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Results for “Micro Electro Mechanical Systems (MEMS)”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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83 records · Page 5

Concept for a Micro Autonomous Ultrasonic Instrument (MAUI)

We investigate a concept for the construction a mobile Micro Optical ElectroMechanical Systems (MOEMS) based laser ultrasonic instrument to serve as a Micro Autonomous Ultrasonic Instrument (MAUI). The system will consist of a laser ultrasonic instrument fabricated using Micro Electro-Mechanical Systems (MEMS) technology, and a MEMS based walking platform like those developed by Pister et al. at Berkeley. This small system will allow for automated remote Non-Destructive Evaluation (NDE) of aerospace vehicles.

Wilson, William C.↗

Electroactive Polymer Actuated Miniature Robotics

This reported study is concentrating on the development of effective EAPs and the resultant enabling mechanisms employing their unique characteristics.

ionomer micro-electro-mechanical systems MEMS↗

Electrostatic Microshutter Arrays

Based on the Microshutter Array (MSA) subsystems developed at NASA Goddard Space Flight Center (GSFC) for the James Webb Space Telescope (JWST), Next Generation Microshutter Array (NGMSA) has been developed to be used as multi-object selectors for future telescopes in space applications. Microshutter arrays function as transmission devices. Selected shutters fully open at 90 degrees permitting income light going through, while the rest of shutters keep closed. The programmable microshutter open and close make the device perform as a multi object selector that can be used on space telescopes. Utilizing a multi object selector, the telescope efficiency can be increased to 100 times or more. Like JWST MSAs, NGMSA features torsion hinges, light shields, front and back electrodes for shutter actuation, latch, and closing. The difference is that JWST MSA utilized the magnetic actuation while NGMSA the electrostatic actuation.

Micro-electro-mechanical-system (MEMS)↗

Diffusion Bonding of Silicon Carbide for a Micro-Electro-Mechanical Systems Lean Direct Injector

Robust approaches for joining silicon carbide (SiC) to silicon carbide sub-elements have been developed for a micro-electro-mechanical systems lean direct injector (MEMS LDI) application. The objective is to join SiC sub-elements to form a leak-free injector that has complex internal passages for the flow and mixing of fuel and air. Previous bonding technology relied upon silicate glass interlayers that were not uniform or leak free. In a newly developed joining approach, titanium foils and physically vapor deposited titanium coatings were used to form diffusion bonds between SiC materials during hot pressing. Microscopy results show the formation of well adhered diffusion bonds. Initial tests show that the bond strength is much higher than required for the component system. Benefits of the joining technology are fabrication of leak free joints with high temperature and mechanical capability.

Halbig, Michael C.↗

Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications

A robust joining approach is critically needed for a Micro-Electro-Mechanical Systems-Lean Direct Injector (MEMS-LDI) application which requires leak free joints with high temperature mechanical capability. Diffusion bonding is well suited for the MEMS-LDI application. Diffusion bonds were fabricated using titanium interlayers between silicon carbide substrates during hot pressing. The interlayers consisted of either alloyed titanium foil or physically vapor deposited (PVD) titanium coatings. Microscopy shows that well adhered, crack free diffusion bonds are formed under optimal conditions. Under less than optimal conditions, microcracks are present in the bond layer due to the formation of intermetallic phases. Electron microprobe analysis was used to identify the reaction formed phases in the diffusion bond. Various compatibility issues among the phases in the interlayer and substrate are discussed. Also, the effects of temperature, pressure, time, silicon carbide substrate type, and type of titanium interlayer and thickness on the microstructure and composition of joints are discussed.

Halbig, Michael C.↗

Flip chip packaging of a MEMS neuro-prosthetic system

A joint research team from California Institute of Technology and Jet Propulsion Laboratory is developing a fully miniaturized, smart implantable neuro-prosthetic system, by combining integrated electronics with Micro Electro Mechanical Structure (MEMS) based electrode arrays. The packaging group of this project team has been tasked with designing and fabricating a package to interface electrically between a MEMS electrode array, capable of extracting signals from brain, and an electronic chip, capable of providing on chip conditioning/processing of extracted data, while delivering the output data to a detector located outside the body.

flip↗

Simulation of MEMS for the Next Generation Space Telescope

The NASA Goddard Space Flight Center (GSFC) is developing optical micro-electromechanical system (MEMS) components for potential application in Next Generation Space Telescope (NGST) science instruments. In this work, we present an overview of the electro-mechanical simulation of three MEMS components for NGST, which include a reflective micro-mirror array and transmissive microshutter array for aperture control for a near infrared (NIR) multi-object spectrometer and a large aperture MEMS Fabry-Perot tunable filter for a NIR wide field camera. In all cases the device must operate at cryogenic temperatures with low power consumption and low, complementary metal oxide semiconductor (CMOS) compatible, voltages. The goal of our simulation efforts is to adequately predict both the performance and the reliability of the devices during ground handling, launch, and operation to prevent failures late in the development process and during flight. This goal requires detailed modeling and validation of complex electro-thermal-mechanical interactions and very large non-linear deformations, often involving surface contact. Various parameters such as spatial dimensions and device response are often difficult to measure reliably at these small scales. In addition, these devices are fabricated from a wide variety of materials including surface micro-machined aluminum, reactive ion etched (RIE) silicon nitride, and deep reactive ion etched (DRIE) bulk single crystal silicon. The above broad set of conditions combine to be a formidable challenge for space flight qualification analysis. These simulations represent NASA/GSFC's first attempts at implementing a comprehensive strategy to address complex MEMS structures.

Mott, Brent↗

High Contrast Programmable Field Masks for JWST NIRSpec

Microshutter arrays are one of the novel technologies developed for the James Webb Space Telescope (JWST). It will allow Near Infrared Spectrometer (NIRSpec) to acquire spectra of hundreds of objects simultaneously therefore increasing its efficiency tremendously. We have developed these programmable arrays that are based on Micro-Electro Mechanical Structures (MEMS) technology. The arrays are 2D addressable masks that can operate in cryogenic environment of JWST. Since the primary JWST science requires acquisition of spectra of extremely faint objects, it is important to provide very high contrast of the open to closed shutters. This high contrast is necessary to eliminate any possible contamination and confusion in the acquired spectra by unwanted objects. We have developed and built a test system for the microshutter array functional and optical characterization. This system is capable of measuring the contrast of the microshutter array both in visible and infrared light of the NIRSpec wavelength range while the arrays are in their working cryogenic environment. We have measured contrast ratio of several microshutter arrays and demonstrated that they satisfy and in many cases far exceed the NIRSpec contrast requirement value of 2000.

Kutyrev, Alexander S.↗