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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

A Compact, Modular Package for Superconducting Bolometer Arrays

As bolometer arrays grow to ever-larger formats, packaging becomes a more critical engineering issue. We have designed a detector package to house a superconducting bolometer array, SQUID multiplexers, bias and filtering circuitry, and electrical connectors. The package includes an optical filter, magnetic shielding, and has well-defined thermal and mechanical interfaces. An early version of this package has been used successfully in the GISMO 2mm camera, a 128-pixel camera operating at a base temperature of 270mK. A more advanced package permits operation at lower temperatures by providing direct heat sinking to the SQUIDS and bias resistors, which generate the bulk of the dissipation in the package. Standard electrical connectors provide reliable contact while enabling quick installation and removal of the package. We describe how the design compensates for differing thermal expansions, allows heat sinking of the bolometer array, and features magnetic shielding in critical areas. We highlight the performance of this detector package and describe its scalability to 1280-pixel arrays in the near future.

Benford, D.↗
NASA NTRS2010

The Assurance Challenges of Advanced Packaging Technologies for Electronics

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Sampson, Michael J.↗
NASA NTRS2010

Ultra Low Temperature Ultra Low Power Instrument Packages for Planetary Surfaces

Achievement of solar system exploration roadmap goals will involve robotic or human deployment and longterm operation of surface science packages remote from human presence, thus requiring autonomous, self-powered operation. The major challenge such packages face will be operating during long periods of darkness in extreme cold potentially without the Pu238 based power and thermal systems available to Apollo era packages (ALSEP). Development of such science payloads will thus require considerable optimization of instrument and subsystem design, packaging and integration for a variety of planetary surface environments in order to support solar system exploration fully. Our work supports this process through the incorporation of low temperature operational components and design strategies which radically minimize power, mass, and cost while maximizing the performance under extreme surface conditions that are in many cases more demanding than those routinely experienced by spacecraft in deep space. Chief instruments/instrument package candidates include those which could provide long-term monitoring of the surface and subsurface environments for fundamental science and human crew safety. The initial attempt to design a 10 instrument environmental monitoring package with a solar/battery based power system led to a package with a unacceptably large mass (500 kg) of which over half was battery mass. In phase 1, a factor of 5 reduction in mass was achieved, first through the introduction of high performance electronics capable of operating at far lower temperature and then through the use of innovative thermal balance strategies involving the use of multi-layer thin materials and gravity-assisted heat pipes. In phase 2, reported here, involves strategies such as universal incorporation of ULT/ULP digital and analog electronics, and distributed or non-conventionally packaged power systems. These strategies will be required to meet the far more challenging thermal requirements of operating through a normal 28 day diurnal cycle. The limited temperature range of efficient battery operation remains the largest obstacle.

Clark, P. E.↗
NASA NTRS2004

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗
NASA NTRSDate not supplied

A Notional Artemis Lunar Surface Exploration Package (ArLSEP) based on the Gandalf Staff Platform

Introduction: The Artemis program is planning to deliver crew and cargo to the lunar surface, but there is no current package for supporting lunar in-struments and experiments similar to the Apollo Lunar Surface Exploration Package (ALSEP). This abstract provides a possible concept for such a package using the Gandalf Staff Platform as a common core. Gandalf Staff: The Gandalf Staff is an early prototype system developed over FY’21/FY’22 using NASA Science Technology Mission Directorate (STMD) Center Information Fund (CIF) grants to de-sign, build and test “proof-of-concept” components. These components include a 24v battery powered monopole that powers a suite of subsystems, including a Graphical User Interface (GUI) for crew, surface voice and data communications, Lunar Search and Rescue (LunaSAR) navigation and communications, LiDAR, field site external lighting, 360-degree camera, and a geothermal instrument for measuring sub-surface temperature gradient. The staff can be carried independently by an Extra-Vehicular Activity (EVA) astronaut, or can be mounted into a tripod for “hands free” support at a surface site being investigated. The staff can be attached to an external solar array and power storage system for long-duration operations. [1,2] ALSEP: An ASLEP flew on each mission Apollo 12 to Apollo 17. For Apollo 11, a simplified packaged called the Early Apollo Scientific Experiments Pack-age (EASEP) was flown. Each package included a “Central Station” that provided the power and communications connected to a variety of instruments and sensors. The power was provided by a Radioisotope Thermoelectric Generator (RTG) fueled by Plutoni-um-238 generating 70 watts of power (initially, decayed over time) [3]. The communications system provide for direct to Earth data transfer from the lunar surface. Each pack-age was stowed externally in the Lunar Module (LM) Scientific Equipment (SEQ) bay with a mass up to 163 kg (Apollo 17). The crew unloaded the ALSEP from the LM and deployed the instruments on the lunar surface. Although designed to operate for only 1 year, many sites operated for up to 8 years successfully [4]. The Active Seismic Experiment (ASE) included 3 geophones for detecting seismic waves created by mortars and thumpers deployed by the crew. Other active experiments measured the lunar atmosphere, the heat flow in the subsurface, the lunar gravity and potential gravity waves, the lunar magnetic field, the solar wind and plasma interactions in cislunar space. Passive experiments included collectors for dust and cosmic rays, and retroreflectors for precise measurements of distance using a laser from Earth. The ALSEP program continues to generate insights into lunar formation and evolution. ArLSEP Concepts: The lunar surface science package for the Artemis program will hopefully exceed the capability of the ALSEP. There are multiple issues for discussion leading to the design of a new ArLSEP, needing requirements definition from the science community, NASA mission architecture, and NASA budget planners. 1. Delivery Mechanism Two possible projects currently provide capability to deliver scientific cargo to the lunar surface: 1) the Commercial Lunar Payload Services (CLPS) [5] and the Human Landing System (HLS) [6, 7]. Each project is controlled by a different organization within NASA and budgeted with different criteria although both support lunar exploration. The HLS system delivers crew (and potentially cargo) to human landing sites. If an ArLSEP is “predeployed” to such a site, the design must include power (either from the vehicle or independently) to keep the electronics functioning until deployed by the crew. If an ArLSEP is delivered on a vehicle after the crew is present on the lunar surface, safety protocols require adequate distance from the humans for impact from descent propelled sur-face regolith ejecta. This distance can not exceed the capability of the crew to walk (if no rover) to the vehicle for ArLSEP deployment. 2. Overall Guidelines The general design of ArLSEP will likely follow the ALSEP with a common system for communications and power; however, significant architecture differences between Apollo and Artemis exist. Power: The RTG will not be available for early Artemis missions nor likely follow-on Lunar Exploration Transportation Services (LETS) missions [8]. Thus, ArLSEP power must be supplied by solar arrays with sufficient battery capability to “keep alive” necessary electronics during any lunar surface eclipse period. Communication: The Artemis program is developing a series of communications satellites for lunar orbit to provide surface transmission of data and voice to Earth. Called “LunaNET”, this network is component useful for ArLSEP since south polar locations may not always have direct “line-of-sight” to Earth [9]. 3. Concept of Operations (ConOps) The general ConOps for ArLSEP is to deliver the package to lunar surface before the crew arrives, and then have the crew deploy the package after some period of time. This requires coordinated design (for power systems) and launch window (for schedule) on both the cargo and crew missions. Once the ArLSEP is deployed, it will operate autonomously for a number of years. It should be designed to be EVA compatible for crew maintenance and upgrade. 4. Notional Design (for discussion purpose only) The landing site near the South Pole is expected to have no eclipse cycle exceeding 5 days, so the “keep alive” power is 144 hours (6 days to include margin). A 12v ArLSEP will use rechargeable LiFePO4 cells, which are common in the Electric Vehicle (EV) industry. With a current of 5 amps and a 125 watt system, the mass is about 90kg. The comm. system and structure adds another 10kg, thus the “Central Station” is approximately 100kg. The solar power is collected on four arrays (each 2m above the surface), and the entire ArLSEP is designed to stow in a 2m x 1m x 1m volume. The experiment and instrument design will vary for each installation and add mass to the total (although they are expected to fit within the 2m3 volume). Seismic wave generation will likely not be provided with mortars, thus an electric “thumper” will be required. Active instruments such as imaging systems and sensing instruments will benefit from the additional power and communication capability provided by ArLSEP. Passive systems such as retroreflectors, witness plates, and cosmic dust collectors can be added to either the landing vehicle and/or the ArLSEP. With repeated HLS missions to the same human site, the ArLSEP can be expanded and easily maintained for long duration science collection on the lunar surface.

ALSEP↗
DOE OSTI2023

Recent Radioactive Material Package Testing Experiences at Oak Ridge National Laboratory

Oak Ridge National Laboratory (ORNL) was a pioneer in the testing of radioactive material shipping packages and has been performing such tests for over 50 years. Currently, except for Type B thermal tests, testing is performed at the purpose-built Packaging Research Facility that is located at the National Transportation Research Center - a U.S. Department of Energy User Facility. Packages used for the transportation of Type B quantities of radioactive materials must be capable of meeting normal conditions of transportation (NCT) requirements and hypothetical accident conditions (HAC) requirements as defined in Title 10 Code of Federal Regulations (CFR) Part 71. Evaluation of package designs to these criteria typically involves a combination of analysis and physical testing. Required physical tests include free drop, crush, puncture, penetration, compression, vibration, water spray, water immersion, and thermal. The Oak Ridge National Laboratory (ORNL) Packaging Evaluation Facility (PEF) at the National Transportation Research Center (NTRC) provides an inclusive testing capability for a wide variety of packages needed for shipment of radioactive materials. Since PATRAM 2019, ORNL has performed several sets of tests including testing of two designs of the Defense Program Package (DPP-3 and DPP-1) and several Special Form Capsules. This paper provides an overview of the testing performed as well as a summary of advancements made to the ORNL package testing program during that time.

Martinez, Oscar↗
DOE OSTI2025

ORNL Package Testing Program Overview

Radioactive materials are widespread in our everyday activities which are used in many different types of industries: Consumer products, Medicine, Industry, Energy, and Defense. In the United States there is about 3 million shipments of radioactive materials per year. With radioactive material being very widespread the number of new applications to ship these quantities increases daily. As such, ensuring the safe and secure transport of these materials is paramount, necessitating stringent packaging, transportation, and certification requirements. Shipments of radioactive materials have been made from Oak Ridge National Laboratory (ORNL) for the past 65 years. Since the 1940s ORNL has been at the forefront of the early development of regulations pertaining to the transport of radioactive shipments and associated regulatory testing. The early involvement resulted in ORNL being one of the leaders in the development of regulations and testing standards pertaining to the testing and design of packages. Today all package testing activities are conducted under the Package Testing Program (PTP) at ORNL at the Package Evaluation Facility (PEF). The PTP develops and evaluates testing solutions – ensuring that they are safe, efficient, and meet regulatory requirements ORNL PTP has extensive experience in the regulatory testing of radioactive material packages, supporting certification of Type A, Type, B, Type AF, and special form packages. The PEF serves as a one-stop-shop for design, testing, and certification of a wide variety of packages needed for shipment of radioactive materials. The facility provides the space, expertise, and equipment necessary to conduct rigorous performance testing under both normal and accident conditions or transport environments including free drop, dynamic crush, puncture, penetration, compression, vibration, water spray, water immersion, and thermal test. The PTP remains a key contributor to the safety and compliance of radioactive material transportation. This presentation will provide an overview of the program’s history, capabilities, and its ongoing role in advancing regulatory standards and transportation safety.

Martinez, Oscar [ORNL] (ORCID:0000000181814046)↗
DOE OSTI2021

A Scoping Study to Develop a Computational Fluid Dynamics Based Model to Predict Radiological Materials Packaging Temperatures within a Generic Staging Building

The objective of this work is to perform computational fluid dynamics simulations of a ventilated radiological-material-package staging building to determine the effect of including or excluding a variety of physical effects and computational methods on both the predicted package temperatures and required computational resources. The generic building contains 640 drum-packages containing heat-generating, radiological material supported on four racks that are eight levels tall. Additionally, there is a forced ventilation system, lighting, and insulated walls. Computational models were constructed that included or excluded (a) shelving, (b) effects of unsteadiness, and (c) radiation heat transfer. Simulations with each drum modeled separately were compared to simpler simulations with sets of four drums represented by an equivalent box-package. These models employed between 106 to 107 elements. Steady state simulations predicted package temperatures that were within 0.1°C of simulations that included transient effects and required only one-eighth the computational resources. Calculations that excluded shelving predicted temperatures within 0.6°C of simulations that included shelving and required one-fourth the computational resources. Excluding radiation heat transfer systematically increased temperatures by around 1.5°C but reduced computational resources by a factor of four. The box-package model reduced the computational resources by a factor of 3, but systematically predicted higher temperatures by around 1.1°C. These results will be used to develop an efficient computational fluid dynamics model to assess the ability of different staging building designs to prevent the temperature of package components from exceeding specified limits.

42 ENGINEERING↗
NASA NTRS2016

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

dielectric performance↗
NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

High Temperature, Packaging, Alumina, Thick Film↗
NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.

high temperature↗
DOE OSTI2020

Fabrication Lessons Learned of Transportation Packaging from the Perspective of a Design Authority - 20322

This paper presents lessons learned regarding fabricating packaging systems from the perspective of a design authority (DA). Capturing and implementing lessons learned is critical for an organization to reduce systematic project risk and thereby promote the likelihood of project success. This paper defines the design authority as the organization responsible for technical design, resolving technical design issues, quality assurance program, and maintenance of the packaging system license. A package system is defined as the packaging, its contents, and auxiliary equipment. Packages are certified by the NRC under 10 CFR 71[1] for transportation by ground. The following lessons learned subjects are presented in the paper: quality assurance, interpretation of drawing dimensional requirements, execution of manufacturing processes, hardware dimensional inspection, and leakage rate testing. All discrepancies presented in this paper have been resolved as described in the appropriate final data package. All described package systems are in compliance with their Safety Analysis Report (SAR) and certificate of conformance requirements. The intent of this paper is to identify opportunities for improving the outcome of future projects and to mitigate fabrication challenges proactively. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
DOE OSTI2020

The Significance of Environmental Attributes as Indicators of the Life Cycle Environmental Impacts of Packaging and Food Service Ware

The environmental impacts of packaging and food service ware (FSW) are increasingly the subject of government policy, public discourse, and industry commitments. While some consideration is given to reducing the impacts of packaging across its entire life cycle, most of the focus is on packaging waste or feedstock substitution. Efforts typically focus on specific packaging characteristics, or material attributes, commonly perceived to be environmentally preferable. This article summarizes an extensive meta-review of existing published literature that was performed to determine whether the material attributes recyclability, recycled content, compostability, and biobased, commonly considered to be environmentally beneficial, correlate with lower net environmental impacts across the full life cycle of the packaging and FSW. Seventy-one unique life cycle assessment (LCA) studies that quantify the environmental impacts throughout the entire life cycle of packaging and FSW were analyzed. These studies included over 5000 comparisons for 13 impact categories commonly analyzed in LCA studies. The results from the meta-review identified a number of instances where material attributes do not correlate with environmental benefits for packaging and FSW. Rather, other characteristics such as material choice or mass of the packaging/FSW products can have higher influence in determining life cycle impacts.

54 ENVIRONMENTAL SCIENCES↗
DOE OSTI2020

SpackDev: Multi-Package Development with Spack

High Energy Physics (HEP) software environments often involve ~ hundreds of external packages and libraries, and similar numbers of experiment-specific, science-critical packages—many under continuous development. Managing coherent releases of the external software stack is challenging enough, but managing the highly-collaborative—and distributed—development of a large body of code against such a stack adds even more complexity and room for error. Spack is a popular Python-based package management tool with a specific focus on the needs of High Performance Computing (HPC) systems and system administrators whose strength is orchestrating the discrete download, build, testing, and installation of pre-packaged or tagged third-party software against similarly stable dependencies. As such it is becoming increasingly popular within HEP as that community makes increasing use of HPC facilities, and as efforts to develop future HPC systems utilize Spack to provide scientific software on those platforms. SpackDev is a system to facilitate the simultaneous development of interconnected sets of packages. Intended to handle packages without restriction to one internal build system, SpackDev is integrated with Spack as a command extension in order to leverage features such as dependency calculations and build system configuration, and is generally applicable outside HEP. We describe SpackDev’s features and development over the last two years, initial experience using SpackDev in the context of the LArSoft liquid argon detector toolkit, and work remaining before it can be considered a fully-functional multi-package build system for HEP experiments utilizing Spack.

Green, Chris↗
DOE OSTI2020

Assessment of Critical Experiment Benchmark Applicability to a Large-Capacity HALEU Transportation Package Concept

This work presents an assessment of the applicability of existing benchmark critical experiments to the criticality safety code validation for a large-capacity high-assay low-enriched uranium (HALEU) transportation package concept. Numerous next-generation nuclear reactor designs require HALEU fuel, which is characterized by an enrichment between 5 and 20 wt% 235 U. The U.S. Department of Energy (DOE) has proposed to recover and downblend highly enriched uranium from DOE-owned used nuclear fuel to accelerate the demonstration of commercially viable microreactor technologies. One element of the infrastructure needed to demonstrate HALEU-fueled reactors is the ability to safely transport enriched product to be used for fuel fabrication. There is uncertainty as to whether existing critical benchmark experiment data are sufficient to support criticality safety code validation for HALEU transportation applications. The anticipated chemical form of the HALEU in the proposed transportation concept is UO 2 with 20 wt% 235 U/U. The concept uses a combination of an existing transportation packaging design and a novel basket design, including borated aluminum flux traps. The basket provides space for 18 reusable, stainless steel canisters that contain the HALEU. In 10 CFR 71, normal conditions of transport (NCTs) and hypothetical accident conditions (HACs) are defined for fissile material transportation packages. NCT and HAC KENO-VI models of the transportation package were developed using the Standardized Computer Analyses for Licensing Evaluation (SCALE) 6.2.3 computer code package, and optimum moderation conditions were determined using the SCALE SAMPLER sequence. The SCALE Tools for Sensitivity and Uncertainty Analysis Methodology Implementation (TSUNAMI) sequences were then used to compare the neutronic characteristics of 1584 International Criticality Safety Benchmark Evaluation Project benchmark critical experiments with the NCT and HAC HALEU transportation models. The TSUNAMI integral correlation coefficient c k was the criterion used to rank neutronic similarity. Thirty-four experiments were identified as similar (c k ≥ 0.9) to the NCT model, and 55 experiments were identified as similar to the HAC model. Hundreds of experiments were also identified as at least marginally similar (c k ≥ 0.8) to both models. The results indicate that additional critical experiments are unlikely to be needed to support HALEU transportation criticality safety analyses for package concepts similar to the concept package analyzed.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
DOE OSTI2021

Packaging of an 8-kV Silicon Carbide Diode Module with Double-Side Cooling and Sintered-Silver Joints

Packaging innovations are needed for medium-voltage wide bandgap power semiconductor modules to enable their adaptation in grid applications. A unique challenge for packaging medium-voltage power modules is managing the trade-off between insulation demand and heat dissipation. The focus of this work was on developing a packaging innovation that improves the module heat dissipation and offers more flexibility to its insulation design. Two strategies were explored for the packaging of an 8-kV SiC diode rectifier module:(1) double-side cooling and (2) sintered-silver bonding. Double-side cooling was realized by using short metal posts rather than long and thin wire bonds for device interconnection, forming a low-profile package with devices sandwiched between two insulated metal substrates. Sintered-silver bonding enabled the devices to function reliably at over 250 °C. Simulations of the packaged module showed a low interconnect inductance of 2.67 nH and a 50% less heat transfer coefficient required to cool the chips. Prototypes of the module were fabricated, and preliminary electrical testing results validated the package design.

27 ARPA - Advanced Research Projects Agency-Energy↗
DOE OSTI2022

A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter

This article presents the design and analysis of a double-side-cooled printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge package with low loop inductances and an integrated gate driver. The 1.2 kV SiC MOSFET dies used in the half-bridge package are embedded in the PCB using AT&S's patented technique. The dies are cooled and electrically connected to traces in the PCB through copper-filled microvias. The design methodology accounts for both electrical and thermal performance, limiting the power-loop inductance to 2.3 nH and the maximum package temperature to less than the 175 °C limit. The integration of the gate drive circuitry allows for a high power density and 2.2 nH gate-loop inductances. At 0.12 K/W, the measured junction-to-case thermal resistance with double-sided cooling is 57% lower than that of a TO-247 package. Under similar operating conditions, the PCB-embedded half-bridge package also achieves a 5.6 times lower voltage overshoot and a 0.5% higher peak efficiency than a TO-247-based half-bridge. This article reports the first demonstration of PCB-embedded 1.2 kV SiC MOSFET packages in buck, boost, and ac–dc converters. Furthermore, the prototype three-phase ac–dc converter for an electric vehicle on-board charger is composed of six PCB-embedded half-bridge packages and achieves an efficiency of 98.2% and a power density of 182 W/in 3 .

42 ENGINEERING↗
DOE OSTI2022

Large-scale parametric modeling of spent nuclear fuel dynamics in the 30 cm package drop scenario

Packages used to transport spent nuclear fuel (SNF) are required by the U.S. Code of Federal Regulations 10 CFR 71.71 to demonstrate satisfactory performance during a drop scenario. While the CFR is meant to ensure safe package function, it does not evaluate survival of the SNF within. The U.S. Department of Energy Spent Fuel and Waste Science and Technology program is working on closing the knowledge gap related to the response of SNF to external mechanical loads, including the hypothetical 30 cm package drop scenario in the CFR. In support of this effort, LS-DYNA finite element simulations were developed by Pacific Northwest National Laboratory (PNNL) to model generic drop scenarios at both the package and fuel assembly level. The models were validated against one-third scale package and full scale fuel assembly drop test data and were exercised to predict fuel cladding strains in a narrow range of model configurations. This work describes a large-scale parametric study conducted by PNNL using the previously developed and validated PWR finite element model, with the addition of a new generic BWR assembly model. The motivation for the parametric study was to characterize the broad range of SNF responses in the 30 cm package drop scenario. This was accomplished by varying the drop orientation, fuel assembly type (17x17 PWR and 10x10 BWR), burnup, cladding temperature, spacer grid buckling load, package mass, impact limiter stiffness, and mechanical gap conditions within the basket. A MATLAB framework was developed to automate LS-DYNA model generation and execution on PNNL institutional computing resources. In total, over 2000 simulations were performed. For each simulation, the SNF response was quantified in terms of permanent grid deformation, fuel rod contact pressure, and strains within the fuel rods, guide tubes, and water rods. The results provide valuable insight into the range of responses that could be reasonably expected from SNF in the hypothetical drop scenario, as well as the sensitivity to each input parameter. The results of this parametric study are a key component of the testing and modeling strategy the Spent Fuel and Waste Science and Technology program is using to close the external loads knowledge gap.

Kadooka, Kevin↗