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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5

Compatibility Testing of Polymeric Materials for the Urine Processor Assembly (UPA) of International Space Station (ISS)

In the International Space Station (ISS), astronauts will convert urine into potable water with the Urine Processor Assembly (UPA) by a distillation process. The urine is pre-treated, containing flush water and stabilizers. About 2.5% solids in the urine are concentrated up to 16% brine through distillation. Dynamic mechanical analysis (DMA) in the stress relaxation mode was primarily used to test 15 polymeric UPA materials for compatibility with the pre-treated and brine solutions. There were concerns that chromium trioxide (CrO3), a stabilizer not in the original pre-treat formulation for similar compatibility testing in 2000, could have an adverse effect on these polymers. DMA testing is partially complete for polymeric material samples immersed in the two solutions at room temperature for as long as 200 days. By comparing each material (conditioned and virgin), the stress relaxation modulus (E) was determined for short-term use and predicted for as long as a 10-year use in space. Such a delta E showed a decrease of as much as 79% for a Nylon material, but an increase as much as 454% for a polysulfone material, with increasing immersion time.

Wingard, Charles D.↗

Nonequilibrium material effects on the behavior of polymeric composite matrices and their related composites

The effects of physical aging on the material properties of some linear and network macromolecular glasses are discussed. The free volume concept is used to describe this behavior. The effect of physical aging on properties of some uniaxial graphite/fiber epoxy resin composites is investigated using stress relaxation in both tensile and flexural modes. The matrix polymers used were resins both of which are based on a 4,4-methylenedianiline derivative of epichlorohydrin with diamino diphenyl sulfone (DDS) as the curing agent. The matrix resin, as used in the practical application in composites, not fully cured and the glass transition of the network was dependent on the curing schedule. The physical aging of the bulk crosslinked epoxy was found to depend on the annealing temperature, and the T sub g of the resin. The physical aging of the composite, monitored by the stress relaxation method, was found to be dependent on the testing direction.

Wilkes, G. L.↗

Structure-Property Relationships of Bismaleimides

The purpose of this research was to control and systematically vary the network topology of bismaleimides through cure temperature and chemistry (addition of various coreactants) and subsequently attempt to determine structure-mechanical property relationships. Characterization of the bismaleimide structures by dielectric, rheological, and thermal analyses, and density measurements was subsequently correlated with mechanical properties such as modulus, yield strength, fracture energy, and stress relaxation. The model material used in this investigation was 4,4'-BismaleiMidodIphenyl methane (BMI). BMI was coreacted with either 4,4'-Methylene Dianiline (MDA), o,o'-diallyl bisphenol A (DABA) from Ciba Geigy, or Diamino Diphenyl Sulfone (DDS). Three cure paths were employed: a low- temperature cure of 140 C where chain extension should predominate, a high-temperature cure of 220 C where both chain extension and crosslinking should occur simultaneously, and a low-temperature (140 C) cure followed immediately by a high-temperature (220 C) cure where the chain extension reaction or amine addition precedes BMI homopolymerization or crosslinking. Samples of cured and postcured PMR-15 were also tested to determine the effects of postcuring on the mechanical properties. The low-temperature cure condition of BMI/MDA exhibited the highest modulus values for a given mole fraction of BMI with the modulus decreasing with decreasing concentration of BMI. The higher elastic modulus is the result of steric hindrance by unreacted BMI molecules in the glassy state. The moduli values for the high- and low/high-temperature cure conditions of BMI/MDA decreased as the amount of diamine increased. All the moduli values mimic the yield strength and density trends. For the high-temperature cure condition, the room- temperature modulus remained constant with decreasing mole fraction of BMT for the BMI/DABA and BMI/DDS systems. Postcuring PMR-15 increases the modulus over that of the cured material even though density values of cured and postcured PMR were essentially the same. Preliminary results of a continuous and intermittent stress relaxation experiment for BMI:MDA in a 2:1 molar ratio indicate that crosslinking is occurring when the sample is in the undeformed state. Computer simulation of properties such as density, glass transition temperature, and modulus for the low- temperature cure conditions of BMI/MDA and BMI/DABA were completed. The computer modeling was used to help further understand and confirm the structure characterization results. The simulations correctly predicted the trends of these properties versus mole fraction BMI and were extended to other BMI/diamine systems.

Tenteris-Noebe, Anita D.↗

Dimensional stability and micromechanical properties of materials for use in an Orbiting Astronomical Observatory.

This paper considers the problem of irreversible dimensional changes of the order of one thousandth of an inch per inch in several candidate materials for orbiting observatories. Although there are a number of potential sources for such dimensional changes, those given major consideration here are applied stresses and residual stresses. Results of room-temperature microyield strength (MYS) and microcreep tests to detect permanent strains associated with both short- and long-duration loading are reported for several engineering materials, including four aluminum alloys (2024, 5456, 6061, and 2014), I400 beryllium, TZM molybdenum, AZ31 magnesium, two titanium alloys (Ti-6Al-4V and Ti-5Al-2.5Sn), 321 stainless steel, a graphite/epoxy composite, and low-expansion glass ceramics. The data indicate that: metallic materials have no true elastic limit; the MYS cannot be predicted reliably from, and is appreciably less than, the conventional yield strength: significant microcreep and stress relaxation can occur at stresses somewhat below the MYS.

Marschall, C. W.↗

Reversible and Irreversible Time-Dependent Behavior of GRCop-84

A series of mechanical tests were conducted on a high-conductivity copper alloy, GRCop-84, in order to understand the time dependent response of this material. Tensile, creep, and stress relaxation tests were performed over a wide range of temperatures, strain rates, and stress levels to excite various amounts of time-dependent behavior. At low applied stresses the deformation behavior was found to be fully reversible. Above a certain stress, termed the viscoelastic threshold, irreversible deformation was observed. At these higher stresses the deformation was observed to be viscoplastic. Both reversible and irreversible regions contained time dependent deformation. These experimental data are documented to enable characterization of constitutive models to aid in design of high temperature components.

viscoelasticity↗

Nearly viscometric flows.

Constitutive equations describing small perturbations on viscometric flows, noting relations with stress-relaxation moduli flow

PERTURBATION THEORY↗

Reconnection of stressed magnetic fields

It is shown that magnetized plasma configurations under magnetic stress relax irreversibly to the state of minimum stress at a rate that is essentially Alfvenic provided a magnetic null is present. The relaxation is effected by the reconnection at the field null and proceeds at a rate proportional to the absolute value of ln(eta) exp-1, where eta is the resistivity. An analytic calculation in the linear regime is presented.

Hassam, A. B.↗

Fluorine Implantation and Residual Stresses in Polysilicon Films

As microelectronic device dimensions are reduced below one micron, the hot carrier effect is a major barrier to continued scaling and VLSI reliability. Several reports have shown that fluorine diffusion into the device gate greatly enhances the resistance to hot carriers. There has been some disagreement as to the mechanism of influence; however, several reports have suggested that the polysilicon is physically modified by the fluorine implant and that the beneficial effects are at least in part due to stress relaxation in the polysilicon.

polysilicon fluorine microelectronic devices hot c↗

Viscoplastic Characterization of Ti-6-4: Experiments

As part of a continued effort to improve the understanding of material time-dependent response, a series of mechanical tests have been conducted on the titanium alloy, Ti-6Al-4V. Tensile, creep, and stress relaxation tests were performed over a wide range of temperatures and strain rates to engage various amounts of time-dependent behavior. Additional tests were conducted that involved loading steps, overloads, dwell periods, and block loading segments to characterize the interaction between plasticity and time-dependent behavior. These data will be used to characterize a recently developed, viscoelastoplastic constitutive model with a goal toward better estimates of aerospace component behavior, resulting in improved safety.

mechanical properties↗

Analysis of creep and relaxation in composite laminates with holes

The time-dependent behavior of composite laminates subjected to mechanical loads is studied using linear viscoelastic theory. Three-dimensional finite elements are formulated to solve the integral equilibrium equations. Analyses of creep and stress relaxation in composites with holes are performed. Results indicate that the relaxation of interlaminar stresses depends on temperature and layups, and that the creep response of strains is affected by stress redistribution between plies.

Lin, Kuen Y.↗

Why do we need detailed gravity over continents: Some Australian examples

Geophysical quantities available over a continent are gravity and components of the magnetic field. Direct inferences on crustal structure are difficult to make and strongly dependent on mechanical assumptions the isostatic state. The data for Australia represents one of the best continental scale gravity surveys. The gravity anomalies are generally bland over the continent which confirms that stress relaxation and erosion and rebound were instrumental in reducing nonhydrostatic stresses. In central Australia very large gravity anomalies occur and the region is out of isostatic equilibrium despite the fact that tectonic activity ceased 300 ma ago. The isostatic response functions points to a substantial horizontal compression in the crust. Similar conclusions are drawn for the large anomalies in western Australia. The tectonic implications of these anomalies are examined. In eastern Australia the gravity anomalies are explained in terms of a model of erosion of the highlands and concomitant regional isostatic rebound.

Lambeck, K.↗

Dwell Notch Low Cycle Fatigue Behavior of a Powder Metallurgy Nickel Disk Alloy

A study was conducted to determine the processes which govern dwell notch low cycle fatigue (NLCF) behavior of a powder metallurgy (P/M) ME3 disk superalloy. The emphasis was placed on the environmentally driven mechanisms which may embrittle the highly stressed notch surface regions and reduce NLCF life. In conjunction with the environmentally driven notch surface degradation processes, the visco-plastic driven mechanisms which can significantly change the notch root stresses were also considered. Dwell notch low cycle fatigue testing was performed in air and vacuum on a ME3 P/M disk alloy specimens heat treated using either a fast or a slow cooling rate from the solutioning treatment. It was shown that dwells at the minimum stress typically produced a greater life debit than the dwells applied at the maximum stress, especially for the slow cooled heat treatment. Two different environmentally driven failure mechanisms were identified as the root cause of early crack initiation in the min dwell tests. Both of these failure mechanisms produced mostly a transgranular crack initiation failure mode and yet still resulted in low NLCF fatigue lives. The lack of stress relaxation during the min dwell tests produced higher notch root stresses which caused early crack initiation and premature failure when combined with the environmentally driven surface degradation mechanisms. The importance of environmental degradation mechanisms was further highlighted by vacuum dwell NLCF tests which resulted in considerably longer NLCF lives, especially for the min dwell tests.

Telesman, J.↗

Viscoelastic properties of entangled polymers - Ternary blends of monodisperse homopolymers

In a previous publication from this laboratory, the Rouse-Bueche-Zimm molecular theory of viscoelasticity has been extended by using a transient network model to apply to binary blends of monodisperse polymers with chain entanglements. The dynamics of the entanglements were modeled both by the enhanced frictional coefficients and by the additional elastic couplings. It was recognized that entanglements not only may form between chains of the same lengths (intracomponent entanglements) but also between those of different lengths (intercomponent entanglements). At a given intercomponent entanglement, the longer chain was assumed to have the frictional coefficient of the shorter chain. Similarly, for blends consisting of several monodisperse components with different molecular weights, such modifications are also required to predict their linear viscoelastic behavior. The frequency of these interactions is assumed to be proportional to the weight ratio of the respective component chains in the blend. Equations of motion are formulated for each component and solved numerically for the relaxation time spectra. Linear viscoelastic properties such as the dynamic mechanical moduli, stress relaxation moduli, and zero-shear viscosity can then be computed for these systems by linear summation of those of the components.

Soong, D.↗