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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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The plans, specifications, cost trade studies, and verification status of a prototype solar heating and hot water system for the Minnesota Department of Natural Resources's single-family dwelling located at O'Brien State Park, 30 miles east of Minneapolis, Minnesota are presented.
The Site Data Acquisition Subsystem (SDAS) designed to collect data from sensors located on residential or commercial buildings using a solar heating and/or cooling system is described. It takes the data obtained from sensors located on the solar system, processes the data into suitable format, stores the data for a period of time, and provides the capability for either telephone retrieval by the central data processing system or manual retrieval of the data for transfer to a central site. The SDAS is also designed so that it will not degrade the operation of the solar heating/cooling system which it is monitoring.
This document describes LANL Storage Program best practices when working with other User Sites to implement DOE M441.1-1 Manual requirements through the use of the SAVY nuclear material packaging system. It is a Manual directive for Field Element Managers to review and approve the SAVY-4000 container series design (with supporting technical basis) as a packaging system for use at their respective sites. This review and approval incorporates an evaluation of the User Site methodology for SAVY surveillance and the process for documenting its nuclear materials storage program. This document aims to assist the Field Element Mangers and User Sites in the processes necessary to credit LANL SAVY surveillance for key elements of the User Site surveillance plan.
This document is the specification which establishes the requirements for the design, installation, and performance of a passive heat exchanger module with auxiliary heaters for use with solar heating systems. It designates the Interim Performance Criteria applicable to the subsystem and defines any deviations. This document also includes the manufacturing instructions and required materials and parts for the Maxitherm S101 Heating Module.
An overview of the CASE/A-ECLSS series modeling package is presented. CASE/A is an analytical tool that has supplied engineering productivity accomplishments during ECLSS design activities. A components verification program was performed to assure component modeling validity based on test data from the Phase II comparative test program completed at the Marshall Space Flight Center. An integrated plotting feature has been added to the program which allows the operator to analyze on-screen data trends or get hard copy plots from within the CASE/A operating environment. New command features in the areas of schematic, output, and model management, and component data editing have been incorporated to enhance the engineer's productivity during a modeling program.
Recommendations for logistics activities and logistics planning are presented based on the assumption that a system prime contractor will perform logistics functions to support all program hardware and will implement a logistics system to include the planning and provision of products and services to assure cost effective coverage of the following: maintainability; maintenance; spares and supply support; fuels; pressurants and fluids; operations and maintenance documentation training; preservation, packaging and packing; transportation and handling; storage; and logistics management information reporting. The training courses, manpower, materials, and training aids required will be identified and implemented in a training program.
LSI packaging effects on systems design, discussing physical integration
This paper describes a modular packaging system for logistics that can be reconfigured into internal outfitting for a lunar outpost, including desks, chairs, partitions, cabinets, and radiation shielding. Logistics include clothes, equipment, food, and other consumables needed to sustain the crew for the duration of the mission. A significant mass penalty is required for the packaging and handling of logistics for re-supply of short to long-term space missions that must be brought out of the gravity well on a launch vehicle. Once the supplies have been exhausted, the packaging material is typically of no further use and is discarded. If a scheme can be developed that reuses the logistics packaging, the mass penalty can be reduced. In this research, a modular packaging system has been devised as a kit-of-parts that can be used for both handling logistics supplies, and then reconfigured into desks, chairs, partitions, cabinets, and radiation shielding. The system is derived from a standard International Space Station (ISS)-type Cargo Transfer Bag (CTB), using soft, unfoldable box-like containers with stiff metal inserts. The empty hydrogen-impregnated CTBs can be used as-is for cabinets, opened up for use as partitions, or draped over the habitat as layers of radiation shielding. Stiff metal inserts can be reconfigured into desks and other useful outfitting.
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The research of the program to design and build a prototype vent system capable of exhausting only vapor to space from an all liquid or two-phase mixture of oxygen, while operating under low or zero-gravity conditions is reported. Work performed during the detail design phase of the program was concerned with the finalization of vent system performance, development of component specifications, solicitation of vendor bids, selection of components and overall system package design. The compact system preliminary design defined for the comparisons was reviewed in light of a desirability to demonstrate complete tank mixing at one-g. Also, performance of the system at low-g conditions with a full tank and maximum temperature stratification or maximum pressure rise between vent cycles was investigated. It was found that under these extreme conditions, not previously considered, that use of a larger pump mixer than previously defined would be desirable. In addition, to simplify ground testing with only a small weight penalty, the exchanger vent pressure was increased from 5 psia to 22 psia nominal. This resulted in less than a 0.2% increase in system weight.
Safety, reliability and quality assurance design analysis results are presented as well as design requirements recommended for implementation in the PEP design.
A plan for the production of two PEP flight systems is defined. The task's milestones are described. Provisions for the development and assembly of new ground support equipment required for both testing and launch operations are included.
Contents: project plan summary; project and mission objectives; related studies and technology support activities; technical summary; management; procurement approach; project definition items and schedule; resources; management review; controlled items; and safety, reliability, and quality assurance.
This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates &om integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CPI, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.
No abstract available
A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.
The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.