Search NASA⌕ Search

SEARCH · Search NASA

Results for “POWER ELECTRONICS”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Automotive Power Electronics Cooling Technology Research at NREL

This presentation describes power electronics thermal management technologies used for on-road EVs. Examples are provided and heat exchangers are described. Advanced cooling technologies developed are NREL to enable increased power density and enable high WBG temperature operation are then presented. The performance (e.g., thermal resistance, pumping power) of the advanced power electronics cooling technologies are compared to the performance of current, on-road technology.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2015

Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles

At present, single-phase liquid, forced convection cooled heat sinks with fins are used to cool power electronics in hybrid electric vehicles (HEVs). Although use of fins in the cooling channels increases heat transfer rates considerably, a second low-temperature radiator and associated pumping system are still required in HEVs. This additional cooling system adds weight and cost while decreasing the efficiency of HEVs. With the objective of eliminating this additional low-temperature radiator and pumping system in HEVs, an alternative cooling technology, subcooled boiling in the cooling channels, was investigated in the present study. Numerical heat transfer simulations were performed using subcooled boiling in the power electronics cooling channels with the coolant supplied from the existing main engine cooling system. Results show that this subcooled boiling system is capable of removing 25% more heat from the power electronics than the conventional forced convection cooling technology, or it can reduce the junction temperature of the power electronics at the current heat removal rate. With the 25% increased heat transfer option, high heat fluxes up to 250 W/cm(2) (typical for wideband-gap semiconductor applications) are possible by using the subcooled boiling system.

Heat transfer simulations↗
DOE OSTI2022

Start-up Optimization Considering Integrated Power Electronic Systems

The startup of systems composed of power electronic systems is becoming more complex. As the systems grow, standard pre-configuration sequencing methods will struggle. This work proposes a linear programming optimization method to couple power electronic systems in a series of startup commands. This formulation is demonstrated in a real-time implementation on hardware.

Starke, Michael↗
DOE OSTI2023

Automated Design-for-Reliability of a Power Electronics Module

The design of a power electronics module is a multiphysics problem and involves electrical, thermal, and reliability targets and constraints. Although the electrical and thermal design consider multiple aspects such as materials, geometry, and energy losses, reliability design is often limited to the selection of the attachment materials and electrical interconnect types. In this paper, we incorporate reliability metrics in the design phase by investigating the impact of package geometry on the thermomechanical behavior of the die-attachment material. To this end, we conducted thermal and power cycling simulations of a commercial six-pack power module with silicon carbide devices to compute junction temperature and strain energy density per cycle, respectively. We performed multiple simulations with different geometric dimensions and established a correlation between input features and output variables using subspace-based dimension reduction. The machine learning-based dimension reduction method serves as a surrogate model, which can be employed to identify the optimal module design from a thermal and reliability standpoint.

design-for-reliability↗
DOE OSTI2022

A 1kV, 480V Power Electronics Hub for DER Integration in Commercial Buildings

Power electronic (PE) systems are increasingly being integrated into distribution and sub-distribution networks in support of distributed energy resource integration (DERs), electric vehicle (EV) charging (particularly in the case of fast charging infrastructure), and improvement in power quality for high performance computing and/or servers farms. This provides an opportunity to research and develop integrated PE systems that can function as single systems thereby bringing additional functionality and benefits to the overall system. The goal of this paper is to demonstrate foundational technologies and capabilities for a multiport power electronics energy hub that can intelligently coordinate and control integrated sources and loads. The focus for this digest is on a commercial building use case which is demonstrated in hardware.

Starke, Michael↗
DOE OSTI2019

Networked Control and Optimization for Widescale Integration of Power Electronic Devices in Residential Homes

Power electronics devices are emerging at residential houses, including electric vehicles, energy storage systems, solar photovoltaic systems, and variable-speed air conditioners. Little work has been done on scalable and end-to-end architectures for integrating and engaging large number of residential behind-the-meter assets to provide grid services. In this paper, a framework for integration of a demand management system, home energy management system, and residential smart inverters is presented. Full measured results of inverter response to control signals is also presented.

Starke, Michael↗
DOE OSTI2024

A graphical user interface platform to support power electronic converters and integrated systems

Power Electronic Systems have grown in size and complexity over the past years. Therefore, users require interfaces to properly configure, develop, and deploy these systems. This work presents a Graphical User Interface that dynamically adapts to the system and allows the user to control and monitor its operation. This GUI uses networked communication and open-source Python libraries to allow the user to interact with the system at its different hierarchical layers, as well as visualize the interconnection of the full system. This is demonstrated by showing the user interface applied to a megawatt class charging station that consists of various energy resources.

Dean, Ben↗
DOE OSTI2019

Flexible Intelligent Real-time dc-ac grid Emulator (FIRE): Power Electronic Hardware-in-the-Loop (PE-HIL) Amplifier

Grid modernization efforts are leading to increased penetration of power electronics in the existing alternating current (ac) bulk power systems (BPS). Some examples of power electronics based applications that are being developed in BPS include high-voltage direct current (HVdc) systems, renewable generation systems, energy storage systems, and others. One of the requirements to succeed in the goals of grid modernization (like increased efficiency and reliability) is to setup a platform that can evaluate basic building blocks of such systems. For example, the basic building block of a modular multilevel converter (MMC)-based HVdc system is a submodule (SM). The evaluation platform will provide means to innovate new SM circuit architectures, new semiconductor devices in the SM, new gate-drivers, new controllers, and others. The flexible intelligent real-time dc-ac grid emulator (FIRE) platform incorporates the evaluation capability to evaluate the basic building blocks. The FIRE platform incorporates this evaluation capability through the power electronic hardware-in-the-loop (PE-HIL) concept. The PE-HIL for MMC-HVdc system can evaluate SMs in the MMC. In this paper, the design of amplifier required to perform PE-HIL simulation is presented. Experimental results of the amplifier and the simulation results of the PE-HIL concept utilizing the amplifier are presented.

Debnath, Suman↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2019

Power Electronics Thermal Management

This project develops thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter designs). The use of WBG-based devices in automotive power electronics will improve efficiency and increase driving range in electric-drive vehicles; however, the implementation of this technology is limited, in part, due to thermal issues. This project will develop system-level thermal models to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability. This project is a Vehicle Technologies Office, U.S. Department of Energy Office of Energy Efficiency and Renewable Energy funded project.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2020

Electron and hole mobility of rutile GeO 2 from first principles: An ultrawide-bandgap semiconductor for power electronics

Rutile germanium dioxide (r-GeO 2 ) is a recently predicted ultrawide-bandgap semiconductor with potential applications in high-power electronic devices, for which the carrier mobility is an important material parameter that controls the device efficiency. We apply first-principles calculations based on density functional and density functional perturbation theory to investigate carrier-phonon coupling in r-GeO 2 and predict its phonon-limited electron and hole mobilities as a function of temperature and crystallographic orientation. The calculated carrier mobilities at 300 K are μ elec , ⊥ c → = 244 cm 2 V –1 s –1 , μ elec , ∥ c → = 377 cm 2 V –1 s –1 , μ hole , ⊥ c → = 27 cm 2 V –1 s –1 , and μ hole , ∥ c → = 29 cm 2 V –1 s –1 . At room temperature, carrier scattering is dominated by the low-frequency polar-optical phonon modes. The predicted Baliga figure of merit of n -type r-GeO 2 surpasses several incumbent semiconductors such as Si, SiC, GaN, and β -Ga 2 O 3 , demonstrating its superior performance in high-power electronic devices.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2014

Power Electronics Thermal Management R&D (Presentation)

This project will investigate and develop thermal-management strategies for wide bandgap (WBG)-based power electronics systems. Research will be carried out to deal with thermal aspects at the module- and system-level. Module-level research will focus on die- and substrate-integrated cooling strategies and heat-transfer enhancement technologies. System-level research will focus on thermal-management strategies for the entire power electronics system to enable smart packaging solutions. One challenge with WBG device-based power electronics is that although losses in the form of heat may be lower, the footprint of the components is also likely to be reduced to reduce cost, weight, and volume. Combined with higher operational temperatures, this creates higher heat fluxes which much be removed from a smaller footprint, requiring advanced cooling strategies.

25 ENERGY STORAGE↗
DOE OSTI2021

A Remote Development Process and Platform for Power Electronic Systems

Like many areas in research and development, power electronic and distributed energy resource research and development slowed during the COVID pandemic. While the presence of the virus has reduced and workers are returning to shared offices, uncertainty of potential future challenges are still present. This work proposes a development and testing network that provides researchers the ability to operate remotely and coordinate control and debug activities for power electronic systems. This development and testing network has been demonstrated in both controller hardware-in-the-loop (C-HIL) and hardware testing.

Starke, Michael↗
DOE OSTI2022

Advanced Power Electronics and Electric Machines [Slides]

The presentation provides an overview of NREL's Advanced Power Electronics and Electric Machines (APEEM) group and its research activities. Power electronics thermal management systems for electric-drive vehicles are described and performance metrics are provided. Additionally, advanced cooling technologies developed at NREL are presented. Finally, an overview is provided for electric machine cooling, integrated drives, and thermomechanical research.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2016

Power Electronics Thermal Management R&D

This project will develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter designs). The use of WBG-based devices in automotive power electronics will improve efficiency and increase driving range in electric-drive vehicles; however, the implementation of this technology is limited, in part, due to thermal issues. This project will develop system-level thermal models to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2022

Reliability Aspects of Power-Dense Electric-Drive Power Electronics

This presentation provides a state of the art of electric-drive vehicle power electronics, and covers the APEEM Group research in thermomechanical and reliability aspects of advanced power electronics packaging. Some future directions are identified.

ADVANCED PROPULSION SYSTEMS↗