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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS1971

Soldering device Patent

Soldering device particularly suited to making high quality wiring joints for aerospace engineering utilizing capillary attraction to regulate flow of solder

Booth, F. W.↗
NASA NTRS1972

A simple, efficient resistance soldering apparatus

Multiple resistance soldering device for attaching electric leads to multiple terminal block connectors uses power source with one terminal connected to working probe, and other terminal attached to connector carrying common pins for lead insertion. Mating of male and female connectors solders each lead to individual cup pin.

Vermillion, C. M.↗
NASA NTRS1972

Investigation of gold embrittlement in connector solder joints

An investigation was performed to determine to what extent typical flight connector solder joints may be embrittled by the presence of gold. In addition to mapping of gold content in connector solder joints by an electron microprobe analyzer, metallographic examinations and mechanical tests (thermal shock, vibration, impact and tensile strength) were also conducted. A description of the specimens and tests, a discussion of the data, and some conclusions are presented.

Lane, F. L.↗
NASA NTRS1976

Compound solder joints

Joining technique prevents contamination, may be used to join dissimilar metal tubes, minimizes fluid and gas entrapment, expedites repairs, and can yield joints having leakage rates less than 0.000001 standard cubic cm He/min. Components of joint are solder sleeve, two solder rings, Teflon sleeve, and tubing to be joined.

Batista, R. I.↗
NASA NTRS1979

Economical solder connections to thin films

Soldering procedure, successfully tested for attaching leads to silicon solar cells, cover-glasses, is simple, inexpensive, and very effective in forming stable connection. Procedure uses solder of indium alloyed with either silver or tin.

Bass, J. A.↗
NASA NTRS1978

The Pd2Si - /Pd/ - Ni - solder plated metallization system for silicon solar cells

The rationale and application of a plated metal system, Pd2Si Pd - Ni - solder, is presented. This metallization system is particularly useful on shallow p-n junction solar cells. The advantages of such plated solar cell contacts are discussed. A process sequence for applying the metallization system is outlined. A specific example is presented, including chemical plating solution formulations and detailed process step descriptions. Electrical test data for solar cells metallized with the palladium-nickel-solder system are provided.

Coleman, M. G.↗
NASA NTRS1984

Digital Soldering-Iron Tester

Instrument reads tip temperature and contact potential in seconds. Tinned soldering tip touched to temperature sensitive button for 4 seconds and to voltage probe for 1 to 3 seconds. Tip temperature and voltage appear on digital displays. Instrument quickly gives assurance conditions are correct for reliable soldering.

Buggle, R. N.↗
NASA NTRS1987

Soldering Tool for Integrated Circuits

Many connections soldered simultaneously in confined spaces. Improved soldering tool bonds integrated circuits onto printed-circuit boards. Intended especially for use with so-called "leadless-carrier" integrated circuits.

Takahashi, Ted H.↗
NASA NTRS1987

Supports for Wires Soldered to Pins

Stress concentrations reduced by reorienting wires. New solder-joint configuration provides support for part of wire most susceptible to damage from handling or vibration part next to solder joint. Reversal of wire and heat-shrinkable tubing reduce stress in this region.

Hill, Arthur J.↗
NASA NTRS1992

Shrink-Fit Solderable Inserts Seal Hermetically

Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

Croucher, William C.↗
NASA NTRS1993

Automated inspection of solder joints for surface mount technology

Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

Savage, Robert M.↗
NASA NTRS2009

Solder Joint Health Monitoring Testbed

A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

Delaney, Michael M.↗
NASA NTRS2012

Soldering in a Reduced Gravity Environment (SoRGE)

Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

Easton, John W.↗