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Results for “Reliability Testing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Study of Contact Resistances in Integrated Circuits

Techniques explored in search for rapid, reliable test. Resistances of aluminum/silicon contacts and methods to measure subjects of NASA report. Study with three tasks undertaken to evaluate nature and reliability of large numbers of semiconductor contacts of type now being fabricated in integrated circuits: Develop yield analysis for series strings of contacts using wafer-level electrical measurements, and identify different types of faults by visual inspection; develop wafer-level tests to evaluate reliability of contact strings; and develop mathematical model for current flow in contacts and examine contact region for evidence of micro-alloying.

Buehler, M. G.↗
NASA NTRS1972

Reliability of composite vessels and proof testing.

The reliability of anisotropic structures is formulated with the aid of the yield and fracture criteria, on the basis of recent studies of composite rocket motor cases in a state of plane stress. The vessel reliability is estimated in terms of the safety factor, thus permitting a rational interpretation of the design safety factor in terms of the vessel relability. The formulation is consistent with the finite element approach, and is being coded into a computer program for practical design evaluation.

Yang, J.-N.↗
NASA NTRS1990

Salt materials testing for a spacecraft adiabatic demagnetization refrigerator

As part of a technology development effort to qualify adiabatic demagnetization refrigerators for use in a NASA spacecraft, such as the Space Infrared Telescope Facility, a study of low temperature characteristics, heat capacity and resistance to dehydration was conducted for different salt materials. This report includes results of testing with cerrous metaphosphate, several synthetic rubies, and chromic potassium alum (CPA). Preliminary results show that CPA may be suitable for long-term spacecraft use, provided that the salt is property encapsulated. Methods of salt pill construction and testing for all materials are discussed, as well as reliability tests. Also, the temperature regulation scheme and the test cryostat design are briefly discussed.

Savage, M. L.↗
NASA NTRS2019

TPSAS-NF1676L-33031-DND

Cryogenic high-Reynolds number testing has been in use for approximately 40 years. This reliable testing capability is used to more closely predict full-scale flight aerodynamics for improved accuracy in estimates of aircraft performance, stability, and loads. A technical course has been created to educate industry, institutional, and research professionals in the overview of cryogenic high-Reynolds number testing and its impact, the availability and accessibility of cryogenic testing and considerations in test planning an execution, and the discussion of other in-depth technical topics. This particular presentation supports a section relating to special data reduction and correction methods as they relate to high-Reynolds number cryogenic wind-tunnel testing.

Scott Goodliff↗
NASA NTRSDate not supplied

TPSAS-NF1676L-32584-DND

Cryogenic, high-Reynolds number testing has been in use for approximately 40 years. This reliable testing capability is used to more closely predict full-scale flight aerodynamics for improved accuracy in estimates of aircraft performance, stability, and loads. A technical course has been created to educate industry, institutional, and research professionals in the overview of cryogenic, high-Reynolds number testing and its impact, the availability and accessibility of cryogenic testing and considerations in test planning and execution, and the discussion of other in-depth technical topics. This particular presentation supports a section of model preparation, tunnel operations, and model access procedures that are unique to cryogenic wind-tunnel testing.

Scott Goodliff↗
NASA NTRS1977

Traveling-wave tube reliability estimates, life tests, and space flight experience

Infant mortality, useful life, and wearout phase of twt life are considered. The performance of existing developmental tubes, flight experience, and sequential hardware testing are evaluated. The reliability history of twt's in space applications is documented by considering: (1) the generic parts of the tube in light of the manner in which their design and operation affect the ultimate reliability of the device, (2) the flight experience of medium power tubes, and (3) the available life test data for existing space-qualified twt's in addition to those of high power devices.

Lalli, V. R.↗
NASA NTRS2005

Lead-Free vs Tin-Lead Reliability of Advanced Electronic Assemblies

This presentation will provide the technical background and specific information published in literature related to reliability test, analyses, modeling, and associated issues for lead-free solder package assemblies in comparison to their tin-lead solder alloys. It also presents current understanding of lead-free thermal cycle test performance in support.

assembly reliability↗
NASA NTRS1974

High-Pressure Oxygen Test Evaluations

The relevance of impact sensitivity testing to the development of the space shuttle main engine is discussed in the light of the special requirements for the engine. The background and history of the evolution of liquid and gaseous oxygen testing techniques and philosophy is discussed also. The parameters critical to reliable testing are treated in considerable detail, and test apparatus and procedures are described and discussed. Materials threshold sensitivity determination procedures are considered and a decision logic diagram for sensitivity threshold determination was plotted. Finally, high-pressure materials sensitivity test data are given for selected metallic and nonmetallic materials.

Schwinghamer, R. J.↗
NASA NTRS1991

Thermal shock testing for assuring reliability of glass-sealed microelectronic packages

Tests were performed to determine if thermal shocking is destructive to glass-to-metal seal microelectronic packages and if thermal shock step stressing can compare package reliabilities. Thermal shocking was shown to be not destructive to highly reliable glass seals. Pin-pull tests used to compare the interfacial pin glass strengths showed no differences between thermal shocked and not-thermal shocked headers. A 'critical stress resistance temperature' was not exhibited by the 14 pin Dual In-line Package (DIP) headers evaluated. Headers manufactured in cryogenic nitrogen based and exothermically generated atmospheres showed differences in as-received leak rates, residual oxide depths and pin glass interfacial strengths; these were caused by the different manufacturing methods, in particular, by the chemically etched pins used by one manufacturer. Both header types passed thermal shock tests to temperature differentials of 646 C. The sensitivity of helium leak rate measurements was improved up to 70 percent by baking headers for two hours at 200 C after thermal shocking.

Thomas, Walter B., III↗
NASA NTRSDate not supplied

Infant Mortality and Wear-Out Failures in Polymer and MnO2 Tantalum Capacitors

Reliability testing of modern tantalum capacitors shows the presence of both types, infant mortality (IM) and wearout (WO) failures. To assure reliable operation, the probability of IM failures should be reduced to below the specified level, and the time of WO inception should be greater than the required useful life of the parts at operation conditions. In this work, several types of MnO2 and polymer cathode tantalum capacitors have been tested at highly accelerated conditions to assess voltage acceleration factors, determine adequate burn-in conditions, and assess the useful life. A modified time dependent dielectric breakdown (TDDB) model has been suggested to explain both types of failure, and a physical mechanism of degradation that is based on migration and reactions of oxygen vacancies explains increase of the defect related, IM failures with the level of stress.

tantalum capacitors↗
NASA NTRS2012

An Intelligent Strain Gauge with Debond Detection and Temperature Compensation

The harsh rocket propulsion test environment will expose any inadequacies associated with preexisting instrumentation technologies, and the criticality for collecting reliable test data justifies investigating any encountered data anomalies. Novel concepts for improved systems are often conceived during the high scrutiny investigations by individuals with an in-depth knowledge from maintaining critical test operations. The Intelligent Strain Gauge concept was conceived while performing these kinds of activities. However, the novel concepts are often unexplored even if it has the potential for advancing the current state of the art. Maturing these kinds of concepts is often considered to be a tangential development or a research project which are both normally abandoned within the propulsion-oriented environment. It is also difficult to justify these kinds of projects as a facility enhancement because facility developments are only accepted for mature and proven technologies. Fortunately, the CIF program has provided an avenue for bringing the Intelligent Strain Gauge to fruition. Two types of fully functional smart strain gauges capable of performing reliable and sensitive debond detection have been successfully produced. Ordinary gauges are designed to provide test article data and they lack the ability to supply information concerning the gauge itself. A gauge is considered to be a smart gauge when it provides supplementary data relating other relevant attributes for performing diagnostic function or producing enhanced data. The developed strain gauges provide supplementary signals by measuring strain and temperature through embedded Karma and nickel chromium (NiCr) alloy elements. Intelligently interpreting the supplementary data into valuable information can be performed manually, however, integrating this functionality into an automatic system is considered to be an intelligent gauge. This was achieved while maintaining a very low mass. The low mass enables debond detection and temperature compensation to be performed when the gauge is utilized on small test articles. It was also found that the element's mass must be relatively small to avoid overbearing the desired thermal dissipation characteristics. Detecting the degradation of a gauge s bond was reliably achieved by correlating thermal dissipation with the bond s integrity. This was accomplished by precisely coupling a NiCr element with a Karma element for accurately interjecting and quantifying thermal energy. A finite amount of thermal energy is consistently placed in the gauge by electrically powering the NiCr element. The energy will only be temporarily stored before it begins to dissipate into the surrounding structure through the gauge bond. The ability to transmit the energy into the structure becomes greatly inhibited by any discontinuity in the bond s substrate. Therefore, the way the thermal dissipation occurs will reveal even the slightest change in the integrity of the bond.

Jensen, Scott L.↗
NASA NTRS2014

A Systems Engineering Approach to Quality Assurance for Aerospace Testing

On the surface, it appears that AS9100 has little to say about how to apply a Quality Management System (QMS) to major aerospace test programs (or even smaller ones). It also appears that there is little in the quality engineering Body of Knowledge (BOK) that applies to testing, unless it is nondestructive examination (NDE), or some type of lab or bench testing associated with the manufacturing process. However, if one examines: a) how the systems engineering (SE) processes are implemented throughout a test program; and b) how these SE processes can be mapped to the requirements of AS9100, a number of areas for involvement of the quality professional are revealed. What often happens is that quality assurance during a test program is limited to inspections of the test article; what could be considered a manufacturing al fresco approach. This limits the quality professional and is a disservice to the programs and projects, since there are a number of ways that quality can enhance critical processes, and support efforts to improve risk reduction, efficiency and effectiveness. The Systems Engineering (SE) discipline is widely used in aerospace to ensure the progress from Stakeholder Expectations (the President, Congress, the taxpayers) to a successful, delivered product or service. Although this is well known, what is not well known is that these same SE processes are implemented in varying complexity, to prepare for and implement test projects that support research, development, verification and validation, qualification, and acceptance test projects. Although the test organization's terminology may vary from the SE terminology, and from one test service provider to another, the basic process is followed by successful, reliable testing organizations. For this analysis, NASA Procedural Requirements (NPR) 7123.1, NASA Systems Engineering Processes and Requirements is used to illustrate the SE processes that are used for major aerospace testing. Many of these processes are also implemented for smaller test projects, and this set of processes will also look familiar to those who have participated in launch site activation and flight demonstrations.

Shepherd, Christena C.↗