM, and ACE by enabling broader spatial coverage and higher spectral resolution. FPAs for the PanFTS, a high spatial resolution Fourier transform spectrometer and a candidate instrument for the GEO-CAPE mission are the focus of the developments reported here, but this FPA technology has the potential to enable a variety of future measurements and instruments. The ESTO ACT Program funded the developed of a fast readout integrated circuit (ROIC) based on an innovative in-pixel analog-to-digital converter (ADC). The 128 X 128 pixel ROIC features 60 ?m pixels, a 14-bit ADC in each pixel and operates at a continuous frame rate of 14 kHz consuming only 1.1 W of power. The ROIC outputs digitized data completely eliminating the bulky, power consuming signal chains needed by conventional FPAs. The 128 X 128 pixel ROIC has been fabricated in CMOS and tested at the Jet Propulsion Laboratory. The current version is designed to be hybridized with PIN photodiode arrays via indium bump bonding for light detection in the visible and ultraviolet spectral regions. However, the ROIC design incorporates a small photodiode in each cell to permit detailed characterization of the ROICperformance without the need for hybridization. We will describe the essential features of the ROIC design and present results of ROIC performance measurements.

focal plane arrays (FPAs)↗

Multi-Color QWIP FPAs for Hyperspectral Thermal Emission Instruments

Infrared focal plane arrays (FPAs) covering broad mid- and long-IR spectral ranges are the central parts of the spectroscopic and imaging instruments in several Earth and planetary science missions. To be implemented in the space instrument these FPAs need to be large-format, uniform, reproducible, low-cost, low 1/f noise, and radiation hard. Quantum Well Infrared Photodetectors (QWIPs), which possess all needed characteristics, have a great potential for implementation in the space instruments. However a standard QWIP has only a relatively narrow spectral coverage. A multi-color QWIP, which is compromised of two or more detector stacks, can to be used to cover the broad spectral range of interest. We will discuss our recent work on development of multi-color QWIP for Hyperspectral Thermal Emission Spectrometer instruments. We developed QWIP compromising of two stacks centered at 9 and 10.5 ?m, and featuring 9 grating regions optimized to maximize the responsivity in the individual subbands across the 7.5-12 ?m spectral range. The demonstrated 1024x1024 QWIP FPA exhibited excellent performance with operability exceeding 99% and noise equivalent differential temperature of less than 15 mK across the entire 7.5-12 ?m spectral range.

Infrared focal plane arrays (FPAs)↗

Modulation Transfer Function of Infrared Focal Plane Arrays

Modulation transfer function (MTF) is the ability of an imaging system to faithfully image a given object. The MTF of an imaging system quantifies the ability of the system to resolve or transfer spatial frequencies. In this presentation we will discuss the detail MTF measurements of 1024x1024 pixels mid -wavelength and long- wavelength quantum well infrared photodetector, and 320x256 pixels long- wavelength InAs/GaSb superlattice infrared focal plane arrays (FPAs). Long wavelength Complementary Barrier Infrared Detector (CBIRD) based on InAs/GaSb superlattice material is hybridized to recently designed and fabricated 320x256 pixel format ROIC. The n-type CBIRD was characterized in terms of performance and thermal stability. The experimentally measured NE delta T of the 8.8 micron cutoff n-CBIRD FPA was 18.6 mK with 300 K background and f/2 cold stop at 78K FPA operating temperature. The horizontal and vertical MTFs of this pixel fully delineated CBIRD FPA at Nyquist frequency are 49% and 52%, respectively.

long-wave infrared↗

Test results of Spacelab 2 infrared telescope focal plane

The small helium cooled infrared telescope for Spacelab 2 is designed for sensitive mapping of extended, low-surface-brightness celestial sources as well as highly sensitive investigations of the shuttle contamination environment (FPA) for this mission is described as well as the design for a thermally isolated, self-heated J-FET transimpedance amplifier. This amplifier is Johnson noise limited for feedback resistances from less than 10 to the 8th power Omega to greater than 2 x 10 to the 10th power Omega at T = 4.2K. Work on the focal plane array is complete. Performance testing for qualification of the flight hardware is discussed, and results are presented. All infrared data channels are measured to be background limited by the expected level of zodiacal emission.

Young, E. T.↗

Mixed Linear/Square-Root Encoded Single-Slope Ramp Provides Low-Noise ADC with High Linearity for Focal Plane Arrays

Single-slope analog-to-digital converters (ADCs) are particularly useful for onchip digitization in focal plane arrays (FPAs) because of their inherent monotonicity, relative simplicity, and efficiency for column-parallel applications, but they are comparatively slow. Squareroot encoding can allow the number of code values to be reduced without loss of signal-to-noise ratio (SNR) by keeping the quantization noise just below the signal shot noise. This encoding can be implemented directly by using a quadratic ramp. The reduction in the number of code values can substantially increase the quantization speed. However, in an FPA, the fixed pattern noise (FPN) limits the use of small quantization steps at low signal levels. If the zero-point is adjusted so that the lowest column is onscale, the other columns, including those at the center of the distribution, will be pushed up the ramp where the quantization noise is higher. Additionally, the finite frequency response of the ramp buffer amplifier and the comparator distort the shape of the ramp, so that the effective ramp value at the time the comparator trips differs from the intended value, resulting in errors. Allowing increased settling time decreases the quantization speed, while increasing the bandwidth increases the noise. The FPN problem is solved by breaking the ramp into two portions, with some fraction of the available code values allocated to a linear ramp and the remainder to a quadratic ramp. To avoid large transients, both the value and the slope of the linear and quadratic portions should be equal where they join. The span of the linear portion must cover the minimum offset, but not necessarily the maximum, since the fraction of the pixels above the upper limit will still be correctly quantized, albeit with increased quantization noise. The required linear span, maximum signal and ratio of quantization noise to shot noise at high signal, along with the continuity requirement, determines the number of code values that must be allocated to each portion. The distortion problem is solved by using a lookup table to convert captured code values back to signal levels. The values in this table will be similar to the intended ramp value, but with a correction for the finite bandwidth effects. Continuous-time comparators are used, and their bandwidth is set below the step rate, which smoothes the ramp and reduces the noise. No settling time is needed, as would be the case for clocked comparators, but the low bandwidth enhances the distortion of the non-linear portion. This is corrected by use of a return lookup table, which differs from the one used to generate the ramp. The return lookup table is obtained by calibrating against a stepped precision DC reference. This results in a residual non-linearity well below the quantization noise. This method can also compensate for differential non-linearity (DNL) in the DAC used to generate the ramp. The use of a ramp with a combination of linear and quadratic portions for a single-slope ADC is novel. The number of steps is minimized by keeping the step size just below the photon shot noise. This in turn maximizes the speed of the conversion. High resolution is maintained by keeping small quantization steps at low signals, and noise is minimized by allowing the lowest analog bandwidth, all without increasing the quantization noise. A calibrated return lookup table allows the system to maintain excellent linearity.

Wrigley, Chris J.↗